# US 5,344,899 A · Phenolic resin, method for producing the resin and epoxy resin composition for encapsulation > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,344,899 A - Document ID: US5344899A - Status: Granted - Kind: A - Application number: 08/018,081 - Filed: 1993-02-16 - Granted: 1994-09-06 - Earliest claimed: 1991-03-29 - Assignees: Nippon Oil Co., Ltd. - Inventors: Masami Enomoto; Susumu Kubota; Fumiaki Oshimi; Hitoshi Yuasa; Yutaka Otsuki - Web page: https://patentgrep.com/patent/US5344899A ## CPC - H10W 74/47: comprising organic materials, e.g. plastics or resins - C08G 61/02: Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes - C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins - C08L 65/00: Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain (C08L7/00 - C08L57/00, C08L61/00 take precedence); Compositions of derivatives of such polymers - H01B 3/30: plastics; resins; waxes - H01B 3/40: epoxy resins - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) ## Abstract A phenolic resin is represented by the formula (1) ##STR1## wherein R.sup.1 denotes a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, m denotes an integer of from 0 to 10 and n denotes 0, 1 or 2. A method for producing the phenolic resin involves reacting in the presence of an acid catalyst 3a,4,7,7a-tetrahydroindene and a phenol represented by the formula (2) ##STR2## wherein R.sup.1 denotes a hydrogen atom or an alkyl group having 1 to 4 carbon atoms and n denotes 0, 1 or 2. An epoxy resin composition for encapsulation contains: (a) a curable epoxy resin, (b) the above phenolic resin, (c) a curing promotor, and (d) an inorganic filler. ## Claims ### Claim 1 An epoxy resin composition for encapsulation comprising: (a) a curable epoxy resin, (b) a phenolic resin of the formula (1) ##STR9## wherein R.sup.1 denotes a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, m denotes an integer of from 0 to 10 and n denotes 0, 1 or 2, (c) a curing promotor, and (d) an inorganic filler. ### Claim 2 (depends on 1) An epoxy resin composition for encapsulation as claimed in claim 1 wherein said curable epoxy resin is selected from the group consisting of an epoxy resin synthesized from epichlorohydrin and bisphenol A, an epoxy resin synthesized from epichlorohydrin and a novolak resin, an alicyclic epoxy resin, an epoxy resin with an halogen atom introduced therein, a polyfunctional epoxy resin, and mixtures thereof. ### Claim 3 (depends on 1) An epoxy resin composition for encapsulation as claimed in claim 1 wherein said curing promotor is selected from the group consisting of tertiary phosphines, imidazoles, tertiary amines and mixtures thereof. ### Claim 4 (depends on 3) An epoxy resin composition for encapsulation as claimed in claim 3 wherein said tertiary phosphine is selected from the group consisting of triethyl phosphine, tributyl phosphine, triphenyl phosphine and mixtures thereof. ### Claim 5 (depends on 3) An epoxy resin composition as claimed in claim 3 wherein said tertiary amine is selected from the group consisting of diethyl ethanol amine, dimethyl benzyl amine, 2,4,6-tris(dimethylamino) phenol, 1,8-diazabicyclo[5,4,0]undecene and mixtures thereof. ### Claim 6 (depends on 3) An epoxy resin composition for encapsulation as claimed in claim 3 wherein said imidazole is selected from the group consisting of 2-ethyl-4-methyl imidazole, 2,4-dimethyl imidazole, 2-methyl imidazole, 2-undecyl imidazole, 2-heptadecyl imidazole, 1-vinyl-2-methyl imidazole, 1-propyl-2-methyl imidazole, 2-isopropyl imidazole, 1-cyanoethyl-2-ethyl imidazole, 1-cyanoethyl-2-ethyl-4-methyl imidazole, 1-cyanoethyl-2-undecyl imidazole, 1-cyanoethyl-2-phenyl imidazole, 2-phenyl imidazole, 1-benzyl-2-methyl imidazole, 2-phenyl-4-methyl imidazole, 2-phenyl-4,5-dihydroxymethyl imidazole, 2-phenyl-4-methyl-5-hydroxymethyl imidazole, and mixtures thereof. ### Claim 7 (depends on 1) An epoxy resin composition for encapsulation as claimed in claim 1 wherein said inorganic filler is a silica powder filler. ### Claim 8 (depends on 1) An epoxy resin composition as claimed in claim 1 wherein an amount of the phenolic resin and an amount of the curing promotor to 100 parts by weight of the curable epoxy resin are 40 to 180 parts by weight and 0.01 to 5.0 parts by weight, respectively, and wherein an amount of the inorganic filler is 50 to 90 wt % based on the total weight of the epoxy resin composition for encapsulation. ### Claim 9 (depends on 1) An epoxy resin composition as claimed in claim 1 further comprising an additional phenolic resin. ### Claim 10 (depends on 9) An epoxy resin composition for encapsulation as claimed in claim 9 wherein said additional phenolic resin is selected from the group consisting of a novolak phenolic resin, a brominated novolak phenolic resin, polyvinyl phenol, brominated polyvinyl phenol, tetrabromo bisphenol A and mixtures thereof. ### Claim 11 (depends on 1) An epoxy resin composition as claimed in claim 1 further comprising an additive selected from the group consisting of a silane coupling agent, an inflammation retarder, a colorant, a mold release agent, a low stress additive, and mixtures thereof.