# US 5,350,490 A · Forming a color filter on a semiconductor substrate

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- Number: US 5,350,490 A
- Document ID: US5350490A
- Status: Granted
- Kind: A
- Application number: 08/024,205
- Filed: 1993-02-22
- Granted: 1994-09-27
- Earliest claimed: 1992-02-21
- Assignees: Samsung Electronics Co., Ltd.
- Inventors: Hyung S. Lee
- Web page: https://patentgrep.com/patent/US5350490A

## CPC

- H10F 39/156: {CCD or CID colour image sensors}
- H10F 77/331: {for filtering or shielding light, e.g. multicolour filters for photodetectors}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION

## Abstract

A manufacturing method for color filter comprises steps of forming a flat layer for smoothing over an image sensor having charge coupled devices or bucket brigade device, forming a first color filter layer and a first inter-layer of dye-proof layer on said flat layer, alternately forming color filter layers and inter-layers in the same manner as above describe steps in order to form a second color filter layer, a second inter-layer, a third color filter layer and a third inter-layer, wherein the first or the third inter-layer is formed of a negative polyimide having a relatively lower thermal shrinkage. In this method, the material for forming the inter-layer which has been the problem in thermal hardening due to the relatively higher thermal shrinkage is substituted with the negative polyimide having a relatively lower thermal shrinkage, so that the stress acted on the interface between the color filter layer and the inter-layer can be minimized, so that image sensor having a superior spectrum characteristic and sensitivity can be obtained.

## Claims

### Claim 1

A method for manufacturing a color filter comprising the steps of:
forming a flat layer for smoothing over an image sensor having charge coupled devices or bucket brigade device,
forming a first color filter layer and a first inter-layer of dye-proof layer on said flat layer,
alternately forming color filter layers and inter-layers in order to form a second color filter layer, a second inter-layer, a third color filter layer and a third inter-layer,
wherein each of said first, second and third inter-layer is formed of a negative photo-sensitivity resin having a relatively low thermal shrinkage.

### Claim 2 (depends on 1)

The method according to claim 1, wherein each of said first, second and third inter-layer is formed of a positive photo-sensitivity resin having a relatively low thermal shrinkage.

### Claim 3 (depends on 2)

The method according to claim 2, wherein said positive photo-sensitivity resin forming the first, the second and thrid inter-layer has a thickness of 0.6.about.1.0 .mu.m.

### Claim 4 (depends on 1)

The method according to claim 1, wherein the third inter-layer is formed by mixed layers of negative photo-sensitivity resin and positive photo-sensitivity resin having a relatively low thermal shrinkage.

### Claim 5 (depends on 3)

The method according to claim 3, wherein said negative photo-sensitivity resin has a thickness of 0.6.about.1.0 .mu.m, and the flat layer has a thickness of 2.0.about.4.0 .mu.m.

### Claim 6 (depends on 1)

The method according to claim 1, wherein said flat layer is formed of a negative photo-sensitivity resin having an unchanged photo-sensitivity at hardening temperature.

### Claim 7 (depends on 1)

The method according to claim 1, wherein the method further includes a step for etching an inter-layer of a pad area each time after forming the first, the second and third inter-layers, respectively.