Modular floor sub-structure for the operational support of computer systems

A floor supported substructure system for a computer component having a given base peripheral configuration with a base region through which heat removing air may enter, said system component having given operational heat dissipation and power consumption characteristics, comprising:

• a plurality of floor modules, each having a lower portion supported from saint floor and having side portions extending upwardly therefrom to support an elevated floor surface at a given height and defining a discrete chamber intermediate said lower portion said elevated floor surface;
• said floor module lower portion comprising a rectangular continuous bottom surface and floor engaging adjustable foot components extensible downwardly from the corners thereof and manually adjustable to effect leveling of said elevated floor surface;
• said side portions being provided as four, panel portions extending upwardly from said bottom surface to define a top edge, select ones thereof having panel openings formed therein and having a connector flange structure fixed to and outwardly offset from said top edge;
• at least one rigid, rectangular floor tile removably positionable in nesting relationship within said connector flange structure for support by said four panel portions, the upwardly disposed surface thereof providing said elevated floor surface;
• the said elevated floor surface of a first said floor module supporting said computer system component and having an air outlet formed therein for providing air transfer communication to said base region;
• a said floor module discrete chamber retaining an air circulation blower having an input and an air flow output;
• an air flow path defined by at least one said discrete chamber extending from said blower airflow output to said air outlet;
• second and third said floor modules positioned in adjacency with said first floor module and oriented to effect a substantial alignment of said elevated floor surfaces thereof.

A floor supported substructure assemblage for a computer system component having a given base peripheral configuration with a base region through which heat removing air may pass, said system component having given operational heat generation and power consumption characteristics, comprising:

• a plurality of floor modules, each having a lower portion supported upon said floor and having side portions extending upwardly therefrom to support an elevated floor surface at a given height and defining a chamber intermediate said lower portion and said elevated floor surface, said floor modules being arranged in a said assemblage to form an elevated floor of predetermined peripheral geometric shape including a linear side portion;
• a said floor module having a said side portion forming said assemblage linear side portion and having a cooling coil mounted within the said chamber thereof connectable with cooling fluid conduits, and located within an input air path extending to an air intake adjacent thereto;
• the said elevated floor surface of a said floor module supporting said computer system component and having an air outlet formed therein for providing air transfer communication with said base region;
• a said floor module chamber retaining an air circulation blower having an input for receiving air from said input air path and an air flow output;
• an air flow path defined by at least one said chamber extending from said blower air flow output to said air outlet;
• and
• said cooling coil and said air circulation blower having capacities corresponding with said computer system component operational heat generation characteristic.

A floor supported substructure assemblage for a computer system component having a given base peripheral configuration with a base region through which heat removing air may pass, said system component having given operational heat generation and power consumption characteristics, comprising:

• a plurality of floor modules, each having a lower portion supported upon said floor and having side portions extending upwardly therefrom to support an elevated floor surface at a given height and defining a discrete chamber intermediate said lower portion and said elevated floor surface, said floor modules being arranged in a said assemblage to form elevated floor of predetermined peripheral geometric shape including a linear side portion;
• a said floor module having a said side portion forming said assemblage linear side portion and having a cooling coil mounted within the said discrete chamber thereof connectable with cooling fluid conduits, and located within an input air path extending to an air intake adjacent thereto;
• a step structure having oppositely disposed floor supported side members extending upwardly a step height less than said floor module given height to a step surface, and defining a step cavity therewithin, one said side member being positioned in abutting adjacency with said assemblage linear side portion;
• said cooling fluid conduits being located within said step cavity and coupled with said cooling coil;
• the said elevated floor surface of a said floor module supporting said computer system component and having an air outlet formed therein for providing air transfer communication with said base region;
• a said floor module discrete chamber retaining an air circulation blower having an input for receiving air from said input air path and an air flow output;
• and
• an air flow path defined by at least one said discrete chamber extending from said blower air output to said air outlet.

A floor supported substructure assemblage for a computer system component having a given base peripheral configuration with a base region through which heat removing air may pass, said system component having given operational heat generation and power consumption characteristics, comprising:

• a plurality of floor modules, each having a lower portion supported upon said floor and having side portions extending upwardly therefrom to support an elevated floor surface at a given height and defining a discrete chamber intermediate said lower portion and said elevated floor surface, said floor modules being arranged in a said assemblage to form an elevated floor of predetermined peripheral geometric shape including a linear side portion;
• each said floor module lower portion comprising a rectangular continuous bottom surface and floor engaging adjustable foot components extensible downwardly from the corners thereof and manually adjustable to effect leveling of said elevated floor surface;
• said side portions being provided as four, panel portions extending upwardly from said bottom surface to define a top edge, select ones thereof having panel openings formed therein and having a connector flange structure fixed to and outwardly offset from said top edge;
• at least one rigid, rectangular floor tile removably positionable in nesting relationship within said connector flange structure for support by said four panel portions, the upwardly disposed surface thereof providing an elevated floor surface;
• a said floor module having a said side portion forming said assemblage linear side portion and having a cooling coil mounted within the said discrete chamber thereof connectable with cooling fluid conduits, and located within an input air path extending to an air intake formed within said module adjacent thereto;
• the said elevated floor surface of a said floor module supporting said computer system component and having an air outlet formed therein for providing air transfer communication to said base region;
• a said floor module discrete chamber retaining an air circulation blower having an input for receiving air from said input air path and an air flow output;
• and
• an air flow path defined by at least one said discrete chamber extending from said blower air output to said air outlet.

A floor module for use in assembling a floor supported sub-structure configured to support a computer system component having given operational heat generation and power consumption characteristics, comprising:

• a frame having a rectangular bottom surface and four side panels extending upwardly therefrom to an edge portion defining four corners and having air transfer openings formed therein, and a flange connector structure including a seat flange extending horizontally outwardly from said edge portion to an upstanding connector flange;
• a vertically adjustable floor engaging foot component mounted to said frame in the vicinity of each said corner;
• at least one floor tile positionable upon said frame over said seat flange anti defining a discrete cavity therewith;
• and
• blocking means positionable in abutment with select said side panels for blocking the flow of air through an adjacent said air transfer opening.