# US 5,345,205 A · Compact high density interconnected microwave system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,345,205 A - Document ID: US5345205A - Status: Granted - Kind: A - Application number: 07/504,753 - Filed: 1990-04-05 - Granted: 1994-09-06 - Earliest claimed: 1990-04-05 - Assignees: General Electric Company - Inventors: William P. Kornrumpf - Web page: https://patentgrep.com/patent/US5345205A ## CPC - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 70/611: {for connecting multiple chips together} - H10W 70/688: {Flexible insulating substrates} - H10W 70/682: {comprising holes having chips therein} - H10W 72/9413: {on encapsulations} - Y10T 29/49124: On flat or curved insulated base, e.g., printed circuit, etc. - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A multimodule microwave system is assembled in a physically compact, high reliability manner employing a high density interconnect structure to interconnect the different modules of a microwave system by rendering the portion of the interconnect structure between modules flexible and by folding the interconnect structure on appropriate sized mandrels between the modules to place the modules in a multi-tier physical stack. Shielding and hermetic packaging may also be provided. ## Claims ### Claim 1 A microwave system comprising: a plurality of distinct microwave electronic modules with respective electrical contacts thereon; a flexible high density interconnect structure interconnecting said microwave electronic modules, said flexible high density interconnect structure including a dielectric layer having a side which is bonded to at least two of said microwave electronic modules and including flexible conductors on an opposite side of said dielectric layer supported by said dielectric layer and ohmically connected to said respective electrical contacts of said microwave electronic modules through via holes in said dielectric layer; said microwave electronic modules being disposed in a multi-tier stack by having said flexible high density interconnect structure being bent between adjacent tiers. ### Claim 2 (depends on 1) The microwave system recited in claim 1 further comprising: a flexible support member bonded to said flexible high density interconnect structure at a bend in said flexible high density interconnect structure, said flexible high density interconnect structure at the bend having an inside facing radially inwardly and an outside facing radially outwardly. ### Claim 3 (depends on 2) The microwave system recited in claim 2 wherein: said flexible support member is disposed on the outside of said high density interconnect structure at said bend. ### Claim 4 (depends on 2) The microwave system recited in claim 2 wherein: said flexible support member is bonded to the same side of said dielectric layer as said electronic modules. ### Claim 5 (depends on 4) The microwave system recited in claim 4 wherein: said flexible support member is disposed on the outside of said high density interconnect structure at said bend. ### Claim 6 (depends on 4) The microwave system recited in claim 4 wherein: said electronic modules are bonded to said dielectric layer by an adhesive material, and said flexible support member is bonded to said dielectric layer by the same adhesive material as bonds said electronic modules to said dielectric layer. ### Claim 7 (depends on 6) The microwave system recited in claim 6 wherein: said flexible support member is disposed at a bend in said flexible high density interconnect structure; and at said bend, said support member is disposed on the outside of said high density interconnect structure. ### Claim 8 (depends on 4) The microwave system recited in claim 4 further comprising: a second support member bonded to the opposite side of said structure from said electronic modules. ### Claim 9 A microwave system comprising: a plurality of distinct microwave electronic modules with respective electrical contacts thereon; a flexible high density interconnect structure interconnecting said microwave electronic modules, said flexible high density interconnect structure including a dielectric layer having a side which is bonded to at least two of said microwave electronic modules and flexible conductors supported by said dielectric layer which are ohmically connected to said respective electrical contacts of said microwave electronic modules; said microwave electronic modules being disposed in a multi-tier stack by having said flexible high density interconnect structure being bent between adjacent tiers; a first flexible support member bonded to said flexible high density interconnect structure at a bend in said high density interconnect structure; a second flexible support member bonded to the opposite side of said structure from said electronic modules; said second flexible support member being disposed at another bend in said flexible high density interconnect structure, said flexible high density interconnect structure at said another bend having an inside facing radially inwardly and an outside facing radially outwardly; and said second flexible support member being disposed on the outside of said high density interconnect structure at said another bend. ### Claim 10 (depends on 9) The microwave system recited in claim 9 further comprising: a heat sink disposed in