Aerosol-plasma deposition of films for electronic cells

A process for coating a first layer of material and a second layer of material onto a nickel-containing substrate, comprising the steps of:

• (a) providing a first solution comprised of a first compound selected from the group consisting of an yttrium compound, a calcium compound, and admixtures thereof, and a second zirconium compound, wherein said first compound and said second zirconium compound are present in said solution at a concentration of from about 0.01 to about 1,000 grams per liter;
• (b) subjecting said first solution to ultrasonic sound waves at a frequency in excess of 20,000 hertz, and to a substantially atmospheric pressure of at least about 600 millimeters of mercury, thereby causing said solution to form into a first aerosol;
• (c) providing a radio frequency plasma reactor;
• (d) generating a plasma gas within said radio frequency plasma reactor;
• (e) contacting said first aerosol with said plasma gas within said plasma reactor while subjecting said first aerosol to a substantially atmospheric pressure of at least about 600 millimeters of mercury and to a radio frequency alternating current at a frequency of from about 100 kilohertz to about 30 megahertz, thereby forming a first vapor;
• (f) providing a nickel-containing substrate disposed outside of said reactor, wherein said substrate is comprised of at least 40 mole percent of nickel;
• (g) contacting said first vapor with said substrate;
• thereby forming a coated nickel-containing substrate;
• (h) providing a second solution comprised of an yttrium compound, a barium compound, and a copper compound, wherein said yttrium, said barium, and said copper are present in said solution in an atomic ratio of 1:2:3and wherein said solution is comprised of from about 0.01 to about 1,000 grams of a mixture consisting essentially of said yttrium compound, said barrium compound, and said copper compound per liter of said second solution;
• (i) subjecting said second solution to ultrasonic sound waves at a frequency in excess of 20.000 hertz, and to a substantially atmospheric pressure of at least about 600 millimeters of mercury, thereby causing said second solution to form into a second aerosol;
• (j) providing a radio frequency plasma reactor;
• (k) generating a plasma gas within said radio frequency plasma reactor;
• (l) contacting said second aerosol with said plasma gas within said plasma reactor of step (k) while subjecting said second aerosol to a substantially atmospheric pressure of at least about 600 millimeters of mercury and to a radio frequency alternating current at a frequency of from about 100 kilohertz to about 30 megahertz, thereby forming a second vapor;
• and
• (m) contacting said second vapor with said coated substrate while said coated substrate is disposed outside of said plasma reactor of step (k), thereby forming an electronic cell.