# US 5,344,343 A · Solder-bearing lead > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,344,343 A - Document ID: US5344343A - Status: Granted - Kind: A - Application number: 07/927,415 - Filed: 1992-09-21 - Granted: 1994-09-06 - Earliest claimed: 1990-04-13 - Assignees: North American Specialties Corporation - Inventors: Jack Seidler - Web page: https://patentgrep.com/patent/US5344343A ## CPC - H01R 12/57: surface mounting terminals - H05K 3/3405: {Edge mounted components, e.g. terminals} - H01R 4/02: Soldered or welded connections {(H01R4/625, H01R4/723, H01R12/59 take precedence)} - H05K 3/341: Surface mounted components - H05K 3/3465: Application of solder - H05K 3/403: {Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof (H05K3/4092 takes precedence)} - H05K 2201/10386: Clip leads; Terminals gripping the edge of a substrate - H05K 2201/10984: Component carrying a connection agent, e.g. solder, adhesive - Y10T 29/49155: Manufacturing circuit on or in base - Y10T 29/49204: Contact or terminal manufacturing - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A solder-bearing lead adapted to be soldered to a conductive surface comprising an elongated body portion having a solder- bearing portion, a terminal portion, and a middle portion disposed between said solder-bearing portion and said terminal portion. The solder-bearing portion carries a solder mass either on a pair of projections extending from one edge of said body portion and forming a gap therebetween dimensioned to receive a solder mass, or on the opposed faces of said solderbearing portion. A region of the middle portion is twisted so that the solder-bearing portion lies in a plane substantially perpendicular to the plane of the terminal portion. The solder-bearing lead can be used as an edge clip for mounting a substrate such as a printed circuit board, or as a surfacemounted lead for a substrate. ## Claims ### Claim 1 A lead for soldering to a conductive surface comprising: a elongated body including a first portion adapted to retain solder, a substantially flat terminal portion, and a middle portion disposed between said first portion and said terminal portion, said first portion including at least one solder mass affixed thereto, a region of said body being twisted about a longitudinal axis at said middle portion so that said first portion lies in a plane substantially perpendicular to the plane of said terminal portion. ### Claim 2 (depends on 1) A lead as in claim 1 wherein said first portion includes a pair of coplanar projections extending from a first edge of said body and forming a gap there between dimensioned to receive a solder mass, and said solder mass being in said gap. ### Claim 3 (depends on 1) A lead as in claim 1 wherein said solder mass is secured to at least one side of said first portion. ### Claim 4 (depends on 1) A lead as in claim 1 wherein said first portion includes at least one coplanar projection extending from a first edge, and said solder mass is positioned on a face of said projection and on an adjoining area of said first portion. ### Claim 5 (depends on 1) A lead as in claim 1 wherein said solder mass is formed as a solder layer on a face of the first lead body portion. ### Claim 6 (depends on 5) A lead as in claim 5 having a solder mass on each of two opposed faces of said first lead body portion. ### Claim 7 (depends on 1) A lead as in claim 1 wherein said first lead body portion includes at least one coplanar projection from an edge of said body portion, and said solder mass is formed as a layer on both faces of said projection and said first body portion. ### Claim 8 A method of forming a series of leads for soldering to contact pads of a substrate, comprising the steps of providing a continous conductive strip having a solder stripe thereon, forming from said strip by stamping a succession of flat elongated lead blanks, each lead blank having first and second portions along its length, one of said portions having said solder stripe thereon, and twisting one of said portions of each said lead blank relative to the other so that said one portion lies in a plane substantially perpendicular to the plane of the other portion of said lead blank. ### Claim 9 A method of forming a series of leads for soldering to contact pads on a substrate comprising the steps of providing a continuous conductive strip, stamping said strip progressively to form a succession of flat elongated lead blanks, each lead blank having first and second portions, twisting one of said portions of each said lead blank relative to the other so that said one portion is in a plane substantially perpendicular to the plane of the other portion of said lead blank, and applying solder to said first portion. ### Claim 10 (depends on 9) A method as in claim 9 wherein said solder is affixed to said first portion before said twisting. ### Claim 11 (depends on 9) A method as in claim 9 wherein said solder is affixed to said first portion after said twisting. ### Claim 12 (depends on 10) A method as in claim 10 wherein said solder is affixed to said strip before forming said lead blanks. ### Claim 13 (depends on 9) A method as in claim 9 also including forming on each lead blank at least one projection extending laterally from a first edge of said one portion and applying said solder adjacent said projection. ### Claim 14 (depends on 13) A method as in claim 13 including forming a pair of projections extending laterally from an edge of said first portion to form a gap between said projections, and affixing solder to said lead in said gap. ### Claim 15 (depends on 9) A method as in claim 9 wherein said solder-applying step includes the step of applying a solder stripe along said conductive strip before said stamping step. ### Claim 16 A lead formed from a blank which comprises an elongated body having first and second edges and also