# US 5,344,893 A · Epoxy/amino powder resin adhesive for printed circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,344,893 A - Document ID: US5344893A - Status: Granted - Kind: A - Application number: 07/913,935 - Filed: 1992-07-17 - Granted: 1994-09-06 - Earliest claimed: 1991-07-23 - Assignees: Ibiden Co., Ltd. - Inventors: Motoo Asai; Chie Onishi - Web page: https://patentgrep.com/patent/US5344893A ## CPC - H05K 3/4661: {Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor (other insulating materials H05K3/387)} - C08G 59/18: Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups {; e.g. general methods of curing} - C08G 59/38: together with di-epoxy compounds - C08L 61/20: Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen (with aminophenols C08L61/04) - C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins - C09J 7/10: without carriers - C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins - H01B 3/40: epoxy resins - H05K 3/387: {for electroless plating (H05K3/4661 takes precedence)} - H05K 3/0035: {of blind holes, i.e. having a metal layer at the bottom} - H05K 3/181: {by electroless plating (adhesives therefor H05K3/387)} - H05K 3/184: {using masks} - H05K 3/426: {initial plating of through-holes in substrates without metal} - H05K 3/4644: {by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)} - H05K 2201/0154: Polyimide - H05K 2201/0212: Resin particles - H05K 2203/0143: Using a roller; Specific shape thereof; Providing locally adhesive portions thereon - H05K 2203/066: Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern - H05K 2203/0773: Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler - H05K 2203/0789: Aqueous acid solution, e.g. for cleaning or etching - H05K 2203/0796: Oxidant in aqueous solution, e.g. permanganate - Y10S 428/901: Printed circuit - Y10S 525/934: Powdered coating composition - Y10S 525/935: Matrix admixed with synthetic fiber - Y10T 428/24843: with heat sealable or heat releasable adhesive layer - Y10T 428/24893: including particulate material - Y10T 428/24917: including metal layer - Y10T 428/24926: including ceramic, glass, porcelain or quartz layer - Y10T 442/674: Nonwoven fabric with a preformed polymeric film or sheet - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) - Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract There are disclosed an adhesive obtained by dispersing a cured amino resin fine powder soluble in acid or oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent when being subjected to a curing treatment as well as a printed circuit board using this adhesive and a method of producing the same. The adhesive has excellent properties such as resistance to chemicals, heat resistance, electric properties, hardness and adhesion property owing to the use of the amino resin fine powder. Therefore, the printed circuit board using such an adhesive is not influenced by service circumstance and is high in the connection reliability without forming short circuit between patterns. Furthermore, in the method of producing the printed circuit board, the adhesive is provided in form of a sheet or a prepreg, whereby the printed circuit board can be produced easily and cheaply. ## Claims ### Claim 1 An adhesive for a printed circuit board comprising: an uncured heat-resistant resin matrix which is insoluble in an acid or an oxidizing agent when cured; and a cured fine powder of heat-resistant resin soluble in an acid or an oxidizing agent, said cured fine powder of heat-resistant resin comprising an amino resin dispersed in said uncured heat-resistant resin matrix. ### Claim 2 (depends on 1) The adhesive according to claim 1, wherein said amino resin fine powder is dispersed into said heat-resistant resin matrix in an amount of 10-100 parts by weight per 100 parts by weight as a solid content of said matrix. ### Claim 3 (depends on 1) The adhesive according to claim 1, wherein said amino resin fine powder is selected from at least one of melamine resin, urea resin and guanamine resin. ### Claim 4 (depends on 1) The adhesive according to claim 1, wherein said heat-resistant resin matrix is a thermosetting heat-resistant resin or a photosensitive heat-resistant resin. ### Claim 5 (depends on 1) The adhesive according to claim 1, wherein said heat-resistant resin matrix is an uncured polyfunctional epoxy resin or an uncured difunctional epoxy resin and an imidazole curing agent. ### Claim 6 (depends on 5) The adhesive according to claim 5, wherein said heat-resistant resin matrix is a mixture of a thermosetting heat-resistant resin consisting of 20-100 wt % as a solid content of an uncured polyfunctional epoxy resin and 80-0 wt % of an uncured difunctional epoxy resin and 2-10 wt % as a solid content of an imidazole curing agent. ### Claim 7 (depends on 1) The adhesive according to claim 1, wherein said heat-resistant resin matrix is at least one photosensitive heat-resistant resin selected from uncured polyfunctional epoxy resin, uncured polyfunctional resin containing an acryl group and uncured polyfunctional acrylic resin, or a mixture of the above resin and at least one photosensitive heat-resistant resin selected from difunctional epoxy resin and difunctional acrylic resin. ### Claim 8 (depends on 7) The adhesive according to claim 7, wherein said heat-resistant resin matrix is a mixture of 20-100 wt % as a solid content of at least one photosensitive heat-resistant resin selected from uncured polyfunctional epoxy resin, uncured polyfunctional resin containing an acryl group and uncured polyfunctional acrylic resin and 80-0 wt % of at least one photosensitive heat-resistant resin selected from difunctional epoxy resin and difunctional acrylic resin. ### Claim 9 An adhesive for a printed circuit board comprising: an uncured heat-resistant resin matrix, which is insoluble in an acid or an oxidizing agent when cured, comprising a mixture of a thermosetting heat-resistant resin consisting of 20-100 wt % as a solid content of an uncured polyfunctional epoxy resin, 80-0 wt % of an uncured difunctional epoxy resin and 2-10 wt % as a solid content of an imidazole curing agent; and a cured fine powder of heat-resistant resin soluble in an acid or an oxidizing agent, said cured fine powder of heat-resistant resin comprising an amino resin dispersed in said uncured heat-resistant resin matrix. ### Claim 10 (depends on 9) The adhesive according to claim 9, wherein said amino resin fine powder is dispersed into said heat-resistant resin matrix in an amount of 10-100 parts by weight per 100 parts by weight as a solid content of said matrix. ### Claim 11 (depends on 9) The adhesive according to claim 9, wherein said amino resin fine powder is at least one member selected from the group consisting of melamine resin, urea resin and guanamine resin.