# US 5,348,460 A · Apparatus for producing flat plastic moldings, for example identity cards > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,348,460 A - Document ID: US5348460A - Status: Granted - Kind: A - Application number: 07/992,727 - Filed: 1992-12-18 - Granted: 1994-09-20 - Earliest claimed: 1991-12-20 - Assignees: GAO Gesellschaft fur Automation and Organisation mbH - Inventors: Helmut Baader - Web page: https://patentgrep.com/patent/US5348460A ## CPC - G06K 19/07724: {the record carrier being at least partially made by a molding process (molding in general B29C45/14)} - B29C 45/14024: {and punching or cutting a portion from the endless articles during mould closing} - B29C 45/26: Moulds - B29C 45/56: using mould parts movable during or after injection, e.g. injection-compression moulding {(B29C45/1705 and B29C45/572 take precedence)} - G06K 19/077: Constructional details, e.g. mounting of circuits in the carrier - B29L 2017/006: {Memory cards, chip cards} - G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES ## Abstract In an apparatus for producing flat plastic moldings, for example identity cards, the mold includes a conic core and a die-block member shaped in accordance with the core member. The opposing side surfaces of the core and die-block members, which are inclined to the opening direction of the mold, enclose a mold space on part of their surface. The core and die-block members are formed in such a way that the mold parts brace each other in the closed state. ## Claims ### Claim 1 An apparatus for producing flat plastic cards with an integrated circuit embedded therein, comprising: two mold parts that are supported for movement relative to each other and which enclose between them at least one mold space; a closing means connected with the mold parts to close them toward one another with a locking pressure which acts against the opening direction of the mold parts; said mold parts including a wedge-shaped core member having mold surfaces inclined to the direction of opening movement of the mold parts, and a die-block member shaped complementally to the core member and having surfaces respectively opposed to the mold surfaces on the core member so as to define at least two approximately two-dimensional mold spaces on respective sides of said core member when the mold is closed; interfitting means on the core member and die-block member which engage one another when the mold is closed, whereby the core member and die-block member brace each other when the mold is closed; and means providing for an integrated circuit module to be embedded into a flat plastic card produced by said apparatus, said providing means including a movable element provided in said core member for each of said mold spaces, each of said movable elements being shiftable substantially perpendicular to a respective side of said core member to a position within a respective one of said mold spaces so as to control the volume of the mold space. ### Claim 2 (depends on 1) The apparatus as claimed in claim 1 wherein: each of the mold spaces is formed by a recess in the mold surface of the core member, said recess having a configuration corresponding to the shape to be given to the card. ### Claim 3 (depends on 1) An apparatus according to claim 1, further comprising: means for delivering a supply of plastic to said mold spaces; and means for supplying an integrated circuit module into each of said mold spaces, said supplying means including said movable element which is adapted to engage an integrated circuit and shift the integrated circuit into a respective one of said mold spaces commensurate with the supplying of plastic by said delivering means. ### Claim 4 (depends on 1) An apparatus according to claim 1, further comprising: means for delivering a supply of plastic to said mold spaces; and means for shifting each of said movable elements into a respective one of said mold spaces commensurate with the supply of plastic thereto by said delivery means such that recesses are formed in the cards produced by said apparatus with each of said recesses being adapted to receive an integrated circuit. ### Claim 5 (depends on 1) An apparatus according to claim 1, wherein each of said movable elements comprises a stamping die, said apparatus further comprising a band carrying a plurality of integrated circuit modules, said band being guided through said core member between said mold space and said stamping die, whereby when said movable element is shifted, an integrated circuit is separated from said band and transferred into said mold space by engagement with said movable element. ### Claim 6 (depends on 5) An apparatus according to claim 5, wherein said stamping die includes a front face, the shape of which corresponds to the shape of the integrated circuit module. ### Claim 7 (depends on 1) An apparatus according to claim 1, wherein the movable element comprises a movable die adapted to be shifted into the mold space such that a recess is formed in each card produced by said apparatus. ### Claim 8 (depends on 6) An apparatus according to claim 6, wherein the front face of said movable die is stepped such that said recess is formed stepped.