# US 5,349,136 A · Mold tool assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,349,136 A - Document ID: US5349136A - Status: Granted - Kind: A - Application number: 08/017,418 - Filed: 1993-02-10 - Granted: 1994-09-20 - Earliest claimed: 1989-08-02 - Assignees: Matsushita Electric Industrial Co., Ltd. - Inventors: Mitsuhiro Abe; Nakanishi Itsuto; Ariyoshi Hideho; Asao Iguchi - Web page: https://patentgrep.com/patent/US5349136A ## CPC - B29C 45/14655: {connected to or mounted on a carrier, e.g. lead frame} - B29C 45/2708: {Gates (B29C45/2703 takes precedence)} - H10W 74/016: {using moulds} - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A mold tool for forming an electronic component having a semiconductor chip sealed on a supporting member by a resin-molded package, includes an upper mold having an upper cavity and a lower mold having a lower cavity, the package being molded in the cavities. Upper and lower gates are arranged at opposing surfaces of the molds and symmetrically formed with respect to a parting face of the mold tool to connect with the cavities. A method for forming the component includes the steps of inserting the supporting member with the chip in the cavities of the molds of the mold tool, clamping the molds, injecting molten resin into the cavities of the clamped molds through the upper and lower gates, cooling the molten resin in the cavities, and separating the molds from each other and removing the component from the cavities. The supporting member has a recess where the chip is located, and the recess has such a depth that a distance between an upper surface of the chip located in the recess and an upper surface of the package is substantially equal to a distance between a lower surface of a portion where the recess is formed and a lower surface of the package. A lead frame is one of the supporting member and includes a cutout formed at a portion corresponding to the gates, which are connected to each other through the cutout. ## Claims ### Claim 1 A molding arrangement for forming an electronic component, comprising: a mold tool having an upper mold and a lower mold defining respective upper and lower cavities and upper and lower gates arranged symmetrically with respect to a parting face between said upper and lower molds at opposite surfaces of said upper and lower molds, said gates connecting directly with said cavities; and a lead frame for supporting a semiconductor chip in said mold tool for sealing the chip with resin, said lead frame having upper and lower sides and a vacant cutout portion therein at a position corresponding to said gates, wherein said gates are connected to each other through said vacant cutout portion; wherein said mold tool further comprises a runner connected to said gates for providing molten resin thereto, said runner being disposed on only one of said upper and said lower sides of said lead frame. ### Claim 2 (depends on 1) The molding arrangement of claim 1, wherein said lead frame has a central rectangular portion for a rectangular semiconductor chip, said vacant cutout portion being located at one corner of said central rectangular portion. ### Claim 3 (depends on 2) The molding arrangement of claim 2, wherein said vacant cutout portion extends from the one corner of said central rectangular region towards a side edge of said lead frame in a direction angled relative to the longitudinal direction of said central rectangular region. ### Claim 4 (depends on 1) The molding arrangement of claim 1, wherein said lead frame has a portion thereof defining sides of said vacant cutout portion, said runner extending only one of below and above said portion of said lead frame to said vacant cutout portion and said gates. ### Claim 5 (depends on 1) The molding arrangement of claim 1, wherein said gates are located between said runner and said cavities such that no leads of said lead frame extend between said gates. ### Claim 6 A molding arrangement for forming an electronic component, comprising: a mold tool comprising an upper mold and a lower mold defining respective upper and lower cavities and upper and lower gates arranged symmetrically with respect to a parting face therebetween, said upper cavity being disposed opposite said lower cavity and said upper gate being disposed opposite said lower gate, said upper and lower gates communicating with said upper and lower cavities, respectively; a lead frame in said mold tool between said upper and lower molds, said lead frame having upper and lower sides and a vacant portion therein at said gates such that said gates are directly connected to each other through said vacant portion of said lead frame; and a runner defined in only one of said upper and lower molds and connected to the respective said gate of said mold for providing molten resin thereto such that said runner is defined on only one of said upper and lower sides of said lead frame and said gates directly fluidly connect said cavities to said runner. ### Claim 7 (depends on 6) The molding arrangement of claim 6, wherein said upper and lower molds have said parting face therebetween, and said upper and lower gates comprise sloping surfaces on said upper and lower molds, respectively, that slope towards said parting face with said vacant portion therebetween. ### Claim 8 (depends on 7) The molding arrangement of claim 7, wherein said sloping surfaces slope to a point at which said gates meet said cavities.