# US 5,344,304 A · Mold for molding of substrate for information recording medium > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,344,304 A - Document ID: US5344304A - Status: Granted - Kind: A - Application number: 07/941,172 - Filed: 1992-09-04 - Granted: 1994-09-06 - Earliest claimed: 1987-09-05 - Assignees: Canon Kabushiki Kaisha - Inventors: Tomoyuki Tamura; Mizuho Hiraoka; Hiroyuki Imataki; Tetsuya Sato - Web page: https://patentgrep.com/patent/US5344304A ## CPC - B29C 33/3842: {Manufacturing moulds, e.g. shaping the mould surface by machining} - B29C 33/306: {Exchangeable mould parts, e.g. cassette moulds, mould inserts (moulds with exchangeable mould parts for injection moulding B29C45/2673; mounting of exchangeable mould inserts for injection moulding B29C45/2675)} - B29C 39/026: {characterised by the shape of the surface} - B29C 39/26: Moulds or cores - B29D 17/005: {Producing optically read record carriers, e.g. optical discs} - B29C 2035/0827: {using UV radiation} - B29L 2017/003: {Records or discs} - B29L 2017/005: {CD''s, DVD''s} - G11B 7/263: {Preparing and using a stamper, e.g. pressing or injection molding substrates (production of optical record carriers, e.g. optical discs B29D17/005)} - Y10S 425/81: Sound record - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - B29D: PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE (making granules B29B9/00; making preforms B29B11/00) - B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES - G11B: INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER (recording measured values in a way that does not require playback through a transducer G01D9/00; recording or playback apparatus using mechanically marked tape, e.g. punched paper tape, or using unit records, e.g. punched or magnetically marked cards G06K; transferring data from one type of record carrier to another G06K1/18; circuits for coupling output of reproducer to radio receiver H04B1/20; gramophone pick-ups or like acoustic electromechanical transducers or circuits therefor H04R) - Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ## Abstract A mold for molding a plurality of substrates for an information recording medium includes a fixing member, a plurality of units fixed to the fixing member, and a molding cavity. Each of the units has a preformat pattern with a surface corresponding to information recording medium formed on its surface, and the molding cavity is disposed opposite to the units so that the preformat patterns face the molding cavity. ## Claims ### Claim 1 A mold for molding a plurality of substrates for an information recording medium, said mold comprising: a fixing member; a plurality of units fixed to said fixing member, each of the units has on its surface a preformat pattern with a surface corresponding to the information recording medium; and a molding cavity disposed opposite to said units so that said preformat patterns face said molding cavity. ### Claim 2 (depends on 1) A mold for molding substrates for an information recording medium according to claim 1, wherein each of said units is detachable. ### Claim 3 (depends on 1) A mold for molding substrates for an information recording medium according to claim 1, further comprising a backing member to which said units are adhered. ### Claim 4 (depends on 1) A mold for molding substrates for an information recording medium according to claim 1, wherein said fixing member is a backing member. ### Claim 5 (depends on 4) A mold for molding substrates for an information recording medium according to claim 4, wherein said units are fixed onto said fixing member with a UV-ray curable type adhesive. ### Claim 6 (depends on 5) A mold for molding substrates for an information recording medium according to claim 5, wherein a plurality of said units are arranged on said fixing member when said UV-ray curable type adhesive is in an uncured state and then fixed by curing of the UV-ray curable type adhesive. ### Claim 7 (depends on 1) A mold for molding substrates for an information recording medium according to claim 1, having voids between said units. ### Claim 8 (depends on 7) A mold for molding substrates for an information recording medium according to claim 7, wherein said voids are 10 mm or less. ### Claim 9 (depends on 8) A mold for molding of a substrate for information recording medium according to claim 8, wherein said voids are 2 to 5 mm. ### Claim 10 (depends on 7) A mold for molding substrates an information recording medium according to claim 7, further comprising a sealing material sealing said voids between said units. ### Claim 11 (depends on 10) A mold for molding substrates for an information recording medium according to claim 10, wherein a mold release treatment is applied on said sealing material. ### Claim 12 (depends on 10) A mold for molding substrates for an information recording medium according to claim 10, wherein said sealing material is not corroded by the resin for cast molding. ### Claim 13 (depends on 12) A mold for molding substrates for an information recording medium according to claim 12, wherein said sealing material is a low melting glass. ### Claim 14 (depends on 13) A mold for molding substrates for an information recording medium according to claim 13, wherein the difference between the thermal expansion ratio of said low melting glass and the thermal expansion ratio of said units is 30.times.10.sup.