# US 5,350,714 A · Point-of-use purification

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- Number: US 5,350,714 A
- Document ID: US5350714A
- Status: Granted
- Kind: A
- Application number: 08/148,354
- Filed: 1993-11-08
- Granted: 1994-09-27
- Earliest claimed: 1993-11-08
- Assignees: Shipley Company, L.L.C.
- Inventors: Peter Trefonas, III; Richard J. Carey
- Web page: https://patentgrep.com/patent/US5350714A

## CPC

- G03F 7/16: Coating processes; Apparatus therefor (applying coatings to base materials in general B05; applying photosensitive compositions to base for photographic purposes G03C1/74)
- B01J 39/05: in the strongly acidic form
- B01J 47/016: Modification or after-treatment of ion-exchangers
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- B01J: CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS

## Abstract

The invention is for a process of removal of dissolved contaminants from an organic solution. The process of the invention involves placing a module containing an ion exchange resin, activated carbon or a mixture of the two between a container from which the organic solution is dispensed and the point at which the solution is to be used. The solution is then passed through the module to remove contaminants. The inventions is useful for removal of dissolved contaminants from organic solutions requiring high purity for use.

## Claims

### Claim 1

A process for coating a liquid organic photoresist composition onto a wafer for integrated circuit manufacture, said process comprising the steps of providing a dispensing means for dispensing said organic composition, a wafer upon which said organic composition is to be coated, and purification means disposed between said dispensing means and said wafer, said purification means comprising a module containing a member selected from the group consisting of at least one ion exchange resin, an activated carbon adsorbent and mixtures thereof, passing said organic photoresist composition from said dispensing means through said purification means to said wafer and drying said photoresist coating.

### Claim 2 (depends on 1)

The process of claim 1 where said purification means further includes filtering means downstream from said module.

### Claim 3 (depends on 1)

The process of claim 1 where said module is part of said dispensing means.

### Claim 4 (depends on 1)

The process of claim 1 wherein said module is equipped with inlet and outlet fittings providing means for inserting said photoresist composition into a feedline.

### Claim 5 (depends on 1)

The process of claim 1 where said module is affixed to said dispensing means.

### Claim 6 (depends on 1)

The process of claim 1 wherein said module contains a mixed anion and cation exchange resin and activated carbon.

### Claim 7 (depends on 1)

The process of claim 1 where said module contains a cation exchange resin.

### Claim 8 (depends on 7)

The process of claim 7 where said photoresist composition contains acid labile materials and said cation exchange resin has been modified to replace strong acid groups with essentially non acidic groups.

### Claim 9 (depends on 1)

The process of claim 1 where said module contains an anion exchange resin.

### Claim 10 (depends on 9)

The process of claim 9 where said photoresist composition contains base labile materials and said anion exchange resin has been modified to replace strong basic groups with a group less basic than hydroxyl.

### Claim 11 (depends on 1)

The process of claim 1 where said module contains activated carbon.

### Claim 12 (depends on 11)

The process of claim 11 where said photoresist composition contains a chelating agent for multivalent metal ions.