# US 5,350,713 A · Design and sealing method for semiconductor packages > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,350,713 A - Document ID: US5350713A - Status: Granted - Kind: A - Application number: 07/943,260 - Filed: 1992-09-10 - Granted: 1994-09-27 - Earliest claimed: 1990-12-19 - Assignees: VLSI Technology, Inc. - Inventors: Louis H. Liang - Web page: https://patentgrep.com/patent/US5350713A ## CPC - H10W 40/77: Auxiliary members characterised by their shape - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 40/257: {having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence)} - H10W 74/124: {the encapsulations having cavities other than that occupied by chips} - H10W 70/682: {comprising holes having chips therein} - H10W 76/63: characterised by their shape or disposition, e.g. between cap and walls of a container - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Several methods of forming an integrated circuit package by ultrasonically welding a thermal plastic material which joins two housing portions together in such a fashion as to seal an integrated circuit within the two housing portions is described along with the resulting structures of those methods. ## Claims ### Claim 1 A method for housing an integrated circuit comprising the steps of: forming first and second housing portions adapted to be joined together to house said integrated circuit; forming a groove having serrated walls in said first housing portion; insert molding a thermal plastic material into said groove of said first housing portion to form a thermal plastic joint area therein; forming a thermal plastic joint area on said second housing portion; and bringing said first and second housing portions together, and joining them together by ultrasonically welding together said thermal plastic joint areas of said first and second housing portions. ### Claim 2 (depends on 1) The method for housing an integrated circuit as recited in claim 1, wherein said insert molding step further comprises the step of forming a weld projection on said thermal plastic joint area of said first housing portion. ### Claim 3 (depends on 1) The method for housing an integrated circuit as recited in claim 1, further comprising, before said bringing and joining together step, the steps of: forming at least two alignment holes on said first housing portion; forming a lead frame having at least two alignment holes; and positioning and holding said lead frame against said first housing portion such that each of said at least two alignment holes of said lead frame are adjacent to one of said at least two alignment holes of said first housing portion. ### Claim 4 (depends on 1) The method for housing an integrated circuit as recited in claim 1, further comprising, before said bringing and joining together step, the steps of: forming at least two alignment holes in said second housing portion; forming a lead frame having at least two alignment holes; and positioning and holding said lead frame against said second housing portion such that each of said at least two alignment holes of said lead frame are adjacent to one of said at least two alignment holes of said second housing portion. ### Claim 5 A method for housing an integrated circuit comprising the steps of: forming first and second housing portions adapted to be joined together to house said integrated circuit; forming a groove in said first housing portion; press-fitting a seal ring comprising a thermal plastic material into said groove formed in said first housing portion to form a thermal plastic joint area therein; forming a thermal plastic joint area on said second housing portion; and bringing said first and second housing portions together, and joining them together by ultrasonically welding together said thermal plastic joint areas of said first and second housing portions. ### Claim 6 (depends on 5) The method for housing an integrated circuit as recited in claim 5, further comprising, before said bringing and joining together step, the steps of: forming at least two alignment holes in said first housing portion; forming a lead frame having at least two alignment holes; positioning and holding said lead frame against said first housing portion such that each of said at least two alignment holes of said lead frame are adjacent to one of said at least two alignment holes of said first housing portion. ### Claim 7 (depends on 5) The method for housing an integrated circuit as recited in claim 5, further comprising, before said bringing and joining together step, the steps of: forming at least two alignment holes in said second housing portion; forming a lead frame having at least two alignment holes; positioning and holding said lead frame against said second housing portion such that each of said at least two alignment holes of said lead frame are adjacent to one of said at least two alignment holes of said second housing portion. ### Claim 8 A method for housing an integrated circuit comprising the steps of: forming, from non-thermal plastic material, first and second housing portions adapted to be joined together to house said integrated circuit; forming a groove having serrated walls in said first housing portion; insert molding a thermal plastic material into said groove of said first housing portion to form a thermal plastic joint area therein; forming a thermal plastic joint area on said second housing portion; and