-7 /.degree.C. or less ### Claim 15 (depends on 13) A mold for molding substrates for an information recording medium according to claim 13, wherein the difference between the thermal expansion ratio of said low melting glass and the thermal expansion ratio of said units is 20.times.10.sup.-7 /.degree.C. or less. ### Claim 16 (depends on 12) A mold for molding substrates for an information recording medium according to claim 12, wherein said sealing material is a low melting metal. ### Claim 17 (depends on 16) A mold for molding substrates for an information recording medium according to claim 16, wherein the melting point of said low melting metal is 300.degree. C. or lower. ### Claim 18 (depends on 12) A mold for molding substrates for an information recording medium according to claim 12, wherein said sealing material is a resin. ### Claim 19 (depends on 18) A mold for molding substrates for an information recording medium according to claim 18, wherein said resin is a thermosetting resin. ### Claim 20 (depends on 18) A mold for molding substrates for an information recording medium according to claim 18, wherein said resin is an adhesive. ### Claim 21 (depends on 20) A mold for molding substrates for an information recording medium according to claim 20, wherein said adhesive is an epoxy acrylate type adhesive. ### Claim 22 (depends on 18) A mold for molding substrates for an information recording medium according to claim 18, wherein said resin has a Young's modulus of 2 to 300 kg/cm.sup.2. ### Claim 23 (depends on 18) A mold for molding substrates for an information recording medium according to claim 18, wherein said resin has a Young's modulus of 2 to 80 kg/cm.sup.2. ### Claim 24 (depends on 10) A mold for molding substrates for an information recording medium according to claim 10, wherein said sealing material is a material having a contact angle as measured with water of 100.degree. or more. ### Claim 25 (depends on 10) A mold for molding substrates for an information recording medium according to claim 10, wherein said sealing material protrudes from a surface of said units. ### Claim 26 (depends on 1) A mold for molding substrates for an information recording medium according to claim 1, wherein each said unit has a plurality of preformat patterns on its surface. ### Claim 27 (depends on 1) A mold for molding substrates for an information recording medium according to claim 1, wherein said mold is for cast molding. ### Claim 28 A mold for molding a substrate for an information recording medium, said mold comprising: a bonding member; a plurality of units bonded to said bonding member, each unit having on its surface a preformat pattern corresponding to the information recording medium and with a void formed between each unit, and a molding cavity disposed opposite to said units so that said preformat patterns face said molding cavity, wherein said bonding member is a sealing member for sealing the voids between said units. ### Claim 29 (depends on 28) A mold according to claim 28, further comprising a backing member to which said units are adhered. ### Claim 30 (depends on 28) A mold according to claim 28, wherein the void is 10 mm or less. ### Claim 31 (depends on 30) A mold according to claim 30, wherein the void is 2 to 5 mm. ### Claim 32 (depends on 28) A mold according to claim 28, wherein a mold release treatment is applied on said bonding member. ### Claim 33 (depends on 28) A mold according to claim 28, wherein said bonding member is not corroded by the resin for cast molding. ### Claim 34 (depends on 28) A mold according to claim 28, wherein said bonding member is a low melting glass. ### Claim 35 (depends on 34) A mold according to claim 34, wherein the difference between the thermal expansion ratio of said low melting glass and the thermal expansion ratio of said units is 30.times.10.sup.-7 /.degree.C. or less. ### Claim 36 (depends on 34) A mold according to claim 34, wherein the difference between the thermal expansion ratio of said low melting glass and the thermal expansion ratio of said units is 20.times.10.sup.