Composite printed circuit board and manufacturing method thereof

Abstract

A composite printed circuit board includes a metal substrate printed circuit section and an insulation substrate printed circuit board section. The metal substrate printed circuit section includes a first layer of a thermally conductive metal for providing high thermal conductivity, and a second layer made of a thermally conductive and electrically insulative material disposed adjacently to said first layer. The second layer has an upper surface upon which electrically conductive wiring may be disposed. The insulator substrate printed circuit board section forms an integral surface with the metal substrate printed circuit section. The insulator substrate printed circuit section further includes a first layer of insulative material, and a second layer of a metallic foil disposed adjacently to at least one side of said first layer of insulative material for forming a conductive wiring layout.

Dependencies are inferred from the claim text.