having a solderable portion and a substantially flat terminal portion, the transverse dimension of said solderable portion parallel to the plane of said flat portion being less than the width of said flat portion, said solderable portion lying substantially along a longitudinal axis of said body, said solderable portion and said terminal portion being substantially in alignment and in planes substantially perpendicular to one another. ### Claim 17 (depends on 16) A lead as recited in claim 16, wherein the width of said terminal portion is substantially 0.005 to 0.006 inch and the width of said solderable portion is substantially 0.007 to 0.008 inch, said solderable portion being in a plane substantially perpendicular to said flat terminal portion with the thickness of said solderable portion being substantially in the direction of the terminal portion width. ### Claim 18 A lead comprising an elongated body having first and second edges and also having a solderable portion carrying a solder mass and having a substantially flat terminal portion, the width of said solderable portion being less than the width of said flat portion, said solderable portion lying substantially along a longitudinal axis of said body portion, said body further comprising at least one projection extending from an edge of said solderable portion and adapted to hold a solder mass. ### Claim 19 (depends on 18) A lead as recited in claim 18, comprising a pair of projections extending from an edge of said solderable portion and having said gap therebetween. ### Claim 20 A method of forming a solderable lead arrangement comprising the steps of: providing an elongated flat strip of conductive material having thereon a band of solder extending along its length, forming therefrom a series of parallel transverse leads each joined at one end to a carrier strip, each of said leads having an elongated body and a lateral projection on one edge of said lead body at the location of said solder band, and causing each of said projections to be at an angle to portion of its respective body, whereby said projections may be placed with an edge in direct metal-to-metal contact with substrate conductive areas and soldered thereto without shifting due to melting of solder. ### Claim 21 (depends on 20) A method as in claim 20 including providing said solder on both sides of each said projection. ### Claim 22 (depends on 20) A method as in claim 20 further including: forming at least certain of said leads in the form of a U-shaped clip, with said projections formed on facing arms of said clip and extending toward one another, said projections being spaced by a gap correlated to the thickness of a substrate to be inserted in and resiliently retained by said clip. ### Claim 23 The method of soldering a lead to a surface conductive area of a substrate, comprising: forming a conductive lead having a flat body portion and a flat projection at one edge of said body portion, said body portion having a layer of solder on one face of said projection, and no solder on another face of said projection, placing said body portion with said non-solder bearing face of said projection in metal-to-metal contact with and with said projection substantially perpendicular to said conductive area, and applying heat to solder said body to said area. ### Claim 24 A solderable lead for connection to a device having a conductive area, comprising: an elongated body of electrically conductive sheet material, said body having a contacting non-solder-bearing portion with a surface for contacting said conductive area of said device with a metal-to-metal contact; said body having another portion for contacting said conductive area with a surface contiguous to said contacting portion; a layer of solder on said latter contiguous surface and extending immediately adjacent to said contacting portion such that, upon heating, said layer of solder will liquefy and migrate to form a soldered joint between said contacting portion and said conductive area when they are juxtaposed. ### Claim 25 (depends on 24) A solderable lead according to claim 24, wherein said solder layer covers a surface of said body angularly disposed to said non-solder-bearing contacting portion. ### Claim 26 (depends on 24) An assemblage of leads, each as in claim 24, each lead being integral with a carrier strip and said leads being spaced along said carrier strip. ### Claim 27 A solderable lead for connection to a device having a conductive area, comprising: an elongated body of electrically conductive sheet material, said body having a contacting portion with a surface for contacting said conductive area of said device with a metal-to-metal contact; said body having another portion with a surface contiguous to said contacting portion; a layer of solder on said latter contiguous surface and extending immediately adjacent to said contacting portion such that upon heating, said layer of solder will liquefy and migrate to form a soldered joint between said contacting portion and said conductive area, said contiguous portion being formed by a projection which is at an angle to a portion of said body and said contacting portion being constituted by an edge of said projection. ### Claim 28 (depends on 27) A lead as in claim 27 wherein said solder also overlies said body adjacent said projection. ### Claim 29 The method of producing a lead soldered to a conductive pad of a substrate comprising the steps of: providing a lead having an elongated body of electrically conductive sheet material, said body having a contacting portion with a non-solder-bearing surface for contacting said conductive area of said device with a metal-to-metal contact; said body having another portion for not contacting said conductive area, with a surface contigous to said contacting portion, and also having a layer of solder on said latter contiguous