# US 5,349,317 A · High frequency signal transmission tape

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- Number: US 5,349,317 A
- Document ID: US5349317A
- Status: Granted
- Kind: A
- Application number: 08/040,599
- Filed: 1993-03-31
- Granted: 1994-09-20
- Earliest claimed: 1992-04-03
- Assignees: Mitsubishi Denki Kabushiki Kaisha
- Inventors: Yoshihiro Notani; Takayuki Katoh
- Web page: https://patentgrep.com/patent/US5349317A

## CPC

- H10W 72/077: {Connecting of TAB connectors}
- H01P 1/047: {Strip line joints}
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 70/688: {Flexible insulating substrates}
- H10W 72/075: {of bond wires}
- H10W 72/50: Bond wires
- H10W 72/701: {Tape-automated bond [TAB] connectors}
- H10W 44/206: {Wires}
- H10W 44/216: {Waveguides, e.g. strip lines}
- H10W 70/682: {comprising holes having chips therein}
- H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting}
- H10W 72/07552: {changes in structures or sizes}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/29: Bond pads specially adapted therefor
- H10W 72/521: {Structures or relative sizes of bond wires}
- H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements}
- H10W 72/5522: {comprising gold [Au]}
- H10W 72/5524: {comprising aluminium [Al]}
- H10W 72/59: Bond pads specially adapted therefor
- H10W 72/951: {Materials of bond pads}
- H10W 90/753: {between laterally-adjacent chips}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B)

## Abstract

A high frequency signal transmission tape for connecting a plurality of high frequency IC chips to each other or connecting a high frequency IC chip to a signal transmission line disposed on a package includes an insulating thin film having a surface; a conductive signal line disposed on the surface; and two conductive grounding lines disposed on the surface on opposite sides of, parallel to, and spaced from the signal line. The signal transmission tape produces small reflection and attenuation of signals in an extremely high frequency band, i.e., a millimeter-wave frequency band over 30 GHz. Therefore, high frequency IC chips arbitrarily arranged on a package are easily connected using the high frequency signal transmission tape.

## Claims

### Claim 1

A high frequency signal transmission tape for making an electrical connection to a high frequency IC chip comprising:
an insulating film having opposite first and second surfaces;
a conductive signal line disposed on said first surface; and
two conductive grounding lines disposed on said first surface on opposite sides of, parallel to, and spaced apart from said signal line wherein said insulating film includes a plurality of slits transverse to said signal line, said signal line and said grounding lines being exposed in and by the slits.

### Claim 2 (depends on 1)

The high frequency signal transmission tape of claim 1 wherein adjacent slits are spaced apart at a substantially uniform interval.

### Claim 3

A high frequency signal transmission tape for making an electrical connection to a high frequency IC chip comprising:
an insulating film having opposite first and second surfaces.;
a conductive signal line disposed on said first surface; and
two conductive grounding lines disposed on said first surface on opposite sides of, parallel to, and spaced apart from said signal line wherein marks are disposed on said second surface of said insulating film at regular intervals in a longitudinal direction of said insulating film generally parallel to said signal line and said grounding lines.

### Claim 4

A high frequency signal transmission tape for making an electrical connection to a high frequency IC chip comprising:
an insulating film having opposite first and second surfaces;
a conductive signal line disposed on said first surface; and
two conductive grounding lines disposed on said first surface on opposite sides of, parallel to, and spaced apart from said signal line wherein openings penetrating through said insulating film are disposed at regular intervals in a longitudinal direction of said insulating film generally parallel to said signal line and said grounding lines.

### Claim 5

A high frequency signal transmission tape for making an electrical connection to a high frequency IC chip comprising:
a conductive signal line and two conductive grounding lines, said signal line and said grounding lines each having a rectangular cross-section with opposed first and second principal surfaces and first and second side wall surfaces transverse to the principal surfaces, said first principal surfaces of said signal line and said grounding lines lying in a plane with said signal line spaced from and disposed between said grounding lines; and
a dielectric material disposed between and contacting said side wall surfaces of said signal line and said grounding lines, adhering said signal line to said grounding lines with said first and second principal surfaces exposed for bonding said signal line and said grounding lines to a high frequency IC chip.

### Claim 6

A high frequency transmission tape for making an electrical connection to a high frequency IC chip comprising:
a conductive signal line and two conductive grounding lines, said signal line and said grounding lines each having circular cross-sections with centers and outside surfaces, the centers of said signal line and said grounding lines lying in a plane with said signal line spaced from and disposed between said grounding lines; and
a dielectric material disposed between and contacting parts of said outside surfaces of said signal line and said grounding lines, adhering said signal line to said grounding lines, said signal line and said grounding lines being commonly exposed along parts of the outside surfaces of said signal line and said grounding lines along a longitudinal direction of said tape generally parallel to said signal line and said grounding lines for bonding said signal line and said grounding lines to a high frequency IC chip.