bringing said first and second housing portions together, and joining them together by ultrasonically welding together said thermal plastic joint areas of said first and second housing portions. ### Claim 9 (depends on 8) The method for housing an integrated circuit as recited in claim 8, wherein said insert molding step further comprises the step of forming a weld projection on said thermal plastic joint area of said first housing portion. ### Claim 10 (depends on 8) The method for housing an integrated circuit as recited in claim 8, further comprising, before said bringing and joining together step, the steps of: forming at least two alignment holes on said first housing portion; forming a lead frame having at least two alignment holes; and positioning and holding said lead frame against said first housing portion such that each of said at least two alignment holes of said lead frame are adjacent to one of said at least two alignment holes of said first housing portion. ### Claim 11 (depends on 8) The method for housing an integrated circuit as recited in claim 8, further comprising, before said bringing and joining together step, the steps of: forming at least two alignment holes in said second housing portion; forming a lead frame having at least two alignment holes; and positioning and holding said lead frame against said second housing portion such that each of said at least two alignment holes of said lead frame are adjacent to one of said at least two alignment holes of said second housing portion. ### Claim 12 A method for housing an integrated circuit comprising the steps of: forming, from non-thermal plastic material, first and second housing portions adapted to be joined together to house said integrated circuit; forming a groove in said first housing portion; press-fitting a seal ring comprising a thermal plastic material into said groove formed in said first housing portion to form a thermal plastic joint area therein; forming a thermal plastic joint area on said second housing portion; and bringing said first and second housing portions together, and joining them together by ultrasonically welding together said thermal plastic joint areas of said first and second housing portions. ### Claim 13 (depends on 12) The method for housing an integrated circuit as recited in claim 12, further comprising, before said bringing and joining together step, the steps of: forming at least two alignment holes in said first housing portion; forming a lead frame having at least two alignment holes; positioning and holding said lead frame against said first housing portion such that each of said at least two alignment holes of said lead frame are adjacent to one of said at least two alignment holes of said first housing portion. ### Claim 14 (depends on 12) The method for housing an integrated circuit as recited in claim 12, further comprising, before said bringing and joining together step, the steps of: forming at least two alignment holes in said second housing portion; forming a lead frame having at least two alignment holes; positioning and holding said lead frame against said second housing portion such that each of said at least two alignment holes of said lead frame are adjacent to one of said at least two alignment holes of said second housing portion. ### Claim 15 A method for housing an integrated circuit comprising the steps of: forming first and second housing portions adapted to be joined together to house said integrated circuit; forming a layer of graphite particles on a surface of said first housing portion; forming a thermal plastic joint area on said second housing portion; and bringing said first and second housing portions together, and joining them together by ultrasonically welding together said thermal plastic joint area of said second housing portion to said layer of graphite particles on said surface of said first housing portion. ### Claim 16 (depends on 15) The method for housing an integrated circuit as recited in claim 15, wherein said thermal plastic joint area forming step comprises the steps of: forming a groove having serrated walls in said second housing portion; and insert molding a thermal plastic material into said groove of said second housing portion to form a thermal plastic joint area therein. ### Claim 17 (depends on 15) The method for housing an integrated circuit as recited in claim 15, wherein said thermal plastic joint area forming step comprises the steps of: forming a groove in said second housing portion; and press-fitting a seal ring comprising a thermal plastic material into said groove formed in said second housing portion to form a thermal plastic joint area therein. ### Claim 18 (depends on 15) The method for housing an integrated circuit as recited in claim 15, wherein said thermal plastic joint area forming step further comprises the step of forming a weld projection on said thermal plastic joint area of said second housing portion. ### Claim 19 (depends on 15) The method for housing an integrated circuit as recited in claim 15, wherein said first and second housing portions forming step includes the step of forming a first housing portion from a metallic material. ### Claim 20 (depends on 15) The method for housing an integrated circuit as recited in claim 15, wherein said first and second housing portions forming step includes the step of forming a first housing portion from a ceramic material.