# US 5,345,038 A · Multi-layer ceramic packages

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 5,345,038 A
- Document ID: US5345038A
- Status: Granted
- Kind: A
- Application number: 07/739,599
- Filed: 1991-07-29
- Granted: 1994-09-06
- Earliest claimed: 1991-07-29
- Assignees: Kyocera America, Inc.
- Inventors: Nobuaki Miyauchi; Takatoshi Irie
- Web page: https://patentgrep.com/patent/US5345038A

## CPC

- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- Y10T 29/42: Piezoelectric device making
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method for making multi-layer ceramic packages. The method provides for attaching contact pins to a ceramic substrate after the application of an intermediate metal layer and an outer metal layer. This eliminates plating the contact pins with an intermediate metal layer and an outer metal layer, thereby saving material and process time.

## Claims

### Claim 1

A multi-layer ceramic package having a ceramic substrate, metallic wire bonding areas, die attach area, and external bonding pads, including:
(a) an intermediate metal layer covering the wire bonding areas, die attach area, and external bonding pads;
(b) an outer metal layer covering the intermediate metal layer on the wire bonding areas, die attach area, and external bonding pads; and
(c) contact pins coupled to the outer metal layer covering the intermediate metal layer on the external bonding pads on the ceramic substrate.

### Claim 2

A multi-layer package including:
(a) a ceramic substrate metallic wire bonding areas, die attached area, and external bonding pads;
(b) an intermediate metal layer covering the wire bonding areas, die attach area, and external bonding pads;
(c) an outer metal layer covering the intermediate metal layer on the wire bonding areas, die attach area, and external bonding pads;
(d) contact pins coupled to the outer metal layer covering the intermediate metal layer on the external bonding pads on the ceramic substrate.

### Claim 3 (depends on 2)

The invention of claim 2, wherein the metallized areas and pads comprise tungsten.

### Claim 4 (depends on 1, 2)

The invention of claim 1 or 2, wherein the intermediate metal layer comprises nickel.

### Claim 5 (depends on 1, 2)

The invention of claim 1 or 2, wherein the intermediate layer covering the wire bonding areas, die attach area, and external bonding pads is plated to the wire bonding areas, die attached area, and external bonding pads.

### Claim 6 (depends on 5)

The invention of claim 5, wherein a metallic compound containing the intermediate metal layer is printed over the plated intermediate metal layer, and the printed compound is reduced to substantially the intermediate metal.

### Claim 7 (depends on 1, 2)

The invention of claim 1 or 2, wherein the intermediate layer covering the wire bonding areas, die attach area, and external bonding pads is a metallic compound containing the intermediate metal layer which is plated to the wire bonding areas, die attached area, and external bonding pads, and reduced to the intermediate metal.

### Claim 8 (depends on 1, 2)

The invention of claim 1 or 2, wherein the outer metal layer comprises an inert metal.

### Claim 9 (depends on 8)

The invention of claim 8, wherein the inert metal is gold.