# US 5,344,795 A · Method for encapsulating an integrated circuit using a removable heatsink support block > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,344,795 A - Document ID: US5344795A - Status: Granted - Kind: A - Application number: 07/949,189 - Filed: 1992-09-22 - Granted: 1994-09-06 - Earliest claimed: 1992-09-22 - Assignees: Microelectronics and Computer Technology Corporation - Inventors: Seyed H. Hashemi; Michael A. Olla; Thomas P. Dolbear; Richard D. Nelson - Web page: https://patentgrep.com/patent/US5344795A ## CPC - H10W 74/016: {using moulds} - H10W 40/778: {in encapsulations} - H10W 90/00: Package configurations - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - Y10T 29/49121: Beam lead frame or beam lead device - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A process for making thermosetting or thermoplastic encapsulated integrated circuit having a heat exchanger in which one end of the heat exchanger is encapsulated in the housing adjacent to the integrated circuit and the other end is exposed to the environment beyond the housing portion. The process of making includes molding a heat exchanger into a thermosetting or thermoplastic package utilizing a preformed heat exchanger having a dissolvable or removable material which serves as a seal block during the molding operation. A plurality of thermally conductive heat exchanger elements are provided for providing the desired thermal performance while reducing the thermal stresses in the package. ## Claims ### Claim 1 A method of making an encapsulated integrated circuit chip having a heat exchanger, comprising, providing an integrated circuit structure which includes an integrated circuit chip on a substrate, the chip electrically connected to a plurality of leads extending from the substrate; preforming a removable seal and support block supporting a plurality of spaced thermally conductive heat exchanger elements having first and second ends, said support block engaging and supporting the second ends of the heat exchanger elements while leaving the first ends exposed; inserting the support block in a mold cavity such that the support block is spaced from the integrated circuit structure and the first ends of the heat exchanger elements are positioned adjacent to the integrated circuit structure; molding a non-electrically conductive thermosetting or thermoplastic material to form a housing in the mold cavity enclosing the chip and the first ends of the heat exchanger elements while allowing the second ends of the heat exchanger elements to be exposed to the exterior of the housing; and removing the support block from the second ends of the heat exchanger elements. ### Claim 2 (depends on 1) The method of claim 1 wherein the support block is removed by dissolving the block in a solvent. ### Claim 3 (depends on 1) The method of claim 1 wherein the support block is selected from the group consisting of nylon, polyurethane and styrene. ### Claim 4 (depends on 1) The method of claim 1 wherein the heat exchanger elements are a plurality of spaced parallel fins with their first ends interconnected. ### Claim 5 (depends on 1) The method of claim 1 wherein the heat exchanger elements include a plurality of parallel extending and generally evenly spaced rows of pins supported by the support block. ### Claim 6 (depends on 5) The method of claim 5 wherein the first ends of the pins include an enlarged head for increased heat dissipation. ### Claim 7 (depends on 1) The method of claim 1 wherein the support is a peel-off backing Sheet-releasably secured by adhesive to the second ends of the heat exchanger elements, ### Claim 8 (depends on 1) The method of claim 1 including attaching a heat exchanger extension to the second ends of at least some of the heat exchanger elements. ### Claim 9 (depends on 1) The method of claim 1 wherein the support block seals the second ends from the thermosetting or thermoplastic material during molding and thereby prevents the material from encapsulating the second ends. ### Claim 10 (depends on 1) The method of claim 1 wherein the preforming is by pre-molding. ### Claim 11 (depends on 1) The method of claim 1 wherein the preforming is by pre-casting. ### Claim 12 (depends on 1) The method of claim 1 wherein the heat exchanger elements are selected from the group consisting of aluminum and graphite. ### Claim 13 (depends on 1) The method of claim 1 wherein the heat exchanger elements are a metal. ### Claim 14 (depends on 1) The method of claim 1 wherein the thermosetting or thermoplastic material is selected from the group consisting of epoxy, polyphenylene sulfide, polyetherimide, polyethersulfone, or liquid crystal polymers. ### Claim 15 (depends on 14) The method of claim 14 wherein the epoxy is selected from the group consisting of anhydride epoxy, novolak epoxy and polyimide epoxy. ### Claim 16 (depends on 1) The method of claim 1 wherein the thermosetting or thermoplastic material is a plastic. ### Claim 17 (depends on 1) The method of claim 1 wherein the first ends of the heat exchanger elements are positioned adjacent the integrated circuit chip. ### Claim 18 (depends on 1) The method of claim 1 wherein the first ends of the heat exchanger elements are positioned adjacent a side of the substrate opposite the integrated circuit chip. ### Claim 19 (depends on 1) The method of claim 1 wherein the first ends of the heat exchanger elements are spaced from the integrated circuit structure. ### Claim 20 (depends on 1) The method of claim 1 wherein the first ends of the heat exchanger elements are in contact with the integrated circuit structure. ### Claim 21 (depends on 1) The method of claim 1 wherein the second ends of the heat exchanger elements are inserted within the support block before molding occurs. ### Claim 22 (depends on 1) The method of claim 1 wherein the second ends of the heat exchanger elements extend from the exterior of the housing. ### Claim 23 (depends on 1) The method of claim 1 wherein the heat exchanger elements are electrically isolated from the integrated circuit chip. ### Claim 24 (depends on 1) The method of claim 1 wherein portions of the housing are disposed between the integrated circuit structure and the heat exchanger elements. ### Claim 25 (depends on 1) The method of claim 1 wherein portions of the housing are disposed between the heat exchanger elements. ### Claim 26 (depends on 1) The method of claim 1 wherein the heat exchanger elements are selected from the group consisting of aluminum and graphite. ### Claim 27 (depends on 1) The method of claim 1 wherein the heat exchanger elements are a metal. ### Claim 28 (depends on 1) The method of claim 1 wherein the heat exchanger elements are attached to the integrated circuit structure before molding occurs. ### Claim 29 (depends on 1) The method of claim 1 wherein the heat exchanger elements are not attached to the integrated structure before molding occurs. ### Claim 30 (depends on 1) The method of claim 1 wherein the heat exchanger elements are attached to the integrated circuit structure solely by the housing. ### Claim 31 (depends on 1) The method of claim 1 wherein the housing extends beyond all surfaces of the integrated circuit structure. ### Claim 32 (depends on 1) The method of claim 1 including allowing the leads to sealably extend through the housing.