-7 /.degree.C. or less. ### Claim 37 (depends on 28) A mold according to claim 28, wherein said bonding member is a low melting metal. ### Claim 38 (depends on 37) A mold according to claim 37, wherein the melting point of said low melting metal is 300.degree. C. or lower. ### Claim 39 (depends on 28) A mold according to claim 28, wherein said bonding member is a resin adhesive. ### Claim 40 (depends on 39) A mold according to claim 39, wherein said adhesive is an epoxy acrylate-type adhesive. ### Claim 41 (depends on 39) A mold according to claim 39, wherein said adhesive has a Young's modulus of 2 to 300 kg/cm.sup.2. ### Claim 42 (depends on 41) A mold according to claim 41, wherein said adhesive has a Young's modulus of 2 to 80 kg/cm.sup.2. ### Claim 43 (depends on 28) A mold according to claim 28, wherein said bonding member has a surface property of a contact angle as measured with water of 100.degree. or more. ### Claim 44 (depends on 28) A mold according to claim 28, wherein said bonding member protrudes from a surface of said units. ### Claim 45 (depends on 28) A mold according to claim 28, wherein each said unit has a plurality of preformat patterns on its surface. ### Claim 46 (depends on 28) A mold according to claim 28, wherein said mold is for cast molding. ### Claim 47 A mold for cast molding a plurality of substrates for an information recording medium, said mold comprising: a fixing member; and a plurality of units fixed to said fixing member and having a void between each unit, with each of the units having on its surface a preformat pattern corresponding to the information recording medium; and a sealing material for sealing the voids between said units. ### Claim 48 (depends on 47) A mold according to claim 47, wherein each of said units is detachable. ### Claim 49 (depends on 47) A mold according to claim 47, further comprising a backing member to which said units are adhered. ### Claim 50 (depends on 47) A mold according to claim 47, wherein said fixing member is a backing member. ### Claim 51 (depends on 50) A mold according to claim 50, wherein said units are fixed onto said fixing member with a UV-ray curable-type adhesive. ### Claim 52 (depends on 51) A mold according to claim 51, wherein a plurality of said units are arranged on the fixing member when said UV-ray curable-type adhesive is in an under uncured state and then fixed by curing of the UV-ray curable-type adhesive. ### Claim 53 (depends on 47) A mold according to claim 47, wherein the void is 10 mm or less. ### Claim 54 (depends on 53) A mold according to claim 53, wherein the void is 2 to 5 mm. ### Claim 55 (depends on 47) A mold according to claim 47, wherein a mold release treatment is applied on said sealing material. ### Claim 56 (depends on 47) A mold according to claim 47, wherein said sealing material is not corroded by the resin for cast molding. ### Claim 57 (depends on 47) A mold according to claim 47, wherein said sealing material is a low melting glass. ### Claim 58 (depends on 57) A mold according to claim 57, wherein the difference between the thermal expansion ratio of said low melting glass and the thermal expansion ratio of said units is 30.times.10.sup.-7 /.degree.C. or less. ### Claim 59 (depends on 58) A mold according to claim 58, wherein the difference between the thermal expansion ratio of said low melting glass and the thermal expansion ratio of said units is 20.times.10.sup.-7 /.degree.C. or less. ### Claim 60 (depends on 47) A mold according to claim 47, wherein said sealing material is a low melting metal. ### Claim 61 (depends on 60) A mold according to claim 60, wherein the melting point of said low melting metal is 300.degree. C. or lower. ### Claim 62 (depends on 47) A mold according to claim 47, wherein said sealing material is a resin. ### Claim 63 (depends on 62) A mold according to claim 62, wherein said resin is a thermosetting resin. ### Claim 64 (depends on 63) A mold according to claim 63, wherein said resin is an adhesive. ### Claim 65 (depends on 64) A mold according to claim 64, wherein said adhesive is an epoxy acrylate-type adhesive. ### Claim 66 (depends on 62) A mold according to claim 62, wherein said resin has a Young's modulus of 2 to 300 kg/cm.sup.2. ### Claim 67 (depends on 66) A mold according to claim 66, wherein said resin has a Young's modulus of 2 to 80 kg/cm.sup.2. ### Claim 68 (depends on 47) A mold according to claim 47, wherein said sealing material has a surface property of a contact angle as measured with water of 100.degree. C. or more. ### Claim 69 (depends on 47) A mold according to claim 47, wherein said sealing material protrudes from a surface of said units. ### Claim 70 (depends on 47) A mold according to claim 47, wherein each of said units has a plurality of the preformat patterns on its surface.