# US 5,346,518 A · Vapor drain system

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- Number: US 5,346,518 A
- Document ID: US5346518A
- Status: Granted
- Kind: A
- Application number: 08/035,999
- Filed: 1993-03-23
- Granted: 1994-09-13
- Earliest claimed: 1993-03-23
- Assignees: International Business Machines Corporation
- Inventors: Robert J. Baseman; Charles A. Brown; Benjamin N. Eldridge; Laura B. Rothman; Herman R. Wendt; James T. Yeh; Arthur R. Zingher
- Web page: https://patentgrep.com/patent/US5346518A

## CPC

- H10P 72/1911: {characterised by materials, roughness, coatings or the like}
- B65G 1/00: Storing articles, individually or in orderly arrangement, in warehouses or magazines (conveyor combinations in warehouses, magazines or workshops B65G37/00; stacking of articles B65G57/00; removing articles from stacks B65G59/00; loading machines B65G65/02)
- H10P 72/1926: {characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- B65G: TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS (packaging B65B; handling thin or filamentary materials, e.g. paper sheets or thread, B65H; cranes B66C; portable mobile or lifting or hauling appliances, e.g. hoists, B66D; devices for lifting or lowering goods for loading or unloading purposes, e.g. fork-lift trucks, B66F9/00; emptying bottles, jars, casks, barrels or similar containers, not otherwise provided for, B67C9/00; delivering or transferring liquids B67D; filling or discharging vessels for liquefied, solidified or compressed gases F17C; pipe-line systems for fluids F17D)

## Abstract

During wafer fabrication, a transportable enclosure, such as a Standard Manufacturing InterFace (SMIF) pod encloses a nascent product, such as a semiconductor wafer, to protect the wafer against contamination during manufacture, storage or transportation. However chemical vapors emitted inside the pod can accumulate in the air and degrade wafers during subsequent fabrication. In order to absorb the vapors inside a closed pod, a vapor removal element typically including an activated carbon absorber, covered by a particulate-filtering vapor-permeable barrier, and covered by a guard plate with holes is disposed within the enclosure. A vapor removal element is disposed closely adjacent to each respective wafer. Alternatively, a single vapor removal element is located inside the enclosure. In certain instances, a fan or thermo-buoyant circulation causes any vapors located inside the enclosure to a vapor removal element for removal. Alternatively a porous vapor removal element may be disposed for removing vapors from air entering the enclosure. In another embodiment a vapor removal element is integrated with the back face of each wafer.

## Claims

### Claim 1

A vapor drain system comprising:
an enclosure for holding a vapor sensitive product between processing steps of its manufacture; and
vapor removal element means disposed in said enclosure for removing contaminating vapors outgassing from a source within said enclosure, the conductance of said vapor removal element sufficiently exceeding the conductance of said source of contaminating vapors to maintain the relative vapor concentration (RVC) of said contaminating vapors in said enclosure at ten percent (10%) or less adjacent the vapor sensitive product to thereby inhibit the formation of contaminating layers on said product.

### Claim 2 (depends on 1)

A vapor drain system as set forth in claim 1, wherein said enclosure comprises a cover having a plurality walls and said vapor removal element means is disposed at at least one of said walls.

### Claim 3 (depends on 2)

A vapor drain system as set forth in claim 2, further including means not part of the vapor sensitive product for circulating vapor past said vapor removal element means.

### Claim 4 (depends on 1)

A vapor drain system as set forth in claim 1 wherein said enclosure holds a plurality wafer shaped products arranged in a stack in face to face to face spaced relationship to one another and said vapor removal element means comprises a plurality of vapor removal element means, with individual ones of said vapor removal element means each interposed between a different pair of said wafer shaped products in the stack.

### Claim 5 (depends on 4)

A vapor drain system as set forth in claim 4 wherein said vapor removal element means is disposed on a face of individual wafer shaped products in said plurality.

### Claim 6 (depends on 4)

A vapor drain system as set forth in claim 4 further including means not part of the vapor sensitive product for circulating vapors to the vicinity of said vapor removal element means.

### Claim 7 (depends on 1)

A vapor drain system as set forth in claim 1, wherein said enclosure comprises a plurality of walls and said vapor removal element means comprises a breather vapor removal element disposed across an aperture in one of said walls.

### Claim 8 (depends on 1)

A vapor drain system as set forth in claim 1, wherein said enclosure comprises a plurality of walls and said vapor removal element means comprises a first breather vapor removal element across an aperture in one of said walls and a second breather vapor removal element across an aperture in another of said walls for providing purging of the atmosphere within said enclosure.

### Claim 9 (depends on 1)

A vapor drain system as set forth in claim 1, wherein said vapor removal element is removable and comprises an absorber for facilitating analysis of said vapors.

### Claim 10 (depends on 9)

A vapor drain system an set forth in claim 9, wherein said absorber is a reversible absorber.

### Claim 11 (depends on 9)

A vapor drain system as set forth in claim 9, wherein said enclosure comprises a plurality of walls and said vapor removal means is disposed in an aperture in one of said walls.

### Claim 12 (depends on 1)

A vapor drain system as set forth in claim 1, wherein said vapor removal element comprises an aperture connecting the interior and exterior of said enclosure and a vapor-permeable and particulate-proof barrier disposed across said aperture.

### Claim 13

A thermo-buoyant vapor drain system comprising:
an enclosure for holding vapor sensitive product between steps of its manufacture;
means not part of the vapor sensitive product for non-uniformly heating and cooling air within said enclosure for causing thermo-buoyant convection of vapor within said enclosure, and
vapor removal element means disposed in said enclosure for removing vapor from said circulating air.

### Claim 14 (depends on 13)

A thermo-buoyant vapor drain system as set forth in claim 13, wherein said means for non-uniformly heating and cooling comprises a heat source located within said enclosure.

### Claim 15 (depends on 13)

A thermo-buoyant vapor drain system as set forth in claim 13, wherein said means for non-uniformly heating and cooling comprises a heat source disposed external to said enclosure and means for transferring heat non-uniformly to air in said enclosure.

### Claim 16 (depends on 13)

A thermo-buoyant vapor drain system as set forth in claim 13, wherein said means for non-uniformly heating and cooling comprises at least one thermal fin located on a wall of said enclosure.

### Claim 17 (depends on 13)

A thermo-buoyant vapor drain system as set forth in claim 13, wherein said means for non-uniformly heating and cooling comprises at least one thermal conductor passing through a wall of said enclosure.

### Claim 18 (depends on 13)

A thermo-buoyant vapor drain system as set forth in claim 13, wherein said means for non-uniformly heating and cooling comprises a fluid cooled thermal plate.

### Claim 19 (depends on 13)

A thermo-buoyant vapor drain system as set forth in claim 13, wherein said enclosure comprises a plurality of walls and said vapor removal element means is disposed at at least one of said walls.

### Claim 20

In a sealed enclosure for retaining a semi-conductor wafer with a sensitive face between manufacturing steps for said wafer, the improvement comprising:
a vapor removal element with a conductance which exceeds the sum of the conductances from all sources of contaminating vapor in the enclosure including those of the wafer itself, said vapor removal element being held in close juxta-position to the sensitive face of the wafer so as to capture vapor emissions from said face to thereby protect the sensitive face of the wafer from formation of contaminating films thereon.

### Claim 21 (depends on 20)

The sealed enclosure of claim 20 wherein said vapor removal element includes vapor removal material enclosed in a porous particulate blocking film.

### Claim 22 (depends on 20)

The sealed enclosure of claim 20 wherein said conductance of said vapor removal element is sufficient to maintain the relative vapor concentration (RVC) within the enclosure at ten percent (10%) or less where RVC= ##EQU5##

### Claim 23

In a sealed enclosure with a rack mounted therein for holding wafers with a sensitive face in a stack with their faces in spaced relationship to each other, the improvement comprising:
vapor removal elements in the spaces between the wafers facing the sensitive face of the wafers to inhibit self-contamination of the sensitive face of the wafers by outgassing of sources on the wafers.

### Claim 24 (depends on 23)

The sealed enclosure of claim 23 wherein the space between the sensitive face of the wafers and the vapor removal elements is 8 mm or less.