Electrostatic patterning of multi-layer module lamina

Abstract

Conductive patterns are formed on a surface and via connections through a lamina or substrate are formed by directly writing an electrostatic charge pattern on a surface of the lamina and developing the written pattern by application of conductive particles thereto, preferably in a liquid suspension of particulate material including a binder and/or a charge control agent. High resolution patterns are obtained with conductive powders having particle sizes in the range of 0.5 to 2.5 microns. Vias are formed by developing the charged pattern with conductive bodies such as spheres having a dimension similar to the finished thickness of the lamina or substrate. After development, the conductive bodies may be embedded within the lamina or substrate, possibly facilitated through the use of heat and lamination techniques. Insulative particulate material may also be used to form insulating patterns. A sequence of direct electrostatic writing and development operations enable the production of microstructures such as capacitors and multiple wiring layers on a single lamina or substrate.

Dependencies are inferred from the claim text.