System for controlling an integrated product process for semiconductor wafers and packages
AssigneeVLSI Technology, Inc.
InventorsScott A. Erjavic, Ronald E. Frye, Jr.
Life of this patent
Estimating the term…
Abstract
A distributed control system for controlling an integrated production process for semiconductor wafers and packages. A workstation is connected to a tester and a sorter/handler for configuring and controlling both devices. An operator need not be aware of different syntaxes and configurations required by different brands of testers, sorters/probers or handlers. The workstation is connected to a computer-aided manufacturing node to obtain setup and other processing control information and to send updated control information to the node through a network. If the data collected from the testers indicates low yield, the computer-aided manufacturing node is alerted.
Claims20
A system for controlling an integrated production process for the processing of semiconductor chips and packages, said process employing wafer sorters, package handlers, testers and a computer aided manufacturing node for providing and storing set up and wafer and package processing control information, said system comprising:
- a semiconductor chip, wafer, or a package;
- and
- a tester, sorter or a handler;
- and
- a control device dedicated to and connected to said tester, sorter or handler, for configuring and controlling the tester, sorter or handler;
- and wherein said device collects and analyzes data from the tester, sorter or handler;
- and
- a network connecting the device to the node, so that said device enables an operator to test, sort or handle said chip, wafer or package according to a predetermined routine, to obtain updated data concerning the chip, wafer or package from the tester, sorter or handler, and to update and send updated processing control information to the node.
A method for controlling an integrated production process for the processing of semiconductor chips and packages using wafer sorters, package handlers, testers and a computer aided manufacturing node for providing and storing set up and wafer and package processing control information;
- said method comprising the following steps using a tester, a sorter or a handler, and a control device and a network connecting said control device to said node:
- configuring the tester connected to the device;
- configuring the sorter or handler connected to the device;
- using the sorter to sort a wafer to be tested or a handler to handle a package to be tested;
- using the tester to test said wafer or package according to a predetermined routine;
- and
- collecting data related to said sorting or handling and said testing.
Dependencies are inferred from the claim text.