Piping connection device
AssigneesTokyo Electron Limited, Tokyo Electron Tohoku Kabushiki Kaisha
InventorKenichi Yamaga
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AssigneesTokyo Electron Limited, Tokyo Electron Tohoku Kabushiki Kaisha
InventorKenichi Yamaga
Estimating the term…
In a semiconductor wafer heat-treating apparatus, there is provided a piping connection device on a gas inlet pipe leading to the heat-treating apparatus and a gas outlet pipe derived from the heat-treating apparatus. The piping connection device has a spherical convex connecting element, and a concave connecting element having a concave spherical surface into which the spherical element is snugly fitted. A pair of presser plates are placed on the outer surfaces of the two connecting elements and clamped by bolts so as to press confronting sealing surfaces of the convex and concave connecting elements against each other. Because the outer surfaces of the two connecting elements to be engaged with the pair of presser plates are spherically fashioned, the connection surfaces can present a satisfactory sealing condition without subjecting the pair of the pipes connected by the piping connection device to excessive biasing forces even though the two pipes are angled to each other.
A piping connection arrangement for coupling a first quartz glass pipe and a second quartz glass pipe together to form a substantially hemispherical seal, said arrangement comprising:
An apparatus for heat-treating a plurality of objects, said apparatus comprising:
Dependencies are inferred from the claim text.