# US 5,349,226 A · Active matrix substrate having a contact pad for detecting bus line signals

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 5,349,226 A
- Document ID: US5349226A
- Status: Granted
- Kind: A
- Application number: 07/813,268
- Filed: 1991-12-24
- Granted: 1994-09-20
- Earliest claimed: 1990-12-28
- Assignees: Sharp Kabushiki Kaisha
- Inventors: Takafumi Kawaguchi; Shiro Takeda
- Web page: https://patentgrep.com/patent/US5349226A

## CPC

- G02F 1/1309: {Repairing; Testing}
- G02F 1/1362: Active matrix addressed cells {(G02F1/134336, G02F1/134363 take precedence)}
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS

## Abstract

In an active matrix substrate including an array of thin film transistors arranged in a matrix, source buses and gate buses formed on an insulating substrate, a contact pad is formed on the source buses and the gate buses so that a metal portion of these buses is exposed, in order to provide an access for probing to monitor the waveform of signals.

## Claims

### Claim 1

An active matrix substrate comprising an array of thin film transistors arranged in a matrix on an insulating substrate, at least two groups of gate buses, and at least two groups of source buses,
wherein the gate buses and the source buses comprise a contact pad for probing formed thereon such that a metal portion thereof is exposed,
wherein one group of the gate buses are connected to a first gate bus driver IC and the other group thereof to a second gate bus driver IC, and one group of the source buses are connected to a first source bus driver IC and the other group thereof to a second source bus driver IC, and the contact pad is formed on each of the outermost gate buses and source buses of each group, and
wherein the contact pad includes a triangle contact portion and a circle contact pad area formed in the center of the contact portion by removing an insulating film covering the gate bus and the source bus to have a metal exposed portion.

### Claim 2

An active matrix substrate comprising an array of thin film transistors arranged in a matrix on an insulating substrate, at least two groups of gate buses, and at least two groups of source buses,
wherein the gate buses and the source buses comprise a contact pad for probing formed thereon such that a metal portion thereof is exposed, and the contact pad includes a triangle contact portion and a circle contact pad area formed in the center of the contact portion by removing an insulating film covering the gate bus and the source bus to have a metal exposed portion.

### Claim 3

An active matrix substrate comprising an array of thin film transistors arranged in a matrix on an insulating substrate, at least two groups of gate buses, and at least two groups of source buses,
wherein the gate buses and the source buses comprise a probe contact pad formed thereon such that a metal portion thereof is exposed,
wherein one group of the gate buses are connected to a first gate bus driver IC and the other group thereof are connected to a second gate bus driver IC, and one group of the source buses are connected to a first source bus driver IC and the other group thereof are connected to a second source bus driver IC, and the contact pad is formed on each of the outermost gate buses and source buses of each group between said source bus driver IC and the array of thin film transistors, and between said gate bus driver IC and the array of thin film transistors.

### Claim 4

An active matrix substrate comprising an array of thin film transistors arranged in a matrix on an insulating substrate, at least two groups of gate buses, and at least two groups of source buses,
wherein the gate buses and the source buses comprise a probe contact pad formed thereon such that a metal portion thereof is exposed,
wherein the contact pad includes a triangle contact portion and a circle contact pad area formed in the center of the contact portion by removing an insulating film covering the gate bus and the source bus to have a metal exposed portion.