# US 5,347,696 A · Method for manufacturing a multi-layer capacitor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,347,696 A - Document ID: US5347696A - Status: Granted - Kind: A - Application number: 08/164,719 - Filed: 1993-12-10 - Granted: 1994-09-20 - Earliest claimed: 1993-01-14 - Assignees: Siemens Aktiengesellschaft - Inventors: Josef Willer; Hermann Wendt; Hans Reisinger - Web page: https://patentgrep.com/patent/US5347696A ## CPC - H01G 4/306: {made by thin film techniques} - Y10T 29/435: Solid dielectric type - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract For manufacturing a multi-layer capacitor, a layer structure (2, 3, 4) is applied onto a substrate (1), said layer structure comprising conductive layers (2, 4) and dielectric layers (3) in alternation and successive conductive layers (2, 4) therein being respectively formed of one of two different materials which are selectively etchable relative to one another. Two openings (6, 8) are produced in the layer structure (2, 3, 4), whereby under-etchings (21, 41 ) are formed in the first opening (6) by selective etching of the one material and are formed in the second opening (8) by selective etching of the other material, so that only the conductive layers (2, 4) of the non-etched material respectively adjoin contacts (91, 92) introduced into the openings (6, 8). ## Claims ### Claim 1 A method for producing a multi-layer capacitor, comprising the steps of: applying a layer structure of conductor layers alternating with dielectric layers on a substrate, said conductor layers alternating as a first conductive layer of a first material and a second conductive layer of a second material, first and said second materials being mutually selectively etchable relative to each other; conducting a first etching to form a first opening completely through said layer structure using a first mask as an etching mask; conducting a second etching of said second material in said second conductive layers by selectively removing said second material in each second layer relative to said first material thereby creating first under-etchings in each second layer in said layer structure neighboring said first opening; conducting a third etching to form a second opening completely through in said layer structure using a second mask as a etching mask; conducting a fourth etching of said first material in said first conductive layers by selectively removing said first material in each first layer relative to said second material thereby creating second under-etchings in each first layer in said layer structure neighboring said second opening; forming a first contact in said first opening, said first contact contacting only said first material conductive layers due to said first under-etchings; and forming a second contact in said second opening, said second contact contacting only said second material conductive layers due to said second under-etchings. ### Claim 2 (depends on 1) Method according to claim 1, further defined by selectively conducting said second etching step and said fourth etching step for forming said under-etchings relative to said dielectric layers. ### Claim 3 (depends on 1) Method according to claim 1, further defined by forming said conductive layers of different metals, ### Claim 4 (depends on 1) Method according to claim 1, further defined by forming said first contact and said second contact by surface-wide, directed application and structuring of a contact layer. ### Claim 5 (depends on 4) Method according to claim 4, further defined by applying said contact layer by sputtering. ### Claim 6 (depends on 4) Method according to claim 4, further defined by applying said contact layer by vapor deposition. ### Claim 7 (depends on 1) Method according to claim 1, further defined by forming said first mask and said second mask by optical lithography. ### Claim 8 (depends on 1) Method according to claim 1, further defined by forming said first mask and said second mask by silk-screening. ### Claim 9 (depends on 1) Method according to claim 1, said applying step further defined by sputtering said first, second and dielectric layers. ### Claim 10 (depends on 1) Method according to claim 1, wherein the step of applying a layer structure is further defined by applying a layer structure having dielectric layers of Si.sub.3 N.sub.4, first conductive layers of tungsten and said second conductive layers of a tungsten silicide onto a substrate. ### Claim 11 (depends on 10) Method according to claim 10, further defined by forming said second conductive layers of a tungsten silicide selected from the group consisting of WSi.sub.2 and WSi.sub.0.4. ### Claim 12 (depends on 10) Method according to claim 10, further defined by conducting said first etching step for forming said first opening and said third step for forming said second opening by a dry etching process with a fluorine-containing etching gas; and adding at least one gas from the group consisting of O.sub.2, Ar, N.sub.2, H.sub.2, He to said etching gas for setting the selectivity in each of said second etching step and said fourth etching step. ### Claim 13 (depends on 12) Method according to claim 12, further defined by conducting said etching using a gas selected from the group consisting of SF.sub.6 or CF.sub.4 as said etching gas. ### Claim 14 (depends on 12) Method according to claim 12 further defined by, adding O.sub.2 in an amount between 10% and 50% in said second etching step for etching tungsten silicide; and adding N.sub.2 in an amount between 30% and 70% in said fourth etching step for etching tungsten. ### Claim 15 (depends on 1) Method according to claim 1, wherein the step of applying a layer structure is further defined by applying a layer structure having dielectric layers of Ta.sub.2 O.sub.5, first conductive layers of Ta; and second conductive layers of TaN on a substrate. ### Claim 16 (depends on 15) Method according to claim 15, further defined by conducting said etching using a gas selected from the group consisting of SF.sub.6 or CF.sub.4 as said etching gas. ### Claim 17 (depends on 15) Method according to claim 15, further defined by, adding O.sub.2 in an amount between 10% and 50% in said second etching step for etching TaN; and adding N.sub.2 in an amount between 30% and 70% in said fourth etching step for etching Ta.