thermal contact with one of said modules. ### Claim 11 (depends on 10) The microwave system recited in claim 10 wherein: said stack has two ends and said module which is disposed in thermal contact with said heat sink is disposed at one end of said stack. ### Claim 12 (depends on 10) The electronic system recited in claim 10 wherein: each of said modules has a face side bonded to said dielectric layer and a back side opposite the face side, and two sequential ones of said modules are disposed in back-to-back relation. ### Claim 13 (depends on 12) The microwave system recited in claim 12 wherein: said back-to-back modules are disposed in back-to-back contact. ### Claim 14 (depends on 12) The microwave system recited in claim 12 wherein: said flexible conductors of said high density interconnect structure include a microwave transmission line which is bent back over itself as a result of the bent configuration of the flexible high density interconnect structure between tiers of said stack. ### Claim 15 (depends on 1) The microwave system recited in claim 1 wherein: said high density interconnect structure comprises a serpentine structure in which said modules are disposed between bends in said serpentine structure. ### Claim 16 (depends on 15) The microwave system recited in claim 15 wherein: said flexible conductors of said high density interconnect structure include a microwave transmission line which is bent back over itself as a result of the bent configuration of the flexible high density interconnect structure. ### Claim 17 (depends on 1) The microwave system recited in claim 1 wherein: said flexible conductors of said high density interconnect structure include a microwave transmission line which is bent back over itself as a result of the bent configuration of the flexible high density interconnect structure. ### Claim 18 (depends on 1) The microwave system recited in claim 1 wherein: two sequential ones of said modules are disposed back-to-back relation. ### Claim 19 (depends on 18) The microwave system recited in claim 18 wherein: said back-to-back modules are disposed in back-to-back contact. ### Claim 20 (depends on 1) The microwave system recited in claim 1 wherein: said modules are electrically connected in series. ### Claim 21 (depends on 1) The microwave system recited in claim 1 wherein: said modules are electrically connected in parallel. ### Claim 22 (depends on 1) The microwave system recited in claim 1 wherein: said system includes a heat spreading member; and a first one of said modules is disposed in thermal contact with said heat spreading member. ### Claim 23 A microwave system comprising: a plurality of distinct microwave electronic modules with respective electrical contacts thereon; a flexible high density interconnect structure interconnecting said microwave electronic modules, said flexible high density interconnect structure including a dielectric layer having a side which is bonded to at least two of said microwave electronic modules and including flexible conductors on an opposite side of said dielectric layer supported by said dielectric layer and ohmically connected to said respective electrical contacts of said microwave electronic modules through via holes in said dielectric layer; said microwave electronic modules being disposed in a multi-tier stack by having said flexible high density interconnect structure being bent between adjacent tiers; a support mandrel having a curved surface; and a portion of said flexible high density interconnect structure being disposed in contact with said curved surface where said flexible high density interconnect structure is bent between two adjacent ones of said modules. ### Claim 24 A method of assembling a microwave system comprising: providing a plurality of components; arranging said components in groups on a support structure, each of said groups comprising the components of a different microwave electronic module; physically and electrically interconnecting said components with a high density interconnect structure including a dielectric layer having a side which is bonded to at least two of said microwave electronic modules and including flexible conductors on an opposite side of said dielectric layer supported by said dielectric layer and ohmically connected to said respective electrical contacts of said microwave electronic modules through via holes in said dielectric layer; rendering a portion of said high density interconnect structure disposed between two adjacent ones of said microwave electronic modules flexible; and bending said flexible portion of said high density interconnect structure to place said two adjacent ones of said microwave electronic modules in a stack. ### Claim 25 (depends on 24) The method recited in claim 24 wherein the step of bending comprises: providing a support mandrel; and bending said flexible portion of said high density interconnect structure along a curved surface of the support mandrel. ### Claim 26 (depends on 24) The method recited in claim 24 wherein the step of physically and electrically interconnecting said components includes: bonding such components to one side of the high density interconnect structure; and which method further comprises the step of: bonding a support member to the side of said high density interconnect structure opposite said components.