Method of fabricating a bottom and top gated thin film transistor
AssigneeMicron Semiconductor, Inc.
InventorsCharles H. Dennison, Monte Manning
Life of this patent
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Abstract
An electric interconnection method includes: a) providing two conductive layers separated by including material on a semiconductor wafer; b) etching the conductive layers and insulating material to define and outwardly expose a sidewall of each conductive layer; c) depositing an electrically conductive material over the etched conductive layers and their respective sidewalls; and d) anisotropically etching the conductive material to define an electrically conductive sidewall link electrically interconnecting the two conductive layers. Such is utilizable to make thin film transistors and other circuitry.
Claims9
A method of fabricating a bottom and top gated thin film transistor comprising the following steps:
- providing an electrically conductive bottom thin film transistor gate electrode layer on a semiconductor substrate, the bottom gate electrode layer having a planar outer surface, the outer surface having a surface area;
- providing a bottom gate dielectric layer over the bottom gate electrode layer;
- providing a thin film transistor body layer over the bottom gate layer;
- defining source, drain and channel regions within the thin film body layer;
- providing a top gate dielectric layer over the thin film transistor body layer;
- providing an electrically conductive top transistor gate electrode layer over the top gate dielectric layer;
- etching the composite top gate electrode, top gate dielectric, and body layers in a pattern which defines a top gate electrode, top gate dielectric and body outline which is received only partially within the bottom gate electrode outer surface area, the bottom gate electrode outer surface area including a portion extending outwardly beyond the outline, the etching outwardly exposing top gate electrode and body sidewalls;
- providing a layer of insulating dielectric over the etched top gate electrode and outwardly exposed sidewalls;
- anisotropically etching the insulating dielectric layer to define an insulating sidewall spacer, the sidewall spacer leaving the top gate electrode sidewall outwardly exposed;
- outwardly exposing bottom gate electrode surface area extending outwardly beyond the outline;
- providing a layer of electrically conductive material over the outwardly exposed top gate electrode sidewall and outwardly exposed bottom gate electrode surface area;
- and
- anisotropically etching the layer of conducting material to define an electrically conductive sidewall link electrically interconnecting the top gate electrode sidewall and bottom gate electrode outer surface.
Dependencies are inferred from the claim text.