# US 5,348,825 A · Method for manufacturing shadow mask and shadow mask manufactured by said method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,348,825 A - Document ID: US5348825A - Status: Granted - Kind: A - Application number: 07/908,194 - Filed: 1992-07-01 - Granted: 1994-09-20 - Earliest claimed: 1991-07-02 - Assignees: Dai Nippon Printing Co., Ltd. - Inventors: Osamu Nakamura; Takeshi Ikegami - Web page: https://patentgrep.com/patent/US5348825A ## CPC - G03F 1/20: Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof - H01J 9/142: {of shadow-masks for colour television tubes} - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) ## Abstract The present invention relates to a method for manufacturing a shadow mask, which is satisfactory in terms of shape, linearity and dimensional accuracy of an etching hole when thickness of an electrode base material is about 20-80 .mu.m. According to the invention, resist is coated on both sides of a base material, and patterning is performed only on the resist on one side, the resist with electrode pattern is developed, and patterning is performed. The resist on the opposite side without electrode pattern is left all over the surface, and this is covered with a resin layer, which has anti-etching property, is resistible to spraying pressure during etching and has reinforcing property enough to maintain surface flatness of the base material to eliminate unstability of the base material by spraying pressure during etching, etching is performed only on one side of the base material from the patterned resist, and a shadow mask is obtained, which is satisfactory in shape, linearity and dimensional accuracy of the etching hole. The invention also discloses a method for forming an etching hole, which is dimensionally larger than the thickness of the electrode base material. ## Claims ### Claim 1 A method for manufacturing a shadow mask of 20-80 .mu.m in thickness, said method comprising the steps of: providing an electrode base material of 20-80 .mu.m thickness with resist coating, patterning in accordance with a predetermined shadow mask pattern the resist layer on one side of the resist coated electrode base material covering the resist layer of the other side of the electrode base material with a reinforcing resin layer having anti-etching property, and etching the electrode base material from the side where the resist layer is patterned opposite the reinforced side so as to penetrate the electrode base material. ### Claim 2 A method for manufacturing a shadow mask of 20-80 .mu.m in thickness, said method comprising the steps of: providing an electrode base material of 20-80 .mu.m thickness with resist coating, patterning in accordance with a predetermined shadow mask pattern the resist layer on one side of the resist coated electrode base material, covering the resist layer of the other side of the electrode base material with a reinforcing resin layer, covering said resin layer with an adhesive film having anti-etching property, and etching the electrode base material from the side where the resist layer is patterned opposite the reinforced side so as to penetrate the electrode base material. ### Claim 3 A method for manufacturing a shadow mask of 20-80 .mu.m in thickness, said method comprising the steps of: providing an electrode base material of 20-80 .mu.m thickness with resist coating, patterning in accordance with a predetermined shadow mask pattern the resist layer on one side of the resist coated electrode base material, covering the resist layer coated on the other side with an adhesive film having anti-etching and reinforcing properties, and etching the electrode base material from the side of and in accordance with the patterned resist layer so as to penetrate the base material. ### Claim 4 (depends on 1, 2) A method for manufacturing a shadow mask according to claim 1 or 2, wherein the resin layer is made of alkali-soluble resin. ### Claim 5 (depends on 4) A method according to claim 4 further comprising removing said reinforcing layer using an alkali solution, and removing the resist layers with a resist removing solution, thereby removing the reinforcing and resin layers with minimal force being exerted on the etched electrode base material. ### Claim 6 (depends on 1, 2) A method for manufacturing a shadow mask according to claim 1 or 2, wherein the resin layer is made of solvent-soluble resin. ### Claim 7 (depends on 5) A method according to claim 5 further comprising removing said reinforcing layer using a solvent and removing the resist layers with a resist removing solution, thereby removing the reinforcing and resin layers with minimal force being exerted on the etched electrode base material. ### Claim 8 (depends on 1, 2) A method for manufacturing a shadow mask according to claim 1 or 2, wherein the resin layer is made of UV-setting resin. ### Claim 9 (depends on 1, 2) A method for manufacturing a shadow mask according to claim 1 or 2, wherein the resin layer is made of hot melt resin. ### Claim 10 (depends on 2, 3) A method for manufacturing a shadow mask according to claim 2 or 3, wherein the adhesive film is an anti-acid adhesive film. ### Claim 11 (depends on 2, 3) A method for manufacturing a shadow mask according to claim 2 or 3, wherein the adhesive film has an adhesive strength that is decreased by heat setting processing, heat foaming processing or ultraviolet irradiation. ### Claim 12 (depends on 1, 2, 3) A method for manufacturing a shadow mask according to any one of claims 1 to 3, wherein the predetermined shadow mask pattern includes slits. ### Claim 13 (depends on 1, 2, 3) A shadow mask manufactured by a manufacturing method according to any one of claims 1 to 3.