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US 5,357,672 AGranted
Method and system for fabricating IC packages from laminated boards and heat spreader
AssigneeLSI Logic Corporation
InventorKeith G. Newman
Life of this patent
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AssigneeLSI Logic Corporation
InventorKeith G. Newman
Estimating the term…
A method and system for producing a plurality of integrated circuit packages having heat spreaders attached thereto. A planar metal sheet having predefined openings allows the addition of discrete bypass capacitors to the integrated circuit package. The planar metal sheet laminates to a plurality of laminated printed wiring boards. The metal sheet is then cut into sections resulting in individual packages. Each package has a cavity in which an integrated circuit die is placed therein. The integrated circuit die is in close thermal communication with the heat spreader of the package and connects to the conductive paths of the printed wiring boards. The invention is especially advantageous in manufacturing in quantity plastic pin grid array (PPGA) and plastic ball grid array (PBGA) integrated circuit packages.
A method for fabricating a plurality of integrated circuit packages from printed wiring board panels and a heat spreader laminated together, said method comprising the steps of:
A method for fabricating a plurality of integrated circuit packages from printed wiring board panels and a heat spreader laminated together, said method comprising the steps of:
A system for fabricating a plurality of integrated circuit packages having heat spreaders integral thereto, comprising:
Dependencies are inferred from the claim text.