surface and extending immediately adjacent to said contacting portion; placing said lead contacting portion in direct metal-to-metal contact with said substrate conductive area with no solder therebetween; heating said lead to melt said solder layer and to cause said solder to flow into the region adjacent the juncture of said contacting portion and said conductive area; whereby on cooling, said conductive pad is soldered to said contacting portion. ### Claim 30 A surface-mounting lead for soldering to a conductive pad on the surface of a substrate comprising: an elongated flat body including a first portion having at least one solder element thereon, and a flat terminal portion, said first body portion lying in a plane substantially perpendicular to the plane of said terminal portion, so that an edge of said first body portion is substantially co-planar with said terminal portion. ### Claim 31 (depends on 30) A lead as in claim 30 wherein said first body portion includes a pair of co-planar projections extending from a first edge of said body, said solder element being on each said projection. ### Claim 32 (depends on 30) A lead as in claim 30 wherein at least one face of said first body portion has a solder layer thereon. ### Claim 33 (depends on 30) A lead as in claim 30 wherein said first body portion includes at least one projection extending from a first edge of said body, and said solder element is positioned on a face of said projection and also on an adjoining area of said first body portion. ### Claim 34 (depends on 30) A lead as in claim 30 wherein said solder element is formed as a solder layer on a face of the first lead body portion. ### Claim 35 (depends on 30) A lead as in claim 30 having a solder element on each of two opposed faces of said first body portion. ### Claim 36 (depends on 30) A lead as in claim 30 wherein said first body portion includes at least one projection from an edge of said body portion, and said solder element is a layer on both faces of said projection and on said first body portion. ### Claim 37 A lead adapted to be soldered to a conductive surface area, comprising: an elongated body having first and second side edges, and including a first body portion adapted to retain solder, a terminal portion, and a middle portion disposed between said first body portion and said terminal portion, said first body portion including a pair of co-planar projections extending from said first edge of said body and forming a gap therebetween dimensioned to receive solder; a region of said body being oriented to cause said projections to lie in a plane substantially perpendicular to the plane of said terminal portion. ### Claim 38 (depends on 37) A lead as recited in claim 37, wherein said first body portion is at substantially a right angle to said terminal portion for applying to a substrate. ### Claim 39 (depends on 37) A lead as recited in claim 37, further comprising a second pair of projections extending from said first edge of said first body portion, said second pair of projections forming a second gap therebetween. ### Claim 40 (depends on 39) A lead as recited in claim 39, wherein said first body portion is bent so that said gaps of each of said pairs of projections face one another to form a channel therebetween to engage a substrate. ### Claim 41 A method of forming a series of leads for soldering to a corresponding series of contact pads on a substrate comprising the steps of providing a continuous strip conductive material, stamping said strip progressively to form a succession of flat elongated lead blanks, each lead blank having first and second portions, changing the orientation of one of said portions of each said lead blank relative to another portion so that said one portion is in a plane substantially perpendicular to the plane of the other portion of said lead blank, and applying solder to said one portion. ### Claim 42 (depends on 41) A method as in claim 41, wherein said solder-applying step includes the step of applying a solder strip along said conductive strip before said stamping step. ### Claim 43 (depends on 41) A method as in claim 41 wherein the orientation of said one portion is changed by twisting and said solder is affixed to said first portion before said twisting. ### Claim 44 (depends on 41) A method as in claim 41 wherein said solder is affixed to said strip before forming said lead blanks. ### Claim 45 (depends on 41) A method as in claim 41 also including forming on each lead blank at least one projection extending laterally from a first edge of said one blank portion and applying said solder on said projection. ### Claim 46 (depends on 41) A method as in claim 41, wherein said orientation changing is performed by twisting said one blank portion substantially 90.degree. relative to said other blank portion. ### Claim 47 A blank for leads for connection to electrical apparatus, comprising an elongated strip of electrically conductive material, one longitudinally extending portion of said strip constituting a carrier portion, said strip also including a series of parallel supporting strips integral with and extending laterally from said carrier portion, and a lead body parallel to and between each pair of consecutive supporting strips, each lead body being supported from the ends of its adjacent supporting strips by severable joins so that one portion of said lead body is between said supporting strips and another portion is not. ### Claim 48 (depends on 47) A blank as in claim 47, wherein said other portion of each said lead body is twisted about its longitudinal axis with respect to said one lead body portion into a plane substantially perpendicular to that of said one portion of said lead body. ### Claim 49 (depends on 48) A blank as in claim 48, wherein said twisted body portion has a configuration thereon adapted to retain a solder.