# US 5,346,558 A · Solderable anisotropically conductive composition and method of using same

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- Number: US 5,346,558 A
- Document ID: US5346558A
- Status: Granted
- Kind: A
- Application number: 08/082,653
- Filed: 1993-06-28
- Granted: 1994-09-13
- Earliest claimed: 1993-06-28
- Assignees: W. R. Grace & Co.-Conn.
- Inventors: Eckart Mathias
- Web page: https://patentgrep.com/patent/US5346558A

## CPC

- B23K 35/22: characterised by the composition or nature of the material
- B23K 35/3613: {Polymers, e.g. resins}
- H05K 3/3485: Application of solder paste, slurry or powder (using printing techniques to form the desired conductive pattern of the printed circuit by applying conductive material H05K3/12)
- B23K 35/025: {Pastes, creams or slurries}
- H05K 3/321: by conductive adhesives
- H05K 3/323: {by applying an anisotropic conductive adhesive layer over an array of pads}
- H05K 2201/0129: Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A novel anisotropically conductive solder paste and a method of use thereof to join metallic parts in electronic manufacturing processes, in particular surface-mount electronic manufacturing processes. The solder paste is fluxless and reflowable for purposes of repair and achieves electrical anisotropy by soldering component leads to circuit board pads, while maintaining electrical insulation properties between adjacent joints.

## Claims

### Claim 1

An anisotropically-conductive solder paste composition which comprises finely-divided metal alloy particles dispersed in a solution of an organic polymer in an organic solvent which has a boiling point above the softening temperature of the polymer and no higher than the melting point of the metal alloy particles, wherein the polymer has a softening temperature at or below the melting point of the metal alloy particles and where said composition is free of a fluxing agent.

### Claim 2 (depends on 1)

The solder paste composition of claim 1 in which the metal alloy particles are selected from the group consisting of tin/lead alloy, tin/lead/silver alloy, bismuth/tin alloy, and indium/tin alloy.

### Claim 3 (depends on 1)

The solder paste composition of claim 1 in which the particle size of the metal alloy particles is less than about 74 microns.

### Claim 4 (depends on 3)

The solder paste composition of claim 3 in which the particle size of the metal alloy particles is less than about 15 microns.

### Claim 5 (depends on 1)

The solder paste composition of claim 1 wherein the organic polymer is a thermoplastic polymer which is heat-softenable at or below the melting point of the metal alloy particles.

### Claim 6 (depends on 5)

The solder paste composition of claim 5 wherein the thermoplastic polymer is a polyester, a polyvinyl chloride, a polyvinyl fluoride, a polyamide, a polyethylene, a polystyrene or a polyurethane.

### Claim 7 (depends on 1)

The solder paste composition of claim 1 in which metal alloy particles are present in an amount of about 50 to about 90 weight percent based on the total weight of the paste.

### Claim 8 (depends on 5)

The solder paste composition of claim 5 in which said solution of organic polymer in an organic solvent is from about 10 to about 50 weight percent based on the total weight of the paste.

### Claim 9 (depends on 1)

The solder paste composition of claim 1 in which said solvent is selected from the group consisting of aliphatic and aromatic alcohols, aliphatic and aromatic esters, aromatic and aliphatic hydrocarbons, aromatic-aliphatic hydrocarbons, and mixtures thereof.

### Claim 10

A surface mount electronic manufacturing process comprising
a) applying an anisotropically-conductive solder paste onto the pads and spaces of a printed circuit board;
b) placing electronic surface mount components onto the printed circuit board wherein the leads of the electronic components are in contact with the solder paste coated pads;
c) heating the printed circuit board at a temperature and for a period of time sufficient to cause the solder paste to melt; and
d) allowing the printed circuit board to cool; wherein the solder paste is free of a fluxing agent and comprises finely-divided metal alloy particles dispersed in a solution of an organic polymer in an organic solvent which has a boiling point above the softening temperature of the polymer and no higher than the melting temperature of the metal alloy particles and wherein the polymer has a softening temperature at or below the melting point of the metal alloy particles.

### Claim 11 (depends on 10)

The process of claim 10 in which the organic polymer is a thermoplastic polymer which is heat-softenable at or below the melting point of the metal alloy particles.

### Claim 12 (depends on 11)

The process of claim 11 in which said thermoplastic polymer is selected from the group consisting of polyamides, polyesters, and polyvinyl chlorides, polyvinyl fluorides, polyethylenes, polyurethanes, or polystyrenes.

### Claim 13 (depends on 10)

The process of claim 10 in which the metal alloy particles are selected from the group consisting of tin/lead alloy, tin/lead/silver alloy, bismuth/tin alloy, and indium/tin alloy.

### Claim 14 (depends on 11)

The process of claim 11 in which the volatile organic solvent is selected from the group consisting of aliphatic and aromatic alcohols, aliphatic and aromatic esters, aliphatic and aromatic hydrocarbons, aromatic-aliphatic hydrocarbons, and mixtures thereof.

### Claim 15 (depends on 10)

The process of claim 10 which further comprises the step of applying pressure onto the electronic surface mount components between steps (b) and (c), wherein said pressure is applied in an amount sufficient to provide coplanarity of the component leads with the pads of the printed circuit board.