# US 5,350,811 A · Epoxy resin and adhesive composition containing the same

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- Number: US 5,350,811 A
- Document ID: US5350811A
- Status: Granted
- Kind: A
- Application number: 08/077,657
- Filed: 1993-06-17
- Granted: 1994-09-27
- Earliest claimed: 1990-04-20
- Assignees: Hitachi Chemical Company, Ltd.
- Inventors: Nobuo Ichimura; Mitsuo Yamazaki; Kohei Fujita; Hidetaka Satou; Yasuo Miyamoto; Masao Kawasumi; Tohru Kikuchi
- Web page: https://patentgrep.com/patent/US5350811A

## CPC

- H01B 1/22: the conductive material comprising metals or alloys
- C08G 59/12: of polycarboxylic acids with epihalohydrins or precursors thereof
- C08G 59/3254: {containing atoms other than carbon, hydrogen, oxygen or nitrogen}
- H01B 1/24: the conductive material comprising carbon-silicon compounds, carbon or silicon
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS

## Abstract

An adhesive composition comprising (a) an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups and (b) a curing agent is suitable for bonding semiconductor chips to a copper frame with a small warpage of the chips.

## Claims

### Claim 1

A process for producing a semiconductor device which comprises bonding a semiconductor chip to a metallic layer with an adhesive composition; said composition comprising an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane dianhydride with an alcohol, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups.

### Claim 2 (depends on 1)

A process according to claim 1, wherein an epoxy compound having one epoxy group and the epoxy compound having two or more epoxy groups are reacted with the 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane.

### Claim 3

A semiconductor device comprising a lead frame, an adhesive composition coated on an island of the lead frame, a semiconductor element placed on the adhesive composition and bonded to the island of the lead frame via the adhesive composition, wires connecting the semiconductor element and the lead frame, and a molded resin encapsulating the whole of the lead frame and the semiconductor element; wherein said adhesive composition comprises an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane dianhydride with an alcohol, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups.