# US 5,348,607 A · High density interconnect thermoplastic die attach material and solvent die attach processing

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- Number: US 5,348,607 A
- Document ID: US5348607A
- Status: Granted
- Kind: A
- Application number: 08/020,913
- Filed: 1993-02-22
- Granted: 1994-09-20
- Earliest claimed: 1989-02-21
- Assignees: General Electric Company
- Inventors: Robert J. Wojnarowski; Charles W. Eichelberger
- Web page: https://patentgrep.com/patent/US5348607A

## CPC

- H10W 70/614: {the multiple chips being integrally enclosed}
- H10W 70/682: {comprising holes having chips therein}
- H10W 70/685: comprising multiple insulating layers
- H10W 72/073: {of die-attach connectors}
- H10W 72/07337: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}
- H10W 72/354: {comprising polymers}
- Y10T 156/109: Embedding of laminae within face of additional laminae
- Y10T 156/1092: All laminae planar and face to face
- Y10T 156/1111: Using solvent during delaminating [e.g., water dissolving adhesive at bonding face during delamination, etc.]
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A mixture for affixing dice to a substrate includes a thermoplastic polyimide, a solvent for the polyimide, and a solvent which does not dissolve the polyimide but adds thixotropicity to the mixture. The mixture is applied to the substrate, the dice are placed thereon, and the solvents are evaporated to bond the dice to the substrate. The bond is radiation hard and exhibits high shear pull strength. A poor solvent for the polyimide, sprayed over the dice and exposed portions of die attach material, causes some polyimide to precipitate out of solution in the exposed portions of die attach material to form a grid that extends between the dice and prevents the dice from "swimming together" during high temperature processing. In a solvent die-attachment method, the substrate is first coated with a mixture of die attach material, and the mixture is dried. Spraying a solvent over the die attach material causes the material to soften so that the dice applied thereto may adhere. The die attach material is then dried to form the bond.

## Claims

### Claim 1

A method of attaching a plurality of dice to a substrate, to allow subsequent removal of said dice, comprising the steps of:
attaching each respective one of said plurality of dice to a surface of said substrate with an associated one of a like plurality of dots of glue, respectively;
coating said surface of said substrate with a solvented thermoplastic polymer solution comprising between 5% and 10% of a polymer in a solvent therefor, said thermoplastic polymer being a polyetherimide comprised of bisphenol-A-dianhydride condensed with metaphenylene diamine, said solvent comprising meta-cresol and a selected one of orthodichlorobenzene and acetophenone; and
drying said solvented polymer solution coated on said surface of said substrate so as to gang-bond said plurality of die in place.

### Claim 2 (depends on 1)

The method of attaching a plurality of dice recited in claim 1 wherein said thermoplastic polymer is a polyetherimide comprised of bisphenol-A-dianhydride and pyromellitic dianhydride condensed with metaphenylene diamine.