Self-shielding microstrip assembly
AssigneeMotorola, Inc.
InventorsWilliam J. Wingfield, Mark A. Crandall, Leng H. Ooi
Life of this patent
Estimating the term…
Abstract
A shielded microstrip assembly (100)includes a substrate 102 having a first ground plane surface (106) and a second surface (206) which includes a transmission line (216). A plurality of solder balls (104) provide electrical interconnection for the ground plane and for the terminals (210) and (212) of transmission line (216). The microstrip assembly (100) is then inverted and attached using solder balls (104) to a carrier (302). The inverted microstrip assembly (100) of the present invention provides for improved shielding, while maintaining the high Q and other advantages associated with a microstrip.
Claims14
A microstrip assembly for attachment to a carrier, comprising:
- a substrate having first and second opposed major surfaces;
- a ground plane disposed on the first major surface;
- a transmission line disposed on the second major surface;
- at least two interconnection terminals disposed on the second major surface, at least one of said at least two interconnection terminals electrically coupled to the ground plane and the other of said at least two interconnection terminals is electrically coupled to the transmission line;
- and
- spacer means located between the second major surface of the substrate and the carrier for providing an air gap between the second surface of the substrate and said carrier upon the microstrip assembly being attached to said carrier, the air gap providing for the transmission line to exhibit an increase in Q value.
An electronic assembly, comprising:
- a microstrip assembly, comprising:
- a substrate having first and second major opposed surfaces;
- a ground plane disposed on the first major surface;
- a transmission line disposed on the second major surface;
- at least two interconnection terminals disposed on the second major surface, at least one of said at least two interconnection terminals electrically coupled to the ground plane and the other of said at least two interconnection terminals electrically coupled to the transmission line;
- and
- at least two solder balls attached one each to the at least two interconnection terminals;
- and
- a carrier having first and second surfaces, the first surface having at least two interconnection pads;
- and
- the at least two solder balls found on the microstrip assembly are soldered one each onto the at least two interconnection pads on the carrier providing for an air gap between the substrate and the carrier which allows for for the microstrip assembly to exhibit an increase in Q value.
A communication device, comprising:
- a receiver;
- and
- an oscillator coupled to the receiver, the oscillator comprising:
- a microstrip assembly, comprising:
- a substrate having first and second major opposed surfaces;
- a ground plane disposed on the first major surface;
- a transmission line resonator disposed on the second major surface;
- at least two interconnection terminals disposed on the second surface, at least one of said at least two interconnection terminals electrically coupled to the ground plane and the other of said at least two interconnection terminals electrically coupled to the transmission line resonator;
- and
- at least two solder balls attached one each to the at least two interconnection terminals;
- and
- a carrier having first and second surfaces, the first surface having at least two interconnection pads;
- and
- the at least two solder balls found on the microstrip assembly are soldered one each onto the at least two interconnection pads on the carrier providing for an air gap between the substrate and the carrier which allows for the transmission line resonator to exhibit an increase in Q value.
Dependencies are inferred from the claim text.