# US 5,352,632 A · Multichip packaged semiconductor device and method for manufacturing the same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 5,352,632 A
- Document ID: US5352632A
- Status: Granted
- Kind: A
- Application number: 08/062,013
- Filed: 1993-05-17
- Granted: 1994-10-04
- Earliest claimed: 1991-02-08
- Assignees: Kabushiki Kaisha Toshiba
- Inventors: Hiromichi Sawaya
- Web page: https://patentgrep.com/patent/US5352632A

## CPC

- H10W 72/701: {Tape-automated bond [TAB] connectors}
- H10W 70/411: {Chip-supporting parts, e.g. die pads}
- H10W 70/466: {Tape carriers or flat leads}
- H10W 72/077: {Connecting of TAB connectors}
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W 90/811: {Multiple chips on leadframes}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 90/726: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- Y10T 29/49121: Beam lead frame or beam lead device
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A plurality of semiconductor chips are mounted on a plurality of islands formed on a lead frame. Inner lead portions of the lead frame and electrode pads formed on the semiconductor chips are electrically connected to one another via first lead portions formed on a flexible resin tape and the electrode pads formed on the semiconductor chips are connected to one another via second lead portions formed on the flexible resin tape. The flexible resin tape on which the islands and inner lead portions of the lead frame, the plurality of semiconductor chips and the first and second lead portions are formed is sealed into a resin package.

## Claims

### Claim 1

A semiconductor device manufacturing method comprising:
a first step of mounting a plurality of semiconductor chips on at least one island formed on a lead frame;
a second step of disposing a flexible resin tape on said lead frame, said resin tape having a plurality of device holes formed in positions corresponding to mounting positions of said semiconductor chips and also having a wiring pattern for electrically connecting an inner lead portion of the lead frame to electrode pads of the semiconductor chips;
a third step of connecting one end of said wiring pattern formed on said flexible resin tape to the electrode pads formed on said plurality of semiconductor chips; and
a fourth step of connecting the another of said wiring pattern formed on said flexible resin tape to an inner lead section of said lead frame.

### Claim 2 (depends on 1)

A semiconductor device manufacturing method according to claim 1, wherein said third step if effected by use of bump electrodes formed on said electrode pads.

### Claim 3 (depends on 1)

A semiconductor device manufacturing method according to claim 1, wherein said fourth step is effected by use of alloy bonding.

### Claim 4 (depends on 1)

A semiconductor device manufacturing method according to claim 1, wherein said wiring pattern is formed on the surface of said flexible resin tape such that the one end portion of the wiring pattern projects outside of said flexible resin tape with the other end portion projecting into said device holes.

### Claim 5

A semiconductor device manufacturing method comprising:
a first step of mounting a plurality of semiconductor chips on at least one island formed on a lead frame;
a second step of disposing a flexible resin tape on said lead frame, said resin tape having a plurality of device holes formed in positions corresponding to mounting positions of said semiconductor chips, having a first wiring pattern for electrically connecting an inner lead portion of the lead frame to electrode pads of the semiconductor chips, and also having a second wiring pattern for interconnection of the electrode pads of said plurality of semiconductor chips;
a third step of connecting one end of said first wiring pattern formed on said flexible resin tape to the electrode pads formed on said plurality of semiconductor chips;
a fourth step of connecting said second wiring pattern formed on said flexible resin tape to the electrode pads formed on said plurality of semiconductor chips so as to electrically connect said semiconductor chips to one another; and
a fifth step of connecting another end of said first wiring pattern formed on said flexible resin tape to an inner lead section of said lead frame.

### Claim 6 (depends on 5)

A semiconductor device manufacturing method according to claim 5, wherein said third and fourth steps are effected by use of bump electrodes formed on said electrode pads.

### Claim 7 (depends on 5)

A semiconductor device manufacturing method according to claim 5, wherein said fifth step is effected by use of alloy bonding.

### Claim 8 (depends on 5)

A semiconductor device manufacturing method according to claim 5, wherein said first wiring pattern is formed on the surface of said flexible resin tape such that the one end portion of the wiring pattern projects outside of said flexible resin tape with the other end portion projecting into said device hole, and said second wiring pattern is formed on the surface of said flexible resin tape such that one end portion of the second wiring pattern projects into said device holes, with another end portion of the second wiring pattern projecting outside of said flexible resin tape.