# US 5,353,196 A · Method of assembling electrical packaging structure and liquid crystal display device having the same

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- Number: US 5,353,196 A
- Document ID: US5353196A
- Status: Granted
- Kind: A
- Application number: 08/169,627
- Filed: 1993-12-20
- Granted: 1994-10-04
- Earliest claimed: 1991-10-09
- Assignees: Canon Kabushiki Kaisha
- Inventors: Masanori Takahashi
- Web page: https://patentgrep.com/patent/US5353196A

## CPC

- G02F 1/13452: {Conductors connecting driver circuitry and terminals of panels}
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/698: Semiconductor materials that are electrically insulating, e.g. undoped silicon
- H10W 90/00: Package configurations
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method of assembling an electrical packaging structure has a plurality of semiconductor chips arranged on a substrate and input wirings to the semiconductor chips connected thereto. The input wirings are distributed through a wiring board arranged on the substrate.

## Claims

### Claim 1

A method for assembling an electrical circuit assembly comprising the steps of:
preparing a substrate on which a plurality of output wirings and a plurality of input wirings exceeding the output wirings in number are formed;
arranging a plurality of semiconductor chips on the substrate and connecting the chips to the input wirings; and
arranging a wiring board for connecting the input wirings to the output wirings on the substrate.