# US 5,352,851 A · Edge-mounted, surface-mount integrated circuit device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,352,851 A - Document ID: US5352851A - Status: Granted - Kind: A - Application number: 07/941,996 - Filed: 1992-09-08 - Granted: 1994-10-04 - Earliest claimed: 1992-09-08 - Assignees: Texas Instruments Incorporated - Inventors: James S. Wallace; Ernie Russell; Daniel Baudouin - Web page: https://patentgrep.com/patent/US5352851A ## CPC - H10W 70/415: {Leadframe inner leads serving as die pads} - H05K 3/303: with surface mounted components (H05K3/32 takes precedence) - H10W 70/429: {being the outer leads} - H05K 3/3426: {characterised by the leads} - H05K 2201/10454: Vertically mounted - H05K 2201/10568: Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element - H05K 2201/10659: Different types of terminals for the same component, e.g. solder balls combined with leads - H05K 2201/10696: Single-in-line [SIL] package - H05K 2203/167: Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract An edge-mounted integrated circuit device (10 ) includes a semiconductor die (11) and a lead frame (15) attached to the semiconductor die (11). The lead frame (15) includes a plurality of leads (14) electrically connected to the semiconductor die and lead frame supports (16, 18). A package (12) encapsulates the semiconductor die and a portion of the lead frame (15). The leads (14) extend from the package (12) and are bent to present a face for surface mount connection to conductors on a substrate. The supports (16, 18) extend from the package (12) for contacting the substrate to support the device (10) in position for soldering the leads (14) to conductors on the substrate. ## Claims ### Claim 1 An edge-mounted integrated circuit device, comprising: a semiconductor die; a lead frame attached to said semiconductor die, said lead frame including a plurality of leads and at least one support, said leads electrically connected to said semiconductor die; a package encapsulating said semiconductor die and a portion of said lead frame, each of said leads extending from an edge of said package and bent to present a face for surface-mount connection to a conductor on a substrate, said at least one support extending from said package for insertion into an opening in the substrate to support said edge-mounted integrated circuit device in position for soldering said faces of said leads to the conductors on the substrate. ### Claim 2 (depends on 1) The integrated circuit device of claim 1 in which said package is flat and said leads are bent to present a face generally perpendicular to said flat package. ### Claim 3 (depends on 1) The integrated circuit device of claim 1 in which said at least one support includes first and second supports. ### Claim 4 (depends on 3) The integrated circuit device of claim 3 in which said first and second supports extend from said edge, said leads being located between said first and second supports. ### Claim 5 (depends on 3) The integrated circuit device or claim 3 in which said first and second supports have different dimensions for insertion into first and second openings, respectively, of different dimensions in the substrate. ### Claim 6 (depends on 1) The integrated circuit device of claim 1 in which said at least one support includes first and second portions formed at an angle to one another. ### Claim 7 (depends on 1) The integrated circuit device of claim 1 in which said at least one support includes a stop surface for limiting extension of said at least one support into the substrate to provide a selected spacing between said edge of said package and the substrate. ### Claim 8 (depends on 1) The integrated circuit device of claim 1 in which said at least one support includes first and second spaced apart portions extending from said edge, said first portion for insertion into a first opening in the substrate, said second portion for insertion into a second opening in the substrate spaced from the first opening. ### Claim 9 (depends on 1) The integrated circuit device of claim 1 in which said at least one support includes first, second, and third portions, said first and second portions formed at an angle to one another, said first portion extending from said edge, said third portion extending from said edge and spaced from said first portion, said first and second portions for insertion into a first opening in the substrate, said third portion for insertion into a second opening in the substrate spaced from the first opening. ### Claim 10 (depends on 9) The integrated circuit device of claim 9 in which said first and third portions of said first support are connected by a stop surface for limiting for limiting extension of said at least one support into the substrate to provide a selected spacing between said edge of said package and the substrate. ### Claim 11 (depends on 1) The integrated circuit device of claim 1 in which said package is composed of plastic molded around said semiconductor die. ### Claim 12 (depends on 1) The integrated circuit device of claim 1 in which said at least one support is electrically connected to said semiconductor die. ### Claim 13 An edge-mounted integrated circuit device, comprising: a semiconductor die; a lead frame attached to said semiconductor die, said lead frame including a plurality of leads, a first support, and a second support, said leads electrically connected to said semiconductor die; a package encapsulating said semiconductor die and a portion of said lead frame, each of said leads extending from a first edge of said package and bent to present face for surface-mount connection to a conductor on a substrate, each of said first and second supports extending from said package and bent to present a face for contacting the substrate to support said integrated circuit device in position for soldering said faces of said leads to the conductors on the substrate, said first support and said second support being bent toward opposite sides of said package. ### Claim 14 (depends on 13) The integrated circuit device of claim 13 in which said leads are located between said first and second supports. ### Claim 15 (depends on 13) The integrated circuit device of claim 13 in which said leads have a first width and said first and second supports have a second width, said first width being less than said second width. ### Claim 16 (depends on 13) The integrated circuit device of claim 13 in which said leads extend from said package a first distance and said first and second supports extend from said package a second distance, said second distance being greater than said first distance. ### Claim 17 (depends on 13) The integrated circuit device of claim 13 in which said package is composed of plastic molded around said semiconductor die. ### Claim 18 (depends on 13) The integrated circuit device of claim 13 in which said at least one of said first and second supports is electrically connected to said semiconductor die. ### Claim 19 (depends on 13) The integrated circuit device of claim 13 in which said package is flat and each of said leads, said first support, and said second support is bent to present a face generally perpendicular to said flat package. ### Claim 20 (depends on 13) The integrated circuit device of claim 13 in which said package includes second and third edges formed at an angle to said first edge, said first and second supports extending from said first edge, said lead frame further including a third support extending from said second edge adjacent said first support and a fourth support extending from said third edge adjacent said second support, said third and fourth supports for contacting the substrate to support said integrated circuit device in position for soldering said faces of said leads to the conductors on the substrate, said first and third supports being bent toward opposite sides of said package and said second and fourth supports being bent toward opposite sides of said package. ### Claim 21 A circuit board assembly, comprising: a circuit board including a surface, an opening in said surface, and a plurality of conductors formed on said surface; an edge-mounted integrated circuit device mounted on said circuit board, said edge-mounted integrated circuit device including: a semiconductor die; a lead frame attached to said semiconductor die, said lead frame including a plurality of leads and at least one support, said leads electrically connected to said semiconductor die; a package encapsulating said semiconductor die and a portion of said lead frame, each of said leads extending from an edge of said package and bent to present a face surface-mount connected to an associated one of said conductors on said circuit board, said at least one support extending from said package and inserted into said opening in said circuit board to support said edge-mounted integrated circuit device. ### Claim 22 A circuit board assembly, comprising: a circuit board including a surface and a plurality of conductors formed on said surface; an edge-mounted integrated circuit device mounted on said circuit board, said edge-mounted integrated circuit device including: a semiconductor die; a lead frame attached to said semiconductor die, said lead frame including a plurality of leads, a first support, and a second support, said leads electrically connected to said semiconductor die; a package encapsulating said semiconductor die and a portion of said lead frame, each of said leads extending from a first edge of said package and bent to present a face for surface-mount connection to an associated one of said conductors on said circuit board, each of said first and second supports extending from said package and bent to present a face contacting said surface of said circuit board to support said integrated circuit device, said first support and said second support being bent toward opposite sides of said package.