# US 5,349,234 A · Package and method for assembly of infra-red imaging devices

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- Number: US 5,349,234 A
- Document ID: US5349234A
- Status: Granted
- Kind: A
- Application number: 07/890,451
- Filed: 1992-05-29
- Granted: 1994-09-20
- Earliest claimed: 1992-05-29
- Assignees: Eastman Kodak Company
- Inventors: William F. DesJardin; Edward J. Ozimek; Luis A. Rivera; Terry Tarn
- Web page: https://patentgrep.com/patent/US5349234A

## CPC

- H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80)
- H10F 77/60: Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Apparatus and a method for the packaging of semiconductor chips to simplify assembly while improving thermal dissipation from the chip and reducing stress in the chip due to differential thermal expansion between the chip and its package as they are cycled over a temperature range are disclosed. An adhesive tape covers an active area of the chip and leaving bonding pads on the chip exposed through a recess in the adhesive tape. A body with a similar recess supports the other side of the tape. Wire bonds are made in the recess to connect bonding pads on the body to the chip. A lid covers the recess to protect the wire bonds.

## Claims

### Claim 1

A packaged energy sensor comprising:
a device for sensing incident energy, said device having a first surface for exposure to said energy and a second surface comprising a plurality of bond pads disposed at a peripheral portion of the second surface;
a body having an upper surface, a lower surface for holding the device, and a recess portion in general alignment with said bond pads;
electrical leads supported by said body in said recess body portion at a location proximate said bond pads;
said body having external electrical connectors extending from the body and electrically connected to the electrical leads supported by said body; and wire connecting the bond pads on the chip to the electrical leads in the recess of the body.

### Claim 2 (depends on 1)

The sensor of claim 1 further comprising an adhesive layer disposed between the second surface of the device and the lower surface of the body for holding the device on the lower surface of the body.

### Claim 3 (depends on 1)

The package of claim 1 wherein the body is made from an alumina ceramic.

### Claim 4 (depends on 2)

The package of claim 2 wherein the adhesive tape is an epoxy tape.

### Claim 5 (depends on 2)

The package of claim 2 wherein the adhesive tape is a polyimide tape.

### Claim 6 (depends on 2)

The package of claim 2 wherein the adhesive tape is reinforced with fibers.

### Claim 7 (depends on 2)

The package of claim 2 wherein the adhesive tape defines at least one recess which aligns with at least one recess defined by the body.

### Claim 8 (depends on 1)

The package of claim 1 wherein the energy detector is a semiconductor chip.

### Claim 9 (depends on 2)

The sensor of claim 2 wherein the adhesive layer comprises adhesive tape configured to substantially cover both the second surface of the device and the lower surface of the body and to expose the bond pads of the device and the recess of the body.

### Claim 10 (depends on 9)

The sensor of claim 9 wherein the adhesive tape mechanically and thermally bonds the device to the body.

### Claim 11 (depends on 1)

The sensor of claim 1 further comprising a lid configured to fit inside the recess portion of the body.

### Claim 12 (depends on 1)

The sensor of claim 1 wherein said body further comprises a shelf disposed in said recess portion and above said bond pads for supporting the electrical leads.

### Claim 13 (depends on 1)

The sensor of claim 1 further comprising a metallized layer disposed on the upper surface of the body for providing a solder contact.

### Claim 14

A package for a semiconductor chip comprising:
a body having an upper surface, a lower surface for holding a device, and a stepped, recessed peripheral portion including
first and second shelves disposed between the upper and lower surfaces;
electrical leads supported on one of said shelves;
external electrical connectors supported by said body and electrically connected to said electrical leads;
a semiconductor device held by said body and having bond pads disposed on a first surface thereof, generally aligned with the recessed peripheral portion of said body and electrically connected to said electrical leads; and wire connecting the bond pads on the chip to the electrical leads in the recess of the body.

### Claim 15 (depends on 14)

The package of claim 14 further comprising:
an adhesive tape holding the semiconductor chip to the lower surface of the body, said tape substantially covering the lower surface of the body and the first surface of the chip, the tape being configured to expose the bond pads and the recessed portion of the body and adapted to mechanically and thermally bond the chip to the body;
and a lid supported by said shelves and endorsing the recessed peripheral portion of the body.

### Claim 16 (depends on 14)

The package of claim 14 wherein the body is made from an alumina ceramic.

### Claim 17 (depends on 15)

The package of claim 15 wherein the adhesive tape is an epoxy tape.

### Claim 18 (depends on 15)

The package of claim 15 wherein the adhesive tape is a polyimide tape.

### Claim 19 (depends on 15)

The package of claim 15 wherein the adhesive tape is reinforced with fibers.

### Claim 20 (depends on 15)

The package of claim 15 wherein the adhesive tape defines at least one recess which aligns with at least one recess defined by the body.

### Claim 21

In combination:
a semiconductor chip with a first surface adapted to have light incident thereon and a second surface for supporting bond pads thereon;
an adhesive tape contacting the second surface of the chip on substantially the entire surface except for the bond pads thereof;
a body of alumina ceramic having upper and lower surfaces, the lower surface contacting the adhesive tape, the body having a peripheral portion with a recess therein and having electrical leads supported in said recess at a location proximate the bond pads of the chip;
external electrical connectors disposed on the upper surface of the body and electrically coupled through the body to the electrical leads at the recess portion thereof and to the bond pads; and wire connecting the bond pads on the chip to the electrical leads in the recess of the body.

### Claim 22 (depends on 21)

The combination of claim 21 further comprising:
a lid enclosing the recess portion.

### Claim 23 (depends on 21)

The combination of claim 21 wherein the adhesive tape is a compliant reinforced epoxy tape.

### Claim 24 (depends on 21)

The combination of claim 21 wherein the adhesive tape is a compliant reinforced polyimide tape.

### Claim 25 (depends on 21)

The combination of claim 21 wherein the external contacts are electrically conductive pins which are brazed into the body at right angles to the front surface and which are electrically connected to bond pads on the body.

### Claim 26 (depends on 21)

The combination of claim 21 wherein the pins are made form a material which approximates the thermal expansion characteristics of the body.

### Claim 27 (depends on 21)

The combination of claim 21 wherein the material is of a composition which is commercially sold under the name of Kovar.

### Claim 28

A method of packaging a semiconductor chip comprising the steps of:
providing a body with a recess in the periphery thereof and having electrical leads supported in said recess;
aligning a recess in a body with an adhesive tape;
causing the body and the tape to come into contact so as to attach the body to the tape;
aligning the recess int eh body to indicia on a chip having bonding pads;
causing the tape and the semiconductor chip to come into contact so as to attach the tape to the semiconductor chip;
curing the adhesive tape such that a mechanical and thermal bond is created between the semiconductor chip and the body;
wire bonding the bonding pads on the chip and electrical leads in the recess of the body.

### Claim 29 (depends on 28)

The method of claim 28 further comprising the step of placing a lid within a recess in the body so as to protect the wire bonds between the body and the chip.