# US 5,352,991 A · Power amplifier assembly

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 5,352,991 A
- Document ID: US5352991A
- Status: Granted
- Kind: A
- Application number: 08/105,243
- Filed: 1993-08-12
- Granted: 1994-10-04
- Earliest claimed: 1993-08-12
- Assignees: Motorola, Inc.
- Inventors: Jeffrey S. Lipschultz; John N. Lubbe; Marc H. Pullman
- Web page: https://patentgrep.com/patent/US5352991A

## CPC

- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A power amplifier assembly that dissipates a maximum of one thousand one hundred watts includes a power amplifier circuit and a chassis that has an overall volume of 0.02 cubic meters. The chassis includes a heat sink base that contains a mounting pattern for the power amplifier circuit. By thermally coupling the power amplifier circuit to the heat sink base via thermal coupling devices and the mounting pattern, the heat sink base dissipates a maximum of one thousand one hundred watts in a volume of 0.016 cubic meters.

## Claims

### Claim 1

A power amplifier assembly that dissipates a maximum of one thousand one hundred watts, the power amplifier assembly comprises:
a power amplifier circuit that includes at least one power element and a plurality of circuit elements;
at least one thermal coupling device that is thermally coupled to the at least one power element; and
a chassis that includes a heat sink base, wherein the heat sink base includes a mounting pattern for the plurality of circuit elements and the at least one thermal coupling device, wherein the chassis has an overall volume of 0.02 cubic meters, and wherein the heat sink base has a power dissipation of 1,100 watts/0.016 cubic meters.

### Claim 2 (depends on 1)

The power amplifier assembly of claim 1 further comprises at least one forced air cooling device, wherein the at least one forced air cooling device forces air across the heat sink base.

### Claim 3 (depends on 1)

In the power amplifier assembly of claim 1, the mounting pattern comprises a plurality of recessed areas cast in the heat sink base.

### Claim 4 (depends on 1)

In the power amplifier assembly of claim 1, the at least one power element comprises at least one amplifier circuit deposited on a ceramic substrate.

### Claim 5 (depends on 4)

In the power amplifier assembly of claim 4, the at least one thermal coupling device comprises a carbon composition material.

### Claim 6 (depends on 5)

In the power amplifier assembly of claim 5, the carbon composition material comprises graphite.

### Claim 7

A power amplifier assembly that dissipates a maximum of one thousand one hundred watts, the power amplifier assembly comprises:
a power amplifier circuit that includes a direct current (DC) distribution module, a pre-amplifier module, a splitter module, at least one power element, a combiner module, an isolator module, and a low pass filter and directional coupler module;
a plurality of thermal coupling devices, wherein each of the plurality of thermal coupling devices is thermally coupled to one of either the at least one power element, the splitter module, the combiner module, or the low pass filter and directional coupler module; and
a chassis that includes a heat sink base, wherein the heat sink base includes a mounting pattern for the DC distribution module, the preamplifier module, the isolator module, and the plurality of thermal coupling devices, wherein the chassis has an overall volume of 0.02 cubic meters, wherein the heat sink base has a power dissipation of 1,100 watts/0.016 cubic meters, and wherein, when the power amplifier circuit is mounted to the heat sink base, the DC distribution module, the pre-amplifier module, the splitter module, the at least one power element, the combiner module, the isolator module, and the low pass filter and directional coupler module form a substantially planar assembly.

### Claim 8 (depends on 7)

The power amplifier assembly of claim 7 further comprises at least one forced air cooling device, wherein the at least one forced air cooling device forces air across the heat sink base.

### Claim 9 (depends on 7)

In the power amplifier assembly of claim 7, the mounting pattern comprises a plurality of recessed areas cast in the heat sink base.

### Claim 10 (depends on 7)

In the power amplifier assembly of claim 7, the at least one power element comprises at least one amplifier circuit deposited on a ceramic substrate.

### Claim 11 (depends on 10)

In the power amplifier assembly of claim 10, each of the plurality of thermal coupling devices comprises a carbon composition material.

### Claim 12 (depends on 11)

In the power amplifier assembly of claim 11, the carbon composition material comprises graphite.