# US 5,344,607 A · Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium

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- Number: US 5,344,607 A
- Document ID: US5344607A
- Status: Granted
- Kind: A
- Application number: 08/078,677
- Filed: 1993-06-16
- Granted: 1994-09-06
- Earliest claimed: 1993-06-16
- Assignees: International Business Machines Corporation
- Inventors: Stephen G. Gonya; James K. Lake; Randy C. Long; Roger N. Wild
- Web page: https://patentgrep.com/patent/US5344607A

## CPC

- B23K 35/262: {Sn as the principal constituent}
- C22C 13/00: Alloys based on tin
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- C22C: ALLOYS (treatment of alloys C21D, C22F)

## Abstract

Disclosed is a high solidus temperature, high service temperature, high strength ternary solder alloy. The components of the alloy are a major portion of Sn and lesser portions of Bi, and In.

## Claims

### Claim 1

A high solidus temperature, high service temperature, high strength ternary solder alloy consisting essentially of about 90 weight percent Sn, about 2 weight percent Bi, and about 8 weight percent In.