Metal-film laminate resistant to delamination
AssigneeSheldahl, Inc.
InventorRichard L. Swisher
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Abstract
A flexible metal-film laminate can comprise a layered film structure having a metal layer securely bonded to a film layer. The laminate contains a unique metal-oxide attachment structure between the film and metal layer comprising randomly distributed regions of metal-oxide. The peel strength of such a laminate is significantly improved over prior laminates and is resistant to peel strength reduction due to environmental stress. The preferred metal-film laminates made with polyester or polyimide can be used in the manufacture of high-quality, low cost, flexible printed circuit boards.
Claims17
A metal-film laminate, resistant to delamination of the metal from the film, which laminate comprises:
- (a) a film layer having at least one surface bearing a non-continuous random distribution of a metal and an oxide of a metal selected from the group consisting of iron, chromium, nickel, molybdenum, manganese, zirconium or mixtures thereof;
- and
- (b) a metal surface adhered to the film through the random distribution, said metal surface comprising:
- (i) a first copper layer, formed on the metal-oxide by vapor metallization, having a thickness of about 50 to 500 nanometers;
- and
- (ii) a second metal layer having a thickness of 0.1 to 40 .mu.M formed on the first copper layer;
- wherein the laminate is free of a metal tie-coat and a peel strength of the metal-film laminate is at least 3 pounds per inch.
A metal-film laminate, resistant to delamination of the metal from the film, which laminate comprises:
- (a) a polymeric film;
- (b) a non-continuous random distribution on the polymeric film, comprising a metal and an oxide of a metal selected from the group consisting of chromium, iron, nickel, manganese, zirconium or mixtures thereof;
- and
- (c) a metal surface adhered to the film through the random distribution, said surface comprising:
- (i) a copper metal layer formed by vapor metallization having a thickness of about 50 to 500 nanometers;
- and
- (ii) a second copper layer having a thickness of 0.1 to 40 .mu.M formed on the metallized copper layer;
- wherein the laminate is free of a metal tie-coat and a peel strength of the metal film laminate is at least 5 pounds per inch.
Dependencies are inferred from the claim text.