# US 5,345,997 A · Cooling device

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- Number: US 5,345,997 A
- Document ID: US5345997A
- Status: Granted
- Kind: A
- Application number: 08/170,647
- Filed: 1993-12-17
- Granted: 1994-09-13
- Earliest claimed: 1991-05-17
- Assignees: Hilti Aktiengesellschaft
- Inventors: Eckart Drossler; Rainer Batliner
- Web page: https://patentgrep.com/patent/US5345997A

## CPC

- C21D 1/53: Heating in fluidised beds
- C21D 1/62: Quenching devices
- C21D 9/0018: {for charging, discharging or manipulation of charge}
- Y10S 165/92: Particulate heat exchange
- C21D: MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING (surface treatment of metallic material involving at least one process provided for in class C23 and at least one process covered by this subclass C23F17/00; unidirectional solidification of eutectic materials or unidirectional demixing of eutectoid materials C30B)
- Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

## Abstract

A cooling device (1) in the form of a vertically arranged hollow chamber is located between a heat treatment furnace (9) and a quenching bath (11d). The device controls the cooling of small hardware items dropping downwardly through it from the furnace (9) to the bath (11d). Spaced baffles (3) are arranged in the hollow chamber and are adjustably inclinable relative to the vertical. A heat transfer member is connected to the baffles so that heat can be removed from or stabilized in the small hardware items flowing over the baffles.

## Claims

### Claim 1

Device for cooling small hardware items positioned between a heat treatment furnace (9) and a quenching bath (11d), the device comprises wall means forming a generally vertically arranged hollow chamber having an upper inlet end and a lower outlet end, a plurality of baffles (3) spaced apart in the vertical direction within the hollow chamber, adjacent said baffles are offset relative to one another and inclined relative to the vertical for forming a tortuous downward flow path between the inlet and the outlet, said baffles each have an adjustable angle of inclination, relative to the vertical, wherein the improvement comprises that said baffles are thermal conductors, said wall means comprises opposed walls, a separate adjustable spring plate connects an upper end of each said baffle to an adjacent said wall of said hollow chamber, said spring plates are adjustable to the adjustable angle of inclination of said baffles and prevent the small hardware items flowing downwardly over said baffles from bypassing the downward flow path by moving between said baffles and the adjacent said walls.

### Claim 2 (depends on 1)

Device as set forth in claim 1, wherein a heat transfer member (4) is connected to the baffles (3) for effecting thermal regulation.

### Claim 3 (depends on 2)

Device, as set forth in claim 2, wherein the heat transfer member (4) is formed as a pipe for flowing a heat transfer medium (4a) therethrough.

### Claim 4 (depends on 2)

Device, as set forth in claim 2, wherein each of said baffles has a first surface arranged to contact the small hardware items flowing downwardly through the hollow chamber and an opposite second surface out of contact with the small hardware items, and the heat transfer member is located on the second surface of the baffles and is connected thereto in a heat conducting manner.

### Claim 5 (depends on 3)

Device, as set forth in claim 3, wherein each of said baffles has a first surface arranged to contact the small hardware items flowing downwardly through the hollow chamber and an opposite second surface out of contact with the small hardware items, and the heat transfer member is located on the second surface of the baffles and is connected thereto in a heat conducting manner.

### Claim 6 (depends on 5)

Device, as set forth in claim 5, wherein said pipe is shaped to provide a sinuous flow path therethrough for the heat transfer medium.