# US 5,346,576 A · Method of manufacturing IC card > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,346,576 A - Document ID: US5346576A - Status: Granted - Kind: A - Application number: 08/085,054 - Filed: 1993-07-02 - Granted: 1994-09-13 - Earliest claimed: 1990-03-26 - Assignees: Mitsubishi Denki Kabushiki Kaisha - Inventors: Makoto Kobayashi; Syojiro Kodai; Katsunori Ochi - Web page: https://patentgrep.com/patent/US5346576A ## CPC - G06K 19/07745: {Mounting details of integrated circuit chips} - H10D 62/117: {Shapes of semiconductor bodies} - Y10S 428/915: Fraud or tamper detecting - Y10S 428/916: Fraud or tamper detecting - Y10T 428/24322: Composite web or sheet - Y10T 428/24826: Spot bonds connect components - Y10T 428/24917: including metal layer - G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract In an IC card and a manufacturing method therefor, an adhesive is applied between core layers in the vicinity of an opening in which an IC module is placed. The core sheet layers held between adhesive layers can easily be deformed when heat and pressure are applied. Therefore, a gap formed between the card substrate and the IC module is filled. Furthermore, the gap from the IC module is narrower at the corners of the IC module than conventionally shaped openings. As a result, gaps at the corners of the IC module after integral molding are prevented. Therefore, the gap between the IC module and the card substrate can be reliably filled during molding. ## Claims ### Claim 1 A method of manufacturing an IC card comprising: forming through holes in a plurality of core sheets; providing a core sheet without a hole; stacking the core sheets with through holes in sequence on the core sheet without a hole to form an opening defined by the through holes, and the core sheet without a hole, including placing at least one adhesive layer between and contacting at least two adjacent core sheets at the periphery of the through holes leaving adhesive-free areas between the core sheets remote from the opening; placing an IC module into the opening, a gap being formed between the opening and the IC module; and applying heat and pressure to the core sheets, at least one adhesive layer, and IC module, wherein the gap between said IC module and said core sheets is filled by flow of the adhesive layer while applying heat and pressure. ### Claim 2 (depends on 1) The method of manufacturing an IC card according to claim 1 wherein said IC module includes a first portion having a rectangular cross section generally parallel to the plurality of core sheets and a first surface on which an external connection terminal is disposed and a second portion having a rectangular cross section generally parallel to the plurality of core sheets with a smaller area than the first portion comprising stacking the core sheets with the through holes to form an opening having a shape conforming to the first and second portions of the IC module. ### Claim 3 (depends on 2) The method of manufacturing an IC card according to claim 2 including, before placing the IC module in the opening, placing an adhesive layer in the opening on the core sheet without a through hole and extending beyond the opening between the core sheet without a through hole and an adjacent core sheet with a through hole and placing the IC module in the opening so that the adhesive layer in the opening contacts a second surface of the IC module opposite the first surface of the IC module. ### Claim 4 (depends on 2) The method of manufacturing an IC card according to claim 2 wherein the rectangular cross sections include corners and the opening has a shape forming the gap with the IC module before applying heat and pressure so that the gap is smaller adjacent corners of the IC module than remote from the corners of the IC module. ### Claim 5 (depends on 2) The method of manufacturing an IC card according to claim 2 wherein the cross section of the second portion includes rounded corners and the through holes include rounded corners forming part of the opening and having a radius of curvature larger than a radius of curvature of the rounded corners of the cross section of the second portion of the IC module. ### Claim 6 (depends on 2) The method of manufacturing an IC card according to claim 2 wherein the rectangular cross sections have corners and the opening has a shape including planar surfaces at each of the corners of the opening adjacent and diagonal to the corners of the IC module. ### Claim 7 (depends on 1) The method of manufacturing an IC card according to claim 1 including integrally molding a protection sheet layer as an outer on said plurality of core sheets. ### Claim 8 (depends on 1) The method of manufacturing an IC card according to claim 1 wherein adhesive layer is a heat sensitive adhesive having a melting point lower than that of the core sheets. ### Claim 9 (depends on 1) The method of manufacturing an IC card according to claim 1 wherein the adhesive layer is a pressure sensitive adhesive. ### Claim 10 (depends on 1) The method of manufacturing an IC card according to claim 1 wherein the adhesive layer is a B-stage heat hardening adhesive.