US 5,365,203 AGranted

Delay line device and method of manufacturing the same

AssigneeSusumu Co., Ltd.

InventorsNakaba Nakamura, Makoto Kosaki

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Abstract

A delay line device comprises first and second substrates. The first substrate has a signal line centrally formed on one of main surfaces of a ceramic substrate, bonding electrodes formed in a peripheral portion of the main surface and a ground electrode formed over substantially the entire region of the other main surface thereof. The second substrate has bonding electrodes formed on one of main surfaces of a ceramic substrate identical in thickness and material to the above ceramic substrate and a ground electrode formed over substantially the entire region of the other main surface thereof. The delay line device is formed by superimposing the first and second substrates on one another so that the bonding electrodes of the first substrate face those of the second substrate and bonding the bonding electrodes of both substrates to one another. Such delay line devices can be manufactured using mother substrates and mother dummy substrates.

Claims7

Dependent claims

A delay line device comprising:

a first substrate having a signal line centrally formed on one of main surfaces of a ceramic substrate, bonding electrodes formed in a peripheral portion of said main surface, a ground electrode formed over substantially the entire region of the other main surface of said ceramic substrate, and means for providing electrical connections between said ground electrode and said bonding electrodes;
and
a second substrate having bonding electrodes formed on one of main surfaces of a ceramic substrate identical in thickness and material to the ceramic substrate of said first substrate and at positions respectively corresponding to the bonding electrodes of said first substrate, a ground electrode formed over substantially the entire region of the other main surface of said ceramic substrate, and means for providing electrical connections between said ground electrode and said bonding electrodes;
and
wherein said first and second substrates being stacked on one another in such a manner that the bonding electrodes of said first substrate and the bonding electrodes of said second substrate are respectively disposed in facing relationship to one another;
and
said opposed bonding electrodes of said first and second substrates are bonded to one another in such a manner that the signal line of said first substrate is brought into contact with the ceramic substrate of said second substrate.

4 more elements

A delay line device comprising:

(a) a plurality of delay line units each comprising:
(1) a first substrate having a signal line centrally formed on one of main surfaces of a ceramic substrate, bonding electrodes formed in a peripheral portion of said main surface, a ground electrode formed over substantially the entire region of the other main surface of said ceramic substrate, means for providing electrical connections between said ground electrode and said bonding electrodes, and through hole terminals formed in a peripheral portion of said ceramic substrate;
(2) a second substrate having bonding electrodes formed on one of main surfaces of a ceramic substrate identical in thickness and material to the ceramic substrate of said first substrate and at positions respectively corresponding to the bonding electrodes of said first substrate, a ground electrode formed over substantially the entire region of the other main surface of said ceramic substrate, means for providing electrical connections between said ground electrode and said bonding electrodes of said second substrate, and through hole terminals formed in a peripheral portion of the ceramic substrate of said second substrate and at positions respectively corresponding to the through hole terminals of said first substrate;
(3) said first and second substrates being stacked on one another in such a manner that the bonding electrodes of said first substrate and the bonding electrodes of said second substrate are respectively disposed in facing relationship to one another;
and
(4) said opposite bonding electrodes of said first and second substrates and said opposite through hole terminals thereof being respectively bonded to one another in such a manner that the signal line of said first substrate is brought into contact with the ceramic substrate of said second substrate;
and
(b) wherein said plurality of delay line units being stacked on one another, and said opposite ground electrodes and said opposite through hole terminals being respectively bonded to one another, and the signal lines of said respective delay line units being electrically connected in series with one another via said respective through hole terminals.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 08/140,539Filed 25 Oct 1993
Priority: JP 4-3223836 Nov 1992
Granted: 15 Nov 1994
Term ends: Not estimatedThe source records don’t support an estimate.

Classification19 codes

H05K 3/4614
By laminating two or more circuit boards: the electrical connections between the circuit boards being made during lamination
H01P 9/006
Delay lines of the waveguide type: meander lines
H05K 3/368
Assembling printed circuits with other printed circuits: parallel to each other
H05K 3/4629
Characterised by the insulating layers or materials: laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets