# US 5,346,863 A · Low temperature sealing composition

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- Number: US 5,346,863 A
- Document ID: US5346863A
- Status: Granted
- Kind: A
- Application number: 08/164,136
- Filed: 1993-12-08
- Granted: 1994-09-13
- Earliest claimed: 1992-12-11
- Assignees: Nippon Electric Glass Co., Ltd.
- Inventors: Hajime Hikata; Kumi Tanaka; Kazuyoshi Shindo
- Web page: https://patentgrep.com/patent/US5346863A

## CPC

- C03C 3/142: {containing lead}
- C03C 8/24: Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
- C03C: CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS

## Abstract

A low temperature sealing composition consists essentially of 45.0 to 85.0 wt. % of PbO, 1.0 to 11.0 wt. % of B.sub.2 O.sub.3, 1.0 to 45.0 wt. % of Bi.sub.2 O.sub.3, 0.2 to 10.0 wt. % of Fe.sub.2 O.sub.3, 0 to 15.0 wt. % of ZnO, 0 to 5.0 wt. % of CuO, 0 to 5.0 wt. % of V.sub.2 O.sub.5, 0 to 3.0 wt. % of SnO.sub.2, 0 to 5.0 wt. % of SiO.sub.2 plus Al.sub.2 O.sub.3, 0 to 7.0 wt. % of BaO, 0 to 5.0 wt. % of TiO.sub.2, 0 to 5.0 wt. % of ZrO.sub.2 and 0 to 6.0 wt. % of F.sub.2. The sealing composition has a low sealing temperature of 400.degree.C. or lower and is useful for readily sealing IC packages and display panels without application of load. In order to adjust the thermal coefficient of expansion, the sealing glass composition may be used by mixing with 20 vol. % to 55 vol. % of refractory filler powder of such as lead titanate based ceramics, willemite based ceramics, cordierite ceramics, zircon based ceramics or tin oxide based ceramics.

## Claims

### Claim 1

A low temperature sealing composition consisting of glass powder, said glass powder consisting essentially of 45.0 to 85.0 wt. % of PbO, 1.0 to 11.0 wt. % of B.sub.2 O.sub.3, 1.0 to 45.0 wt. % of Bi.sub.2 O.sub.3, 0.2 to 10.0 wt. % of Fe.sub.2 O.sub.3, 0 to 15.0 wt. % of ZnO, 0 to 5.0 wt. % of CuO, 0 to 5.0 wt. % of V.sub.2 O.sub.5, 0 to 3.0 wt. % of SnO.sub.2, 0 to 5.0 wt. % of SiO.sub.2 plus Al.sub.2 O.sub.3, 0 to 7.0 wt. % of BaO, 0 to 5.0 wt. % of TiO.sub.2, 0 to 5.0 wt. % of ZrO.sub.2 and 0 to 6.0 wt. % of F.sub.2.

### Claim 2 (depends on 1)

A low temperature sealing composition as claimed in claim 1, said glass powder consisting essentially of 50.0 to 83.0 wt. % of PbO, 2.0 to 10.0 wt. % of B.sub.2 O.sub.3, 1.2 to 35.0 wt. % of Bi.sub.2 O.sub.3, 0.2 to 9.0 wt. % of Fe.sub.2 O.sub.3, 0 to 13.0 wt. % of ZnO, 0 to 4.0 wt. % of CuO, 0 to 3.0 wt. % of V.sub.2 O.sub.5, 0 to 2.0 wt. % of SnO.sub.2, 0 to 3.0 wt. % of SiO.sub.2 plus Al.sub.2 O.sub.3, 0 to 5.0 wt. % of BaO, 0 to 1.0 wt. % of TiO.sub.2, 0 to 1.0 wt. % of ZrO.sub.2 and 0 to 6.0 wt. % of F.sub.2.

### Claim 3

A low temperature sealing composition comprising 45 vol. % to 80 vol. % of glass powder and 20 vol. % to 55 vol. % of refractory filler powder, said glass powder consisting essentially of 45.0 to 85.0 wt. % of PbO, 1.0 to 11.0 wt. % of B.sub.2 O.sub.3, 1.0 to 45.0 wt. % of Bi.sub.2 O.sub.3, 0.2 to 10.0 wt. % of Fe.sub.2 O.sub.3, 0 to 15.0 wt. % of ZnO, 0 to 5.0 wt. % of CuO, 0 to 5.0 wt. % of V.sub.2 O.sub.5, 0 to 3.0 wt. % of SnO.sub.2, 0 to 5.0 wt. % of SiO.sub.2 plus Al.sub.2 O.sub.3, 0 to 7.0 wt. % of BaO, 0 to 5.0 wt. % of TiO.sub.2, 0 to 5.0 wt. % of ZrO.sub.2 and 0 to 6.0 wt. % of F.sub.2.

### Claim 4 (depends on 3)

A low temperature sealing composition as claimed in claim 3, said glass powder consisting essentially of 50.0 to 83.0 wt. % of PbO, 2.0 to 10.0 wt. % of B.sub.2 O.sub.3, 1.2 to 35.0 wt. % of Bi.sub.2 O.sub.3, 0.2 to 9.0 wt. % of Fe.sub.2 O.sub.3, 0 to 13.0 wt. % of ZnO, 0 to 4.0 wt. % of CuO, 0 to 3.0 wt. % of V.sub.2 O.sub.5, 0 to 2.0 wt. % of SnO.sub.2, 0 to 3.0 wt. % of SiO.sub.2 plus Al.sub.2 O.sub.3, 0 to 5.0 wt. % of BaO, 0 to 1.0 wt. % of TiO.sub.2, 0 to 1.0 wt. % of ZrO.sub.2 and 0 to 6.0 wt. % of F.sub.2.

### Claim 5 (depends on 3)

A low temperature sealing composition as claimed in claim 3, said refractory filler powder comprising at least one element which is selected from the group consisting of lead titanate based ceramic powder, willemite based ceramic powder, cordierite ceramic powder, zircon based ceramic powder, tin oxide based ceramic powder, .beta.-eucryptite ceramic powder, and mullite ceramic powder.