# US 5,346,979 A · Curable resin, process for making and electronic part protective coating

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 5,346,979 A
- Document ID: US5346979A
- Status: Granted
- Kind: A
- Application number: 08/003,398
- Filed: 1993-01-12
- Granted: 1994-09-13
- Earliest claimed: 1992-01-17
- Assignees: Shin-Etsu Chemical Co., Ltd.
- Inventors: Hiroshige Okinoshima; Hideto Kato
- Web page: https://patentgrep.com/patent/US5346979A

## CPC

- C08G 73/106: {containing silicon}
- C08G 73/101: {containing chain terminating or branching agents}
- C08G 73/1039: {comprising halogen-containing substituents}
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS

## Abstract

A novel curable polyimide resin of structural formula (1) or (2) is provided wherein R.sup.1 and R.sup.2 are independently substituted or unsubstituted monovalent C.sub.1-10 hydrocarbon groups, R.sup.3 is a divalent C.sub.1-10 organic group, X is a tetravalent organic group containing an aromatic or aliphatic ring, Y is a divalent organic group, Z is a divalent organic group containing an aromatic ring, W is a trivalent organic group containing an aromatic ring, m is an integer of 1 to 3, and n is an integer of at least 1. It can be prepared by reacting a polyimide with a silicon compound. The curable resin forms with a solvent a solution having a low viscosity and shelf stability and cures at relatively low temperatures below 300.degree. C. into coatings having heat resistance, mechanical strength, electrical properties, solvent resistance and substrate adherence. ##STR1##

## Claims

### Claim 1

A curable resin having the following structural formula ##STR30##

### Claim 2

A curable resin having the following structural formula ##STR31##

### Claim 3

A curable resin having the following structural formula ##STR32##

### Claim 4

A curable resin having the following structural formula ##STR33##