Three-dimensional electroformed circuitry

A three-dimensional electrical circuit comprising:

• a substrate having first and second sides, and
• a plurality of conductors on said first side having outer surfaces lying in and defining a conductor surface, at least some of said conductors having forward raised contact features integral therewith and projecting in a first direction from said conductor surface away from said substrate for providing a readily connectable and disconnectable pressure interconnection to another element at said first side of said substrate, said contact features and said conductors consisting essentially of a conductive material having poor structural characteristics, at least some of said contact features having a back side depression filled with a contact feature rigidifying high strength material, at least one of said conductors having a rearward raised feature integral therewith and projecting from said conductor surface through said substrate in a direction opposite said first direction for connection to another element at said second side of said substrate.

A three-dimensional electrical circuit comprising:

• a substrate having first and second sides, and
• a plurality of conductors on said first side having outer surfaces lying in and defining a conductor surface, at least some of said conductors having contact features integral therewith and projecting from said conductor surface in a first direction for providing a readily connectable and disconnectable pressure interconnection to another element at said first side of said substrate, said substrate having at least one hole there through, and a post feature integrally formed with one of said conductors and projecting through said substrate hole in a direction opposite said first direction for connection to another element at said second side of said substrate.