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US 5,352,634 AGranted
Process for fabricating an active matrix circuit
OwnerThomas P. Brodyinventor
Life of this patent
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Abstract
An improved method of fabricating integrated circuits, particularly active matrix arrays. The present method comprises applying an etch-resist pattern to an integrated circuit by printing to form resist patterns. The circuit is then etched, recoated with a different substance, a new ink pattern applied and the pattern repeated to form the successive layers of the integrated circuit.
Claims13
A method of manufacturing integrated circuits having at least one layer, comprising the steps of:
- coating a substrate with a conductive material forming a single layer of the circuit;
- applying an etch-resist pattern to at least one layer of said coated substrate by printing said resist pattern onto said coated substrate;
- and
- placing said coated substrate with resist pattern in a bath to etch away desired portions of the coated substrate;
- and further comprising the steps of providing said integrated circuit with a plurality of layers alternating between conductive and insulation layers and applying an etch-resist pattern to said plurality of integrated circuit layers by printing.
2 more elements
A method of manufacturing an active matrix comprising:
- a) generating a printing plate containing an etch-resist pattern of at least one layer of the entire active matrix;
- b) coating an active matrix substrate with a material which forms a single layer of said active matrix;
- c) utilizing said printing plate to print said resist pattern onto said coated substrate;
- d) placing said substrate into an etch bath to remove selected portions of said substrate coating which are not covered by said resist;
- and
- e) placing said coated substrate in a neutralizing and cleaning bath to remove the etch bath and resist from the substrate.
3 more elements
Dependencies are inferred from the claim text.