# US 5,352,542 A · Use of silver alloys as cadium-free brazing solder

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- Number: US 5,352,542 A
- Document ID: US5352542A
- Status: Granted
- Kind: A
- Application number: 08/115,001
- Filed: 1993-09-01
- Granted: 1994-10-04
- Earliest claimed: 1992-09-02
- Assignees: Degussa AG
- Inventors: Alexander Voelcker; Joerg Beuers; Sigurd Joensson; Dieter Kaufmann; Georg Ptaschek; Wolfgang Kaster
- Web page: https://patentgrep.com/patent/US5352542A

## CPC

- B23K 35/3006: {Ag as the principal constituent}
- Y10T 428/12896: Ag-base component
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Cadmium-free brazing solders which also have working temperatures under 630.degree. C. containing 45 to 80 wt. % silver, 5 to 25 wt. % copper, 10 to 25 wt. % gallium, and 0.1 to 5 wt. % indium and/or tin.

## Claims

### Claim 1

A cadmium-free silver alloy brazing solder comprising 45 to 80 wt. % silver, 5 to 25 wt. % copper, 10 to 25 wt. % gallium, and 0.1 to 5 wt. % indium and/or tin; wherein said solder has a working temperature of 530.degree. to 600.degree. C.

### Claim 2 (depends on 1)

The alloy according to claim 1, comprising 62 to 72 wt. % silver, 8 to 18 wt. % copper, 12 to 24 wt. % gallium, and 1 to 4 wt. % indium and/or tin.

### Claim 3 (depends on 2)

The alloy according to claim 2, comprising 65 to 70 wt. % silver, 10 to 15 wt. % copper, 15 to 22 wt. % gallium, and 2 to 4 wt. % indium and/or tin.

### Claim 4 (depends on 1)

A metal article brazed with the solder according to claim 1.

### Claim 5 (depends on 2)

A metal article brazed with the solder according to claim 2.

### Claim 6 (depends on 3)

A metal article brazed with the solder according to claim 3.

### Claim 7

A cadmium-free silver alloy brazing solder consisting essentially of 45 to 80 wt. % silver, 5 to 25 wt. % copper, 10 to 25 wt. % gallium, and 0.1 to 5 wt. % indium and/or tin; wherein said solder has a working temperature of 530.degree. to 600.degree. C.