# US 5,353,364 A · Optical module with improved grounding of an optical element > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,353,364 A - Document ID: US5353364A - Status: Granted - Kind: A - Application number: 08/104,012 - Filed: 1993-08-10 - Granted: 1994-10-04 - Earliest claimed: 1992-08-11 - Assignees: Sumitomo Electric Industries, Ltd. - Inventors: Hiromi Kurashima - Web page: https://patentgrep.com/patent/US5353364A ## CPC - G02B 6/4246: {Bidirectionally operating package structures} - G02B 6/4201: {Packages, e.g. shape, construction, internal or external details} - G02B 6/4255: {Moulded or casted packages} - G02B 6/4274: {Electrical aspects (G02B6/4263 and G02B6/4265 take precedence)} - G02B 6/428: {containing printed circuit boards [PCB]} - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS ## Abstract An optical functional element is contained in and grounded to a metal package. A grounding lead member, which is connected to a grounding lead pin forming portion via a connecting lead portion, is welded to the outer surface of the metal package either before or after resin molding. ## Claims ### Claim 1 An optical module comprising: an optical connector for receiving an end of an optical fiber to be connected to the optical module; an optical functional element to be optically coupled with the optical fiber; a metal package fixed to the optical connector and containing the optical functional element, the optical functional element being grounded to the metal package; electronic circuit parts electrically connected to the optical functional element; a circuit board on which the electronic circuit parts are mounted; a plurality of lead pins electrically connected to the electronic circuit parts; at least one grounding member electrically connected to the metal package; a grounding lead pin electrically connected to the grounding lead member; and a resin mold member holding the metal package, electronic circuit parts, circuit board, lead pins, grounding member and grounding lead pin. ### Claim 2 (depends on 1) The optical module of claim 1, wherein the metal package has, in its outer surface, a groove with which a tip of the grounding member is engaged. ### Claim 3 (depends on 1) The optical module of claim 1, further comprising a flexible connecting lead portion connecting the grounding member to the grounding lead pin while supporting the grounding member. ### Claim 4 (depends on 1) The optical module of claim 1, wherein the metal package and the grounding member is partially exposed from the resin mold member. ### Claim 5 (depends on 1) The optical module of claim 1, wherein the metal package and the grounding member is entirely contained in the resin mold member. ### Claim 6 (depends on 1) The optical module of claim 1, wherein the grounding member is a thin metal part formed by cutting a lead frame. ### Claim 7 (depends on 1) The optical module of claim 1, wherein the grounding member is a wire directly connected to the grounding lead pin. ### Claim 8 (depends on 1) The optical module of claim 1, further comprising a mother land on which the circuit board is mounted, the mother land serving to electrically connect the grounding member to the grounding lead pin. ### Claim 9 (depends on 1) The optical module of claim 1, wherein the electronic circuit parts are grounded to the grounding lead pin via the circuit board. ### Claim 10 A manufacturing method of an optical module, comprising the steps of: preparing an assembly comprising a lead frame including a plurality of lead pin forming portions, at least one grounding lead member and a grounding lead pin forming portion electrically connected to the grounding lead member, a circuit board having electronic circuit parts and mounted on the lead frame, an optical connector supported by the lead frame, a metal package fixed to the optical connector and containing an optical functional element electrically connected to the electronic circuit parts and grounded to the metal package; electrically connecting the grounding lead member to the metal package; and molding the assembly with a resin to hold the metal package, electronic circuit parts, circuit board, lead pin forming portions, grounding lead member and grounding lead pin forming portion; and cutting out unnecessary portions of the lead frame. ### Claim 11 (depends on 10) The manufacturing method of claim 10, wherein a flexible connecting lead portion electrically connects the grounding lead member to the grounding lead pin forming portion while supporting the grounding lead member. ### Claim 12 A manufacturing method of an optical module, comprising the steps of: preparing an assembly comprising a lead frame including a plurality of lead pin forming portions, at least one grounding lead member and a grounding lead pin forming portion electrically connected to the grounding lead member, a circuit board having electronic circuit parts and mounted on the lead frame, an optical connector supported by the lead frame, a metal package fixed to the optical connector and containing an optical functional element electrically connected to the electronic circuit parts and grounded to the metal package; molding the assembly with a resin to hold the metal package, electronic circuit parts, circuit board, lead pin forming portions, grounding lead member and grounding lead pin forming portion; electrically connecting the grounding lead member to the metal package; and cutting out unnecessary portions of the lead frame. ### Claim 13 (depends on 12) The manufacturing method of claim 12, wherein the steps of electrically connecting the grounding lead member to the metal package and cutting out unnecessary portions of the lead frame are performed simultaneously.