# US 5,344,600 A · Method for encapsulating semiconductor devices with package bodies

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- Number: US 5,344,600 A
- Document ID: US5344600A
- Status: Granted
- Kind: A
- Application number: 07/931,459
- Filed: 1992-08-21
- Granted: 1994-09-06
- Earliest claimed: 1989-06-07
- Assignees: Motorola, Inc.
- Inventors: Michael B. McShane; Alan H. Woosley; Francis Primeaux
- Web page: https://patentgrep.com/patent/US5344600A

## CPC

- H10W 74/016: {using moulds}
- B29C 45/14655: {connected to or mounted on a carrier, e.g. lead frame}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)

## Abstract

A method of encapsulating a semiconductor device permits use of the same mold for various package types. In one form, a mold (34 and 36) has a first cavity (50) in which a first insert (52 and 53) is positioned, the first insert defining a length and a width of a package body which is to be formed in the mold. The first insert in the first cavity also defines a second cavity (54) in which a second insert (56 and 57) is positioned, the second insert defining a thickness of the package body. Plastic is inserted into the mold to form the package body. To form other package types, one or more inserts are replaced instead of using a different mold. In another embodiment, the inserts are adjustable. For example, rather than having to change inserts to form a package with a different thickness, the inserts are adjusted by, for instance, a screw mechanism (66) within the mold or by the addition or removal of shims (60).

## Claims

### Claim 1

A method for encapsulating semiconductor devices, each device including a package body, the method comprising the steps of:
providing a mold having at least one mold platen, the mold platen having a first cavity formed therein;
providing a first insert in the first cavity which defines a width and a length of a first package body, the first insert also defining a second cavity;
providing a second insert in the second cavity and within the first insert which defines a thickness of the first package body, the second insert having an adjustable position within the first insert;
providing a lead frame;
attaching a semiconductor die to the lead frame;
inserting the lead frame with the semiconductor die attached thereto into the mold;
filling an encapsulant into the mold including the second cavity in the second insert to form the first package body which encapsulates the semiconductor die, while keeping the first and second inserts stationary;
removing the lead frame, the semiconductor die, and the first package body from the mold; and
adjusting the second insert within the first insert such that the second insert defines a thickness of a second package body which is different than the thickness of the first package body, wherein the second insert is adjusted while the first insert is held stationary;
wherein the mold is provided with means to adjust the position of the second insert within the second cavity, and wherein the means to adjust comprises at least one shim within the second cavity.

### Claim 2

A method for encapsulating semiconductor devices, each device including a package body and a molded carrier ring surrounding each package body, the method comprising the steps of:
providing a mold having at least one mold platen, the mold platen having a first cavity for defining a carrier ring shape and having a second cavity for accepting a first insert of predetermined dimensions, the first insert defining one of a plurality of user selectable package body widths and lengths and defining a third cavity within the second cavity for accepting a second insert of predetermined dimensions, the second insert defining a fourth cavity which determines a first one of a plurality of user selectable package body thicknesses and having an adjustable position within the third cavity to permit variation of the package body thickness;
providing one or more shims which are positioned in the third cavity, the one or more shims determining the position of the second insert within the third cavity;
providing a lead frame;
attaching a semiconductor die to the lead frame;
inserting the lead frame with the semiconductor die attached thereto into the mold;
filling the fourth cavity formed by the second insert with plastic to form a package body which encapsulates the semiconductor die while keeping the first and second inserts stationary;
filling the first cavity in the mold with plastic to form a molded carrier ring which surrounds the package body;
removing the lead frame, the semiconductor die, and the package body from the mold; and
adjusting the second insert within the first insert such that the second insert defines a second one of the plurality of user selectable package body thickness which is different than the first one of the plurality of user selectable package body thicknesses, wherein the second insert is adjusted while the first insert is held stationary.