# US 5,343,616 A · Method of making high density self-aligning conductive networks and contact clusters

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- Number: US 5,343,616 A
- Document ID: US5343616A
- Status: Granted
- Kind: A
- Application number: 07/837,357
- Filed: 1992-02-14
- Granted: 1994-09-06
- Earliest claimed: 1992-02-14
- Assignees: Rock Ltd.
- Inventors: Joseph A. Roberts
- Web page: https://patentgrep.com/patent/US5343616A

## CPC

- H05K 7/1451: {with connections between circuit boards or units}
- H01R 31/00: Coupling parts supported only by co-operation with counterpart
- H05K 3/045: {by making a conductive layer having a relief pattern, followed by abrading of the raised portions}
- H05K 3/4614: {the electrical connections between the circuit boards being made during lamination}
- H05K 9/0039: {Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing (printed shielding conductors, ground planes or power planes for reduction of cross-talk or noise in printed circuits H05K1/0218)}
- H05K 1/036: {Multilayers with layers of different types}
- H05K 3/281: {by means of a preformed insulating foil (H05K3/284 takes precedence)}
- H05K 3/328: by welding
- H05K 3/386: {by the use of an organic polymeric bonding layer, e.g. adhesive}
- H05K 3/4647: {by applying an insulating layer around previously made via studs}
- H05K 2201/0195: Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
- H05K 2201/0355: Metal foils
- H05K 2201/0367: Metallic bump or raised conductor not used as solder bump
- H05K 2201/0382: Continuously deformed conductors
- H05K 2201/0715: provided by an outer layer of PCB
- H05K 2203/025: Abrading, e.g. grinding or sand blasting
- H05K 2203/063: of preperforated insulating layer
- Y10T 29/49083: Heater type
- Y10T 29/49155: Manufacturing circuit on or in base
- Y10T 29/49156: with selective destruction of conductive paths
- Y10T 29/49217: by elastic joining
- Y10T 29/49222: forming array of contacts or terminals
- Y10T 29/49906: Metal deforming with nonmetallic bonding
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A conductive network, which can be flexible or rigid, can have self-aligning conductors which connect with corresponding conductors of other networks. The conductive network can be fabricated into densely packed contact clusters for use as electrical interconnectors or circuits. The contact clusters, which can be configured to substantially any shape, are the essential components of high density connector assemblies. The methods and apparatus for making the conductive network and cluster contacts are also described.

## Claims

### Claim 1

A method for manufacturing a conductive network comprising the steps of
forming a planar metallic sheet into a non-planar pattern having
a dielectric material on a first side of said metallic sheet; and
removing raised portions of said metallic sheet from a second side of said metallic sheet to form electrically insulated conductive paths.

### Claim 2 (depends on 1)

The method of claim 1 further comprising the step of adhering a sheet of spring material to said dielectric material.

### Claim 3 (depends on 1)

The method of claim 1 further wherein said removing step comprises the step of grinding said raised portions of said sheet.

### Claim 4 (depends on 1)

The method of claim 1 further wherein said forming step comprises the step of coining said metallic sheet.

### Claim 5 (depends on 1)

The method of claim 1 further wherein said adhering step comprises the step of fusing said flexible dielectric material to said metallic sheet.

### Claim 6 (depends on 1)

The method of claim 1 wherein said planar metallic sheet contains minor inclusions.

### Claim 7 (depends on 1)

The method of claim 1 further comprising the steps of adhering the dielectric material to the first side and simultaneously performing said forming and adhering steps.

### Claim 8

A method for fabricating an interconnection between two conductive materials comprising the steps of:
forming a planar metallic sheet into a non-planar pattern;
adhering a flexible dielectric material to a first side of said metallic sheet;
removing raised portions of said metallic sheet from a second side of said metallic sheet to form electrically insulated conductive paths;
providing at least one window in an insulating layer;
adhering a conductive sheet material to said insulating layer; and
cold pressure fusing a conductive path and said conductive sheet through said insulating layer window.

### Claim 9 (depends on 8)

The method of claim 8 wherein said fusing step further comprises the steps of
developing a stress hardened, adhesive filled force concentrator to one of said conductive sheet and said conductive path; and
laminating an assembled combination of said conductive sheet and said conductive path for cold pressure fusing said sheet through said dielectric window.

### Claim 10 (depends on 8)

The method of claim 8 wherein said conductive sheet is an electrical shielding material.

### Claim 11 (depends on 8)

The method of claim 8 further comprising the step of
providing at least one window in said flexible dielectric material adhered to said first side of said metallic sheet.

### Claim 12 (depends on 8)

The method of claim 8 further comprising the step of simultaneously performing said forming step and said first adhering step.

### Claim 13

A method for manufacturing a conductive network comprising the steps of
forming a planar metallic sheet into a non-planar pattern;
adhering a dielectric material to a first side of said metallic sheet;
removing raised portions of said metallic sheet from a second side of said metallic sheet to form electrically insulated recessed conductive paths; and
blocking at least one of said conductive paths to isolate at least one pad portion of a path for receiving a solder volume.

### Claim 14 (depends on 13)

The method of claim 13 wherein said blocking step comprises the step of
filling portions of said conductive path with a blocking material to define said pad portion.

### Claim 15 (depends on 13)

The method of claim 13 wherein said blocking step comprises the step of
forming said planar sheet, during the forming step, to block at least one lateral extent of said conductive path.

### Claim 16 (depends on 15)

The method of claim 15 further comprising the steps of
providing solder to each pad portion; and
soldering a device to selected conductive paths at said pad portions for electrically connecting said device in a circuit configuration with said network.

### Claim 17

A method for manufacturing a conductive network comprising the steps of
forming a planar metallic sheet into a non-planar pattern;
adhering a dielectric material to a first side of said metallic sheet;
removing raised portions of said metallic sheet from a second side of said metallic sheet to form electrically insulated recessed conductive paths; and
providing at least one of said conductive paths with a solder volume at a portion thereof.

### Claim 18 (depends on 17)

The method of claim 17 further comprising the step of
soldering a device to selected conductive paths at said portions for electrically connecting said device in a circuit configuration with said network.

### Claim 19

A method for manufacturing a conductive network comprising the steps of
forming an electrically conducting material into a non-planar pattern;
adhering a dielectric material to a first side of said material; and
removing raised portions of said conducting material from a second side of said conducting material to form electrically insulated conductive paths.

### Claim 20 (depends on 19)

The method of claim 19 wherein said removing step comprises
removing said material until said conducting material and said dielectric material have a coplanar surface, and said conducting material has a planar configuration.

### Claim 21

A method for manufacturing a supported conductive network comprising the steps of:
a) forming a planar electrically conductive sheet into a non-planar pattern having a dielectric material fast with a first face thereof; and
b) removing portions of the sheet from a second face thereof to form electrically insulated electrically conductive paths supported by the dielectric material.

### Claim 22 (depends on 21)

The method of claim 21 wherein the dielectric material is made fast with the first face of the sheet after the forming step.

### Claim 23 (depends on 21)

The method of claim 21 wherein the forming step forms ridges and troughs on both said faces.

### Claim 24 (depends on 23)

The method of claim 23 comprising adhering the dielectric material to the first face by an adhesive which also serves to fill voids between the dielectric material and the first face.

### Claim 25 (depends on 22)

The method of claim 22 wherein the forming step forms a raised said pattern on the first face only and the portions removed form said paths from said raised pattern.

### Claim 26 (depends on 25)

The method of claim 25 wherein the sheet is one of copper, a laminate comprising a relatively thin copper layer defining the first face and a relatively thick aluminum layer defining the second face, a laminate comprising layers of two different electrically conductive materials, a laminate comprising a relatively thin electrically conductive metal layer defining the first face and a relatively thick dielectric layer defining the second face, a laminate comprising a layer of electrically conductive material defining the first face and a layer of dielectric material defining the second face.

### Claim 27 (depends on 21)

The method of claim 21 wherein the forming step and application of the dielectric material are performed simultaneously.

### Claim 28 (depends on 21)

The method of claim 21 wherein the removing step is a machining operation.

### Claim 29 (depends on 26)

The method of claim 26 wherein the planar sheet is a flexible laminate comprising an electrically conductive layer and a dielectric layer.

### Claim 30 (depends on 29)

The method of claim 29 wherein the forming step forms ridges and troughs on both faces of the laminate.

### Claim 31 (depends on 29)

The method of claim 29 wherein the conductive layer is attached to a flexible said dielectric layer by an adhesive and the adhesive is displaced in the forming step to allow the formation into a non-planar pattern and to fill voids otherwise formed between the layers.

### Claim 32 (depends on 21)

The method of claim 21 comprising the step of making fast a second electrically conductive material to the dielectric material remote from the paths.

### Claim 33 (depends on 32)

The method of claim 32 wherein the electrically conductive material is a spring material.

### Claim 34 (depends on 22)

The method of claim 22 wherein the forming step is achieved by drawing the sheet against a suitably contoured surface and the dielectric material is applied to the sheet while the sheet is so drawn.

### Claim 35

A method for manufacturing a supported conductive network comprising the steps of:
a) providing a flexible laminate having an electrically conductive layer and a dielectric layer, the laminate being sufficiently pliable to be deformed by a partial vacuum to define a non-planar pattern;
b) applying such a partial vacuum to the dielectric layer to draw a first face of the laminate against an appropriately contoured surface forming the laminate into a non-planar pattern; and
c) removing portions of the laminate from a second face thereof to form electrically insulated electrically conductive paths supported by the dielectric material.

### Claim 36 (depends on 35)

The method of claim 35 wherein the laminate is chosen to be sufficiently resilient to return to a planar form when released from the contoured surface subsequent to removal of the portions.

### Claim 37 (depends on 35)

The method of claim 35, comprising the further step of pressing the deformed laminate into a planar form after the portions are removed and after release of the laminate from the contoured surface.

### Claim 38 (depends on 37)

The method of claim 37 wherein the raised portions are removed while the laminate is held against the contoured surface by the partial vacuum.

### Claim 39

A method for manufacturing a supported conductive network comprising the steps of:
a) providing a planar electrically conductive sheet
b) forming a non-planar pattern in said planar electrically conductive sheet, and providing a dielectric material fast with a first face of said sheet;
c) removing portions of the sheet from a second face thereof to form electrically insulated electrically conductive recessed paths supported by the dielectric material; and
d) blocking at least one of said recessed conductive paths to isolate at least one pad portion of a path for receiving a solder volume.

### Claim 40

A method for manufacturing a supported conductive network comprising the steps of:
a) providing a planar electrically conductive sheet
b) forming a non-planar pattern in said planar electrically conductive sheet, and providing a dielectric material fast with a first face of said sheet;
c) removing portions of the sheet from a second face thereof to form a plurality of electrically insulated electrically conductive recessed paths supported by the dielectric material;
d) providing a spring layer overlapping at least a portion of said dielectric layer;
e) shaping a first end of said conductive paths to form a contact region having at least one pair of parallel, spaced apart, clip arms oriented parallel to a common axis;
f) orienting a second end of said conductive paths to form a clip member for mechanically interlocking with conductive contacts of a connecting member;
g) providing connection of one or more circuit elements to selected conductive paths in a circuit configuration.

### Claim 41

A method for manufacturing a supported conductive network comprising the steps of:
a) providing a planar electrically conductive sheet;
b) forming a non-planar pattern in said planar electrically conductive sheet, and providing a dielectric material fast with a first face of said sheet, wherein the forming step and application of the dielectric material are performed simultaneously by molding the dielectric material onto the first face with the molding pressure serving to deform the planar sheet into the non-planar pattern; and
c) removing portions of the sheet from a second face thereof to form electrically insulated electrically conductive paths supported by the dielectric material.

### Claim 42

A method for manufacturing a supported conductive network comprising the steps of:
a) providing a planar electrically conductive sheet;
b) forming a non-planar pattern in said planar electrically conductive sheet, and providing a dielectric material fast with a first face of said sheet;
c) removing portions of the sheet from a second face thereof to form electrically insulated electrically conductive paths supported by the dielectric material;
d) making fast a second electrically conductive material to the dielectric material remote from the paths; and
e) providing a window in said dielectric material and cold pressure fusing a conductive path and said electrically conductive material together through said window.

### Claim 43 (depends on 42)

The method of claim 42 wherein said fusing step further comprises the steps of
developing a stress hardened, adhesive filled force concentrator to one of said conductive material and said conductive path; and
laminating an assembled combination of said conductive material and said conductive path using said concentrator for cold pressure fusing said sheet through said dielectric window.

### Claim 44

A method for manufacturing a conductive network comprising the steps of
a) providing a planar electrically conductive sheet;
b) forming said electrically conductive sheet into a non-planar pattern;
c) providing a layer of dielectric material fast on a first side of said electrically conductive sheet; and
d) removing portions of said electrically conductive sheet from a second side of said electrically conductive sheet to form electrically insulated conductive paths.

### Claim 45 (depends on 44)

A method according to claim 44, wherein step b) is performed before step c).

### Claim 46 (depends on 44)

A method according to claim 44, wherein step c) is performed before step b).

### Claim 47 (depends on 44)

A method according to claim 44, wherein steps b) and c) are performed simultaneously.

### Claim 48 (depends on 45)

A method according to claim 45 comprising forming of at least one surface of the dielectric material into a non-planar pattern, corresponding to and in intimate contact with the non-planar pattern of the electrically conductive sheet, subsequent to the formation of the non-planar pattern of the electrically conductive sheet.

### Claim 49 (depends on 46)

A method according to claim 46 comprising forming of at least one surface of the dielectric material into a non-planar pattern, corresponding to and in intimate contact with the non-planar pattern of the electrically conductive sheet, simultaneously with the formation of the non-planar pattern of the electrically conductive sheet.

### Claim 50 (depends on 47)

A method according to claim 47 comprising forming of at least one surface of the dielectric material into a non-planar pattern, corresponding to and in intimate contact with the non-planar pattern of the electrically conductive sheet, simultaneously with the formation of the non-planar pattern of the electrically conductive sheet.