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US 5,358,604 AGranted
Method for producing conductive patterns
AssigneeMicroelectronics and Computer Technology Corporation
InventorsCharles W. C. Lin, Chung J. Lee, Tom J. Hirsch, Kimcuc T. Tran
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Abstract
The invention provides an apparatus and methods of using the apparatus to transfer conductive patterns onto substrates under conditions of heat and pressure. The apparatus comprises a master mold with a printing surface on which is produced a permanent mirror image of the conductive pattern to be created. This pattern is then coated with a loosely adherent film of conductive metal, such as copper, which is transferred onto a substrate to be printed.
Claims28
A method of making conductive patterns, comprising:
- (1) selecting a mold with at least one surface, said surface being treatable to produce a pattern on said surface;
- (2) treating the surface of the mold to selectively remove material to a preselected depth from portions of the surface of the mold, thereby creating gaps in the surface and producing a pattern on the mold surface corresponding to a mirror image of a desired conductive pattern;
- (3) filling the gaps created by the selective removal of material with a composition that is resistant to metallization;
- (4) metallizing the mirror image pattern on the surface of the mold without metallizing the filled gaps;
- and
- (5) printing the metallized mirror image pattern onto a substrate by transferring said metallized mirror image pattern to said substrate without the removal of said filling composition in said gaps so as to produce a conductive pattern on the surface of the substrate.
3 more elements
Dependencies are inferred from the claim text.