# US 5,353,294 A · Semiconductor laser device and semiconductor laser module

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- Number: US 5,353,294 A
- Document ID: US5353294A
- Status: Granted
- Kind: A
- Application number: 07/954,157
- Filed: 1992-09-30
- Granted: 1994-10-04
- Earliest claimed: 1991-10-02
- Assignees: NEC Corporation
- Inventors: Kazuo Shigeno
- Web page: https://patentgrep.com/patent/US5353294A

## CPC

- G02B 6/4207: {with optical elements reducing the sensitivity to optical feedback (anti-reflection devices specially adapted for lasers, see H01S3/0064)}
- H01S 5/02251: using optical fibres
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL

## Abstract

According to this invention, a semiconductor laser device includes a coaxial package and a semiconductor laser chip. The semiconductor laser chip is incorporated in the package such that an emission position of the semiconductor laser chip is shifted from an axis of the package.

## Claims

### Claim 1

A semiconductor laser device comprising:
a coaxial package having an axis which coincides with an axis of an optical fiber coupled thereto;
a stem, coupled into said package, having a sub-mount portion for incorporating said semiconductor chip, an upper surface of said sub-mount portion being formed to be shifted in a radial direction away from the axis of said package;
a heat-radiation heat sink arranged on the upper surface of said sub-mount portion; and
a semiconductor laser chip, incorporated on said heat sink, having an emission position which is a position for emitting a laser beam, said emission position being set to be vertically shifted in a radial direction away from the axis of said package by a thickness of said heat sink in order to decrease a coupling loss.

### Claim 2 (depends on 1)

A device according to claim 1, wherein said package in which said semiconductor laser chip is incorporated is hermetically sealed, and said package has a window in a center axial direction for transmitting a radiation beam emitted from said semiconductor laser chip.

### Claim 3

A semiconductor laser module comprising:
a semiconductor laser chip incorporated on a heat sink having an emission position which is a position for emitting a laser beam, said emission position being set to be vertically shifted in the radial direction away from the axis of said package by a thickness of said heat sink in order to decrease a coupling loss;
a lens for focusing a radiation beam emitted from said semiconductor laser chip;
an optical fiber having an inclined end face for decreasing the amount of a reflected return of said beam, the optical beam being focused on said inclined end face by said lens; and
a coaxial holder for holding said lens and said optical fiber on the same axis, said coaxial holder being coupled to said coaxial package of said semiconductor laser device so that an axis of said coaxial holder coincides with an axis of said coaxial package.

### Claim 4 (depends on 3)

A module according to claim 3, wherein said semiconductor laser device and said optical fiber are coupled to each other so that an incident direction of the optical beam emanating from said lens is opposite to the inclination of the end face of said optical fiber, so that the optical beam refracted at the end face of said optical fiber coincides with the axis of said optical fiber.