# US 5,348,214 A · Method of mounting semiconductor elements

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- Number: US 5,348,214 A
- Document ID: US5348214A
- Status: Granted
- Kind: A
- Application number: 08/012,369
- Filed: 1993-02-02
- Granted: 1994-09-20
- Earliest claimed: 1990-11-20
- Assignees: Sumitomo Electric Industries, Ltd.
- Inventors: Masanori Nishiguchi; Atsushi Miki
- Web page: https://patentgrep.com/patent/US5348214A

## CPC

- H10W 72/072: {of bump connectors}
- H10W 72/07227: {involving guiding structures, e.g. spacers or supporting members}
- H10W 72/07236: {Soldering or alloying}
- H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 80/168: {using guiding structures}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 29/49146: with encapsulating, e.g., potting, etc.
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method of mounting a plurality of semiconductor elements each having bump electrodes on a wiring board by pressing the semiconductor elements to the wiring board while aligning the electrodes and heating the structure. In the mounting method, one or more heat sinks are previously joined to the backs opposite to the surfaces with the bump electrodes formed thereon of the semiconductor elements.

## Claims

### Claim 1

A method of mounting semiconductor elements comprising the steps of:
providing a plurality of semiconductor elements, each of said semiconductor elements having first and second surfaces and having bump electrodes on said first surface;
forming a resist pattern on heat sinks to align said semiconductor elements with said heat sinks;
joining said heat sinks to said second surfaces;
pressing said semiconductor elements, with said heat sinks joined thereon to a wiring board having electrodes, while aligning said bump electrodes to correspond with the wiring board electrodes;
heating said bump electrodes and said wiring board to mount said semiconductor elements on said wiring board; and
applying a molding resin to said wiring board, said semiconductor elements and said heat sinks.

### Claim 2 (depends on 1)

A method as in claim 1 wherein the wiring board electrodes are concavities and said pressing and electrode aligning includes pressing said bump electrodes